Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Shingo Yoshioka

Hiroaki Fujiwara

Tsuyoshi Takeda

Hiromitsu Takashita

Takatoshi Abe

Tomoaki Sawada

Hiroharu Inoue

Yuko Konno

Keiko Kashihara

Shinji Hashimoto

Koji Kishino

Toru Nakashiba

Junko Kurizoe

Naoyuki Kondo

Takashi Hoshi

A sheet-shaped stretchable structure including stretchable resin sheets laminated together is provided. A conductive layer may be disposed at least at one of several positions. For example, the conductive layer may be disposed between any two adjacent ones of the laminated stretchable resin sheets. The conductive layer may be disposed on a top surface of an uppermost one of the laminated stretchable resin sheets. Further, the conductive layer may be disposed on a bottom surface of a lowermost one of the laminated stretchable resin sheets, and a via hole.

Sheet-shaped stretchable structure, and resin composition for stretchable resin sheet and stretchable resin sheet used for the structure

The present invention is a resin composition characterized by being able to undergo elastic deformation, having little residual strain rate and exhibiting stress relaxation properties. More specifically, the present invention relates to a resin composition wherein the stress relaxation rate (R) and the residual strain rate (&#x3b1;), as measured in a prescribed extension-restoration test, are as follows: 20%&#x2264;R&#x2264;95% and 0%&#x2264;&#x3b1;&#x2264;3%.

Resin composition and film using same

A prepreg includes a resin layer constituted by a half-cured product of a thermosetting resin composition, and a fibrous substrate provided in the resin layer. A prepreg test piece that is a cured product obtained by heat curing the thermosetting resin composition has a maximum value of 400 kPa or less for thermal shrinkage stress measured by a predetermined thermal stress test.

Prepreg, metal-clad laminated plate, wiring board, and method for measuring thermal stress of wiring board material

A sheet-shaped stretchable structure used as an electronics element has a stretch of not less than 10% and includes a plurality of laminated stretchable resin sheet, and at least one hollow is provided between at least one of pairs of two adjacent ones of the laminated stretchable resin sheets.

A conductive film includes a film substrate and a conductive layer formed on at least one surface of the film substrate. The film substrate and the conductive film have elongation of 10% or more. Ten-point average roughness Rz of the surface of the film substrate on at least a conductive layer side is 0.05 to 0.5 &#x3bc;m, and an average interval Sm of unevenness is 0.1 to 1 &#x3bc;m.

Conductive film, and touch panel, display, touch sensor, and solar cell using the same

The present invention is a resin composition characterized by being able to undergo elastic deformation, having little residual strain rate and exhibiting stress relaxation properties. More specifically, the present invention relates to a resin composition wherein the stress relaxation rate (R) and the residual strain rate &#x3b1;, as measured in a prescribed extension-restoration test, are as follows: 20%&#x2264;R&#x2264;95% and 0%&#x2264;&#x3b1;&#x2264;3%.

The present invention relates to an electrically conductive film characterized by being able to undergo elastic deformation, having little residual strain rate and exhibiting stress relaxation properties. More specifically, the present invention relates to an electrically conductive film wherein the stress relaxation rate (R) and the residual strain rate (alpha), as measured in a prescribed extension-restoration test, are as follows: 20%&#x2266;R&#x2266;95% and 0%&#x2266;&#x3b1;&#x2266;3%.

Electrically conductive film

Provided is a structural member for electronic devices which uses a material that is flexible and has excellent restoration properties after extension and stress relaxation properties. The structural member for electronic devices has the following properties A and B: (Property A) In a case where predetermined deformation is applied, stress that applies the deformation is relaxed (reduced) with time: and (Property B) In a case where the stress that applies deformation is 0, the deformation rarely remains while a resin composition is recovered. That is, when stress is 0, residual strain substantially becomes 0 (specifically 3% or lower).

Structural member for electronic devices

A three-dimensional structure in which a wiring is provided on a surface is provided. At least a part of the surface of the three-dimensional structure includes an insulating layer containing filler. A recessed gutter for wiring is provided on the surface of the three-dimensional structure, and at least a part of a wiring conductor is embedded in the recessed gutter for wiring.

Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same

The present invention relates to a resin composition that becomes a cured product that exhibits force response behavior such that an area surrounded by a tensile stress-strain curve f1(x), when an amount of strain is increased from 0% to 0.3% by pulling at 999 &#x3bc;m/min while plotting the amount of strain on the x axis and tensile stress on the y axis, and also surrounded by the x axis, is greater than an area surrounded by a stress-strain curve f2(x), when the amount of strain is decreased from 0.3%, and also surrounded by the x axis, and the amount of change in the amount of strain when tensile stress is 0, before and after applying tensile stress, is 0.05% or less.

Resin composition, resin varnish, prepreg, metal-clad laminated board and printed wiring board

The present invention relates to a manufacturing method of a molded article, including: a molded article forming step of forming a molded article by curing a resin composition on a main surface, on the side of a bendable first supporting medium, of a laminated supporting medium obtained by laminating the first supporting medium and a second supporting medium that is harder than the first supporting medium; a second-supporting medium peeling step of peeling the second supporting medium from the first supporting medium after the molded article forming step; and a first-supporting medium peeling step of peeling the first supporting medium from the molded article while bending the first supporting medium after the second-supporting medium peeling step. The shape of the first supporting medium can be maintained at a curing temperature at which the resin composition is cured in the molded article forming step.

Manufacturing method of molded article

A resin composition that becomes a cured product that exhibits force response behavior such that an area surrounded by a tensile stress-strain curve f1(x), when an amount of strain is increased from 0% to 0.3% by pulling at 999 &#x3bc;m/min while plotting the amount of strain on the x axis and tensile stress on the y axis, and also surrounded by the x axis, is greater than an area surrounded by a stress-strain curve f2(x), when the amount of strain is decreased from 0.3%, and also surrounded by the x axis, and the amount of change in the amount of strain when tensile stress is 0, before and after applying tensile stress, is 0.05% or less.

The present invention relates to a dry film for optical waveguides, obtained through sequential stacking of a carrier film, a plating adhesion layer, an uncured cladding layer and a cover film. Solid microparticles are dispersed in a resin composition that constitutes the plating adhesion layer.

Dry film for optical waveguides, optical waveguide using same, photoelectric composite wiring board using same, and method for producing photoelectric composite wiring board

A metal-clad laminate of the present invention comprises an insulating layer, and a metal layer that is present at least on one surface side of the insulating layer. The insulating layer is a laminate of at least three layers: a center layer, a first resin layer that is present on one surface side of the center layer, and a second resin layer that is present on the other surface side of the center layer. The center layer, the first resin layer and the second resin layer each contain a cured product of a respective resin composition. The elastic modulus of the cured product of the resin composition contained in the center layer is lower than the elastic moduli of both the cured product of the resin composition contained in the first resin layer and the cured product of the resin composition contained in the second resin layer.

Metal-clad laminate and printed wiring board

The present invention relates to an electrically conductive film characterized by being able to undergo elastic deformation, having little residual strain rate and exhibiting stress relaxation properties. More specifically, the present invention relates to an electrically conductive film wherein the stress relaxation rate (R) and the residual strain rate &#x3b1;, as measured in a prescribed extension-restoration test, are as follows: 20%&#x2266;R&#x2266;95% and 0%&#x2266;&#x3b1;&#x2266;3%.

Growing community of inventors

Osaka, Japan

Shingo Yoshioka