Nichia Corporation

Shinichi Daikoku

Toru Hashimoto

Keiji Emura

Shun Kitahama

Masaaki Katsumata

Daisuke Sanga

Yoshiki Sato

Yoshikazu Matsuda

Daisuke Kasai

Hirofumi Nishiyama

Eiko Minato

Ryuma Marume

Akira Miki

Akihiro Nakamura

A light-emitting device comprising a package comprising a light-emitting element comprising a first surface and a second surface opposite to the first surface, a first light-transmissive member arranged on the second surface of the light-emitting element, paired electrodes at the first surface of the light-emitting element, and a first covering member covering the light-emitting element such that the paired electrodes are exposed from the first covering member. The light-emitting device further comprises a light-guiding plate on which the package is placed, and a second covering member arranged on the light-guiding plate and covering laterally the package. The light-emitting device further comprises paired wirings continuously covering the paired electrodes exposed and the first covering members and being connected to the paired electrodes respectively. The paired wirings are formed by irradiation of laser light on a metal paste layer continuously covering the paired electrodes and the first covering member to remove the metal paste layer between the paired electrodes, the metal paste layer comprising a mixture of a resin and metal powder.

Method for manufacturing light-emitting device

A light-emitting module includes: a light-guiding plate having a first main surface serving as a light extracting surface and a second main surface opposite to the first main surface, a recess defined in the second main surface by at least one lateral surface and a base surface; a wavelength conversion member in the recess of the light-guiding plate, the wavelength conversion member having a first surface facing the base surface defining the recess, a second surface opposite to the first surface, and at least one lateral surface between the first surface and the second surface; at least one light-emitting element bonded to the second surface of the wavelength conversion member; a light-transmissive member disposed between the lateral surface defining the recess and the lateral surface of the wavelength conversion member; and a light-reflective member covering the second main surface of the light-guiding plate and lateral surfaces of the light-emitting element.

Light-emitting module

A planar light source includes: a support member that defines a plurality of first holes extending from an upper surface to a lower surface of the support member, wherein the support member comprises a wiring layer disposed at a lower surface side; a light source disposed on the upper surface of the support member, the light source including: a light-emitting element, and a plurality of electrodes disposed on a lower surface of the light-emitting element; and a plurality of conductive members, each of which is disposed in a corresponding one of the first holes and electrically connects a corresponding one of the electrodes and the wiring layer. A lower surface of each of the electrodes is located in the corresponding first hole. Each of the conductive members is in contact with the lower surface and lateral surfaces of the corresponding electrode.

Planar light source

In order to obtain a light emitting module with a less unevenness of luminance, provided is a method for manufacturing a light emitting module comprising: preparing a light emitter and a light-transmissive light guide plate, the light emitter comprising a light emitting element, the light guide plate having a first main surface serving as a light emitting surface from which light is emitted outside and a second main surface located opposite to the first main surface and having a concave portion, the concave portion comprising a side surface and a bottom surface that is smaller than an opening of the concave portion in a cross-sectional view; fixing the light emitter to the bottom surface of the concave portion via a bonding member; and forming a wiring at an electrode of the light emitting element.

Light emitting module with concave surface light guide plate

A light-emitting module manufacturing method of the present disclosure includes: providing a plurality of light sources each including a semiconductor layered structure and an electrode; providing a lightguide plate having a first principal surface to serve as a light extraction surface, a second principal surface opposite to the first principal surface, and a plurality of through holes penetrating through the lightguide plate from the first principal surface to the second principal surface; providing a light modulating member in each of the through holes; providing a plurality of bonding members on the light modulating member; equalizing heights of upper surfaces of the plurality of bonding members; placing the light sources on the bonding members such that the electrode faces away from the light modulating member; providing a cover member so as to cover the second principal surface; and forming an interconnect layer electrically coupled with the light sources.

Method for manufacturing light-emitting module

The light emitting device includes a light emitting element having an electrode-formed surface on which electrode posts are formed; a covering member covering the electrode-formed surface and lateral surfaces of the light emitting element while forming an exposure portion of each of the electrode posts which are exposed from the covering member; a pair of electrode layers provided on a surface of the covering member and electrically connected to the exposed portions of the electrode posts; and a pair of electrode terminals which are respectively electrically connected to the electrode layers, having a surface area larger than a surface area of the electrode posts, and having an outer edge positioned at an end portion of the covering member; and an insulating member provided between the pair of the electrode terminals while being in contact with lateral surfaces of the pair of electrode terminals.

Light emitting device, light emitting module, method of manufacturing light emitting device, and method of manufacturing light emitting module

A method for manufacturing a light-emitting device includes preparing an intermediate product; the product includes a light-emitting element provided with paired electrodes at a first surface and a first covering member covering the light-emitting element such that portions of surfaces of the paired electrodes are exposed. A metal paste layer is formed, continuously covering the exposed portion of the paired electrodes and the first covering member. Paired wirings are formed for preventing the paired electrodes from being short-circuited. The metal paste layer on the paired electrodes and the metal paste layer on the first covering member are irradiated with laser light to remove the metal paste layer between the paired electrodes and a portion of the metal paste layer on the first covering member.

A light guide body aggregate substrate includes: a light-transmitting substrate having a main surface; a plurality of unit regions located at the main surface of the substrate, wherein the plurality of unit regions are spaced apart from each other, wherein the plurality of unit regions are arranged one-dimensionally in one row extending in a first direction and a plurality of columns, or arranged two-dimensionally in a plurality of rows extending in the first direction and a plurality of columns extending in a second direction, and wherein a light guide structure is located in each unit region; a first region located at the main surface of the substrate, surrounding the plurality of unit regions; and a 1-A alignment mark and a 1-B alignment mark arranged at the substrate in the first region.

Light guide body aggregate substrate and production method for integrated light-emitting device

The light emitting device includes: a light emitting element, a covering member, a pair of electrode layers, and a pair of electrode terminals. The light emitting element has an electrode-formed surface on which a pair of electrode posts are formed. The covering member covers an electrode-formed surface of the light emitting element while forming an exposed portion of each of the pair of electrode posts which is exposed from the covering member. The pair of electrode layers are provided on a surface of the covering member and electrically connected to the exposed portions of the pair of electrode posts. The pair of electrode terminals are electrically connected to the pair of electrode layers, and provided on the surface of the covering member. The pair of electrode terminals are thicker than the pair of electrode layers, and are disposed at an interval larger than an interval between the pair of electrode posts.

A method for manufacturing a light emitting module including the steps of: preparing a light source including a light emitting element that has a pair of electrodes on the same surface side, and an encapsulation member that covers the light emitting element so as to expose a portion of a surface of the pair of electrodes; preparing a lightguide plate having a first primary surface to be a light emitting surface, and a second primary surface on an opposite side from the first primary surface, wherein the second primary surface has a recessed portion that has a bottom surface and at least one lateral surface; placing the light source on the bottom surface of the recessed portion with the electrodes facing up so as to be spaced apart from the lateral surface of the recessed portion; arranging a cover member that buries a gap between the lateral surface of the recessed portion and the light source and covers the light source including the electrodes; removing the cover member until the electrodes are exposed; and forming a metal film electrically connected to the light emitting elements.

Method for manufacturing light emitting module

Method for manufacturing light emitting module with concave surface light guide plate

A light emitting device includes: light emitting cells arranged in column and row directions, each including a semiconductor stack including a first semiconductor layer and a second semiconductor layer; a first insulation layer continuously disposed on the light emitting cells and having, in each light emitting cell, a first hole on the first semiconductor layer exposed from the second semiconductor layer and a second hole on the second semiconductor layer; a wiring electrode having light reflectivity, covering the first insulation layer, and electrically connected with the first semiconductor layer at the first hole in each light emitting cell; and a second electrode disposed in each light emitting cell and electrically connected with the second semiconductor layer at the second hole. The first insulation layer is exposed from the first semiconductor layer between the light emitting cells. The lower face of the first semiconductor layer has a roughened surface.

Light emitting device

A method, comprising: providing a light emitting element including a semiconductor stack body and an electrode; providing a lightguide plate having a first surface and a second surface opposite to the first surface, wherein the second surface includes a plurality of recesses; arranging a light-transmitting member in each of the recesses; adjusting upper surfaces of the light-transmitting members to a uniform height; placing a wavelength conversion member on the light-transmitting member; placing the light emitting element on the wavelength conversion member with the electrode facing up; arranging a cover member that covers the light emitting element; removing the cover member until the electrode is exposed; and forming a wiring that electrically connects the light emitting elements together.

Method of manufacturing light emitting module

A light guide body aggregate substrate includes: a light-transmitting substrate having a main surface; a plurality of unit regions, wherein the plurality of unit regions are arranged one-dimensionally in one row extending in a first direction and a plurality of columns, or two-dimensionally in a plurality of rows extending in the first direction and a plurality of columns extending in a second direction, and wherein a light guide structure is located in each unit region; a marginal region; and a plurality of first alignment marks arranged in the first direction on the substrate in the marginal region, each first alignment mark being disposed at a position corresponding to a position in the first direction of a corresponding one of the plurality of columns of the plurality of unit regions extending in the second direction.

A method of manufacturing a light emitting device includes: providing a wafer that comprises: a supporting substrate, and a plurality of light emitting structures arranged in a two-dimensional array on a first principal surface of the supporting substrate along a first direction and a second direction, each of the plurality of light emitting structures comprising a first semiconductor layer, which includes a first region and a second region, and a second semiconductor layer, which covers the second region of the first semiconductor layer, wherein the plurality of light emitting structures includes a first light emitting structure and a second light emitting structure; forming a recess in the first principal surface of the supporting substrate between the first light emitting structure and the second light emitting structure; forming a resin layer in the recess; and removing the supporting substrate so as to expose the first semiconductor layer.

Growing community of inventors

Tokushima, Japan

Shinichi Daikoku