Toppan Printing Co., Ltd.

Hisamitsu Pharmaceutical Company, Inc.

Kureha Corporation

Okada Shigyo Co., Ltd.

Shinichi Hirakawa

Hirofumi Okada

Saichi Ono

Hiroyuki Taketomi

Yoichiro Yotsuya

Hiroshi Sakai

Yuji Hashitani

A packaging material is formed by a substrate, and an inner sealing layer comprising a polyolefin layer and an aqueous dispersion-type polyester resin layer successively disposed on the substrate. The aqueous dispersion-type amorphous polyester resin layer contains an anionic surfactant or an amphoteric surfactant and is substantially free from an organic solvent having a boiling point of at most 100&#xb0; C. The thus-formed packaging material is excellent in aroma-retentivity, aroma non-adsorptivity, particulate non-adhesion, low residual solvent and sealability. The packaging material is also free from environmental problem and is therefore suitable as a packaging material for particulate medical supplies and health foodstuff.

Packaging material for and packaged product of medical supplies and the like

In a bagfor packaging having a first faceA and a second faceB that are mutually opposite, a first line of weaknessA (B) and a second line of weaknessA (B) and a third line of weaknessA (B) constituted by a plurality of breaks of perforation form arranged between the first line of weakness and the second line of weakness and having an inclination with respect to a prescribed unsealing direction Lare respectively formed in the first face and the second face such that these are arranged in mutually parallel fashion, and the plurality of breaks of perforation form constituting the third line of weakness formed in the first face and the plurality of breaks of perforation form constituting the third line of weakness formed in the second face are formed inclined in mutually opposite directions with respect to the prescribed unsealing direction. In this way a finger-grip portion of suitable extent is formed at the unsealed aperture of the bag for packaging after unsealing.

Packaging bag

Growing community of inventors

Osaka, Japan

Shinichi Hirakawa