Murata Manufacturing Co., Ltd.

Shinichi Araki

Ryosuke Takada

Takahiro Baba

Kunihiro Komaki

Kanto Iida

Hideyuki Taguchi

Hayato Noma

A transmission line device includes first and second transmission lines. The first transmission line includes a first electrode pad that is electrically connected to a first signal conductor pattern, and a second electrode pad and a third electrode pad that are portions of a first ground conductor pattern. The second transmission line includes a fourth electrode pad that is electrically connected to a second signal conductor pattern, and a fifth electrode pad and a sixth electrode pad that are portions of a second ground conductor pattern. The first electrode pad is between the second electrode pad and the third electrode pad, and the fourth electrode pad is between the fifth electrode pad and the sixth electrode pad. The second electrode pad and the third electrode pad are larger than the first electrode pad, and the fifth electrode pad and the sixth electrode pad are larger than the fourth electrode pad.

Transmission line device comprising a plurality of substrates each having signal and ground conductor patterns thereon that are joined to each other

A resin substrate includes a resin base material including a first main surface, electrode pads provided on the first main surface, circuit conductor patterns, a resist film, and a coverlay film. The resist film includes, on the outer circumference, a plurality of protruding portions each of which has a tapered shape with a vertex. A portion of the circuit conductor patterns are covered with the resist film, and the coverlay film covers a portion of the resist film including the protruding portions and exposed portions of the circuit conductor patterns. The protruding portions are located at positions sandwiching the exposed portions of the circuit conductor patterns.

Resin substrate and method for producing resin substrate

A plate-shaped multilayer wiring substrate includes at least two resin layers stacked on top of each other and each including an insulating base and a conductive pattern provided on the insulating base, and a front surface layer joined onto the resin layers stacked. The front surface layer has a higher elastic modulus than an elastic modulus of the insulating bases. A joint interface between the resin layers and the front surface layer includes projections and depressions. Also, a method for manufacturing the plate-shaped multilayer wiring substrate includes a step of stacking, on top of resin layers, a front surface layer having a higher elastic modulus than an elastic modulus of the resin layers, and a step of performing pressing under pressure from above the front surface layer by using a flat surface in a heated state to join the resin layers and the front surface layer.

Multilayer wiring substrate

An interposer includes a stacked body including first and second mounting surfaces that face each other, a first electrode on the first mounting surface, and a second electrode on the second mounting surface. The stacked body includes flexible insulating layers stacked on each other, and a folded portion. The first and second electrodes are electrically connected to each other. The stacked body includes an upright portion between the first and second mounting surfaces and in which a stacking direction in which the insulating layers are stacked is parallel to the first and second mounting surfaces, and a bent portion bent in a plan view of the first and second mounting surfaces.

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Nagaokakyo, Japan

Shinichi Araki