Fujitsu Corporation

The University of Tokyo

Shinichi Hirose

Daiyu Kondo

Taisuke Iwai

Yoshitaka Yamaguchi

Yukie Sakita

Yohei Yagishita

Masaaki Norimatsu

Ikuo Soga

Yoshihiro Mizuno

Seiki Sakuyama

Tatsuya Usuki

Koji Asano

Motomu Takatsu

Yasuhiko Arakawa

A bonding structure includes: a plurality of carbon nanotubes; a first bonded member; and a first metal sintered compact bonding first end portions of the plurality of carbon nanotubes and the first bonded member, wherein the first metal sintered compact enters spaces between the first end portions of the plurality of carbon nanotubes, and bonds to the plurality of carbon nanotubes while covering side faces and end faces of the first end portions of the plurality of carbon nanotubes.

Bonding structure and method of manufacturing bonding structure

A heat dissipation sheet includes a carbon material layer configured to include a plurality of linear carbon materials arranged in parallel with each other, an adhesive resin layer configured to include a first surface to be in contact with an end of each of the plurality of linear carbon materials, a thickness of the adhesive resin layer being less than 1 μm, and a release sheet configured to be in contact with a second surface among a plurality of surfaces of the adhesive resin layer, the second surface being over a side opposite to the first surface.

Heat dissipation sheet and method of manufacturing heat dissipation sheet

In order to provide a conductive heat radiation film that can stabilize the shape, a method of manufacturing a conductive heat radiation filmincludes: a first heated filmincluding a plurality of first metal particles; and a plurality of carbon nanotubesincluding tipsadhered to the first heated film

Conductive heat radiation film, method of manufacturing the same, and method of manufacturing electronic device

A heat dissipation sheet includes a first sheet composed of a plurality of first carbon nanotubes, and a second sheet composed of a plurality of second carbon nanotubes, wherein the first sheet and the second sheet are coupled in a stacked state, and the first carbon nanotubes and the second carbon nanotubes are different in an amount of deformation when pressure is applied.

Heat dissipation sheet, manufacturing method of heat dissipation sheet, and electronic apparatus

In order to provide a conductive heat radiation film that can stabilize the shape, a conductive heat radiation filmincludes: a first heated filmincluding a plurality of first metal particles; and a plurality of carbon nanotubesincluding tipsadhered to the first heated film

A bonding structure includes: a plurality of carbon nanotubes; a first bonded member, and a first metal sintered compact bonding first end portions of the plurality of carbon nanotubes and the first bonded member, wherein the first metal sintered compact enters spaces between the first end portions of the plurality of carbon nanotubes, and bonds to the plurality of carbon nanotubes while covering side faces and end faces of the first end portions of the plurality of carbon nanotubes.

An electronic device includes a component, a resin film formed to the component, and a plurality of carbon nanotubes whose end portions pass through the resin film and are in contact with the component, wherein a first portion of each of the carbon nanotubes is covered with the resin film, the first portion has a first length which is greater than a thickness of the resin film, and an intermediate portion of each of the carbon nanotubes other than the first portion is uncovered with and exposed from the resin.

Electronic device and heat dissipating sheet

There is provided a method of manufacturing a heat radiation sheet, the method including: forming a base film on a substrate; growing a plurality of carbon nanotubes on the base film; and vaporizing at least a part of the base film by heating the base film to coat the carbon nanotube with a coating film containing a material of the vaporized base film.

Heat radiation sheet, method of manufacturing heat radiation sheet, and method of manufacturing electronic device

A carbon nanotube structure includes a plurality of carbon nanotubes, and a graphite film that binds one ends of the plurality of carbon nanotubes. And a heat dissipation sheet includes a plurality of carbon nanotube structures arranged in a sheet form, wherein each of the carbon nanotube structures includes a plurality of carbon nanotubes, and a graphite film that binds one ends of the plurality of carbon nanotubes.

Carbon nanotube structure, heat dissipation sheet, and method of manufacturing carbon nanotube structure

A heat dissipation material includes a plurality of linearly-structured objects of carbon atoms configured to include a first terminal part and a second terminal part; a first diamond-like carbon layer configured to cover the first terminal part of each of the plurality of linearly-structured objects; and a filler layer configured to be permeated between the plurality of linearly-structured objects.

Heat dissipation material and method of manufacturing thereof, and electronic device and method of manufacturing thereof

A method of manufacturing an electronic device includes: placing a resin film on a component; and while heating the resin film to be softened, pressing end portions of a plurality of carbon nanotubes against the softened resin film to bring the end portions into contact with the component, and causing the softened resin film to climb up side surfaces of the carbon nanotubes.

Method of manufacturing an electronic device

An electronic device includes: a semiconductor device; a heat-conductive resin, disposed above the semiconductor device, including a heat conductor and a resin; a linear carbon piece, disposed above the heat-conductive resin, to be thermally in contact with the heat conductor; and a heat spreader, disposed above the linear carbon piece, including a depressed portion having the heat-conductive resin.

Electronic device and method of manufacturing the same

A sheet structure has: a bundle structure including a plurality of linear structures made of carbon which are oriented in a predetermined direction; a covering layer covering the plurality of linear structures made of carbon; and a filling layer provided between the plurality of linear structures made of carbon covered with the covering layer. The thickness of the covering layer is not uniform in a direction crossing the predetermined direction.

Growing community of inventors

Yokohama, Japan

Shinichi Hirose