Fuji Corporation

Shinichi Fujii

Yukinori Nakayama

Mizuho Nozawa

Yusuke Kikuchi

Yuhei Inoue

Satoshi Sonoda

A management device used in a mounting system including multiple mounting-related devices in which a member is attached to one or more attachment sections, and a moving work device that moves between the multiple mounting-related devices to automatically attach and detach the member to and from the attachment sections, the management device including, when acquiring prohibition information including information on the attachment sections to and from which the member is not attachable and detachable by the moving work device from the mounting-related device, a management control section that creates an instruction list based on the prohibition information, in which an attachment and detachment instruction of the member for the attachment sections other than the attachment sections to and from which the member is not attachable and detachable is registered, and causes the moving work device to execute attachment and detachment processing of the member based on the instruction list.

Management device, mounting system, and management method

An article transport system includes a station group, a first communication device, and a determination section. In the station group, multiple stations capable of sending out and receiving an article, which is used in a board work machine performing a predetermined board work on a board, are arranged side by side. The first communication device includes a first communication section, which is provided in a transport vehicle capable of sending out and receiving the article between the transport vehicle and a predetermined station among the multiple stations, and a second communication section, which is provided in each of the multiple stations.

Article transport system

A component mounting machine includes a control device that controls a wafer supply device and a component transfer device. The control device includes a die information storage section storing the position of the dies stored in the wafer supply device associated with a rank of the dies, a block information acquisition section acquiring the condition of the dies to be mounted on a block provided on a board, a rank designation section designating the rank of the die to be picked up by the component transfer device, and a position designation section designating the position of the die to be picked up by the component transfer device. The position designation section designates the position of the die so that the die having the rank designated by the rank designation section is continuously picked up over the multiple wafers stored in the wafer supply device.

Component mounting machine

A wafer supply device configured to supply a wafer divided into multiple dies to a supply position, the wafer supply device includes a die information storage section configured to store the number of dies for each rank allocated to each of the dies, a block information acquisition section configured to acquire a condition of dies to be mounted on a block provided on a board to be conveyed, a required block number acquisition section configured to acquire a required number of dies to be mounted on the block, and a producible number calculation section configured to calculate a number of blocks that can be produced based on a content stored in the die information storage section and a content acquired by the block information acquisition section and the required block number acquisition section.

Growing community of inventors

Kariya, Japan

Shinichi Fujii