Mitsubishi Gas Chemical Company, Inc.

Shinichi Ayuba

Hisayuki Kuwahara

Shun Ogawa

Kentaro Ishii

Takahiko Sumino

Masayoshi Takahashi

Jun Mitadera

Nobuhiko Matsumoto

Eiichi Honda

Tomomichi Kanda

Kosuke Otsuka

Shigeyuki Hirose

Shinichi Yonehama

Kana Kumamoto

Disclosed is a polyamide resin composition, including: a polyamide (A) containing a diamine unit including 70 mol % or more of a p-xylylenediamine unit and a dicarboxylic acid unit including 70 mol % or more of a linear aliphatic dicarboxylic acid unit having 6 to 18 carbon atoms; and a filler (B), in which the polyamide (A) includes a polyamide having a phosphorus atom concentration of 50 to 1,000 ppm and a YI value of 10 or less in a color difference test in accordance with JIS-K-7105, and a content of the filler (B) is 1 to 200 parts by mass with respect to 100 parts by mass of the polyamide (A).

Polyamide resin composition

Provided is a polyamide resin composition comprising an elastomer etc, and a reactive polyamide resin excellent in reactivity. The polyamide resin composition comprises 0.5 to 100 parts by mass of an elastomer per 100 parts by mass of a reactive polyamide resin, wherein the reactive polyamide resin obtained by polycondensing a diamine (A) containing 70 mol % or more of a diamine structural unit derived from xylylenediamine and a dicarboxylic acid (B) containing 50 mol % or more of a dicarboxylic acid structural unit derived from sebacic acid, and has a concentration of reactive functional groups of 100 &#x3bc;eq/g or more and a molar ratio of reacted diamine to reacted dicarboxylic acid (the number of moles of reacted diamine/the number of moles of reacted dicarboxylic acid) of 1.0 or more.

Reactive polyamide resins and polyamide resin compositions

A method of producing polyamide by the direct polycondensation of a diamine component and a dicarboxylic acid component without using a solvent, such as water. The diamine component containing 70 mol % or more of p-xylylenediamine is added to a reaction system containing the dicarboxylic acid component under pressure while maintaining the reaction system in a molten state. After the addition of the diamine component, the pressure of the reaction system is reduced to atmospheric pressure over 50 min or more at a pressure falling speed of 1.0 MPa/h or less. By the production method, polyamide with a small molecular weight dispersion is easily produced.

Method for producing polyamide

Disclosed is a flame-retardant polyamide resin composition, including: a polyamide (A) containing a diamine unit including 70 mol % or more of a p-xylylenediamine unit and a dicarboxylic acid unit including 70 mol % or more of a linear aliphatic dicarboxylic acid unit having 6 to 18 carbon atoms; an organic halogen compound (B) that serves as a flame retardant; an inorganic compound (C) that serves as a flame retardant aid; and an inorganic filler (D), in which the polyamide (A) includes a polyamide having a phosphorus atom concentration of 50 to 1,000 ppm and a YI value of 10 or less in a color difference test in accordance with JIS-K-7105, and a content of the organic halogen compound (B), a content of the inorganic compound (C), and a content of the inorganic filler (D) are 1 to 100 parts by mass, 0.5 to 50 parts by mass, and 0 to 100 parts by mass, respectively, with respect to 100 parts by mass of the polyamide (A).

Flame-retardant polyamide resin composition

The present invention provides an amine based epoxy resin curing agent and an epoxy resin composition containing the curing agent. The epoxy resin composition has a high gas barrier performance, a long pot life, and utility as a coating material or an adhesive for laminates. The amine based epoxy resin curing agent is composed of a reaction product of (A), (B) and (D) or (A), (B), (C) and (D): (A) m-xylylenediamine or p-xylylenediamine; (B) a polyfunctional compound having at least one acyl group, which is capable of forming an amide group site through a reaction with a polyamine and forming an oligomer; (C) a monovalent carboxylic acid having from 1 to 8 carbon atoms and/or its derivative; and (D) a functional compound having at least one carbonate site represented by the formula (2), which is capable of forming a carbamate site represented by the formula (1) through a reaction with a polyamine: 

Amine epoxy resin curing agent, gas barrier epoxy resin composition comprising the curing agent, coating agent, and adhesive agent for laminate

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Kanagawa, Japan

Shinichi Ayuba