Ebara Corporation

Konami Corporation

Tdk Corporation

Konami Digital Entertainment Co., Ltd.

Shingo Yasuda

Mizuki Nagai

Akira Owatari

Yusuke Tamari

Nobuhiro Goto

Takashi Uchiyama

Masashi Shimoyama

Daisuke Sato

Hiroyuki Kanda

Fumio Kuriyama

Kazuhiro Kusuda

Naoki Shimomura

Ryosuke Toriyama

Takehiko Abe

Daisuke Tsuchida

Yuichi Nakahara

Yoshihiko Satoh

Makikazu Takehana

Yuki Ikeda

Nobuhito Muto

Provided are a plating method, an insoluble anode and a plating apparatus capable of reducing consumption of an additive in a plating solution, when plating a substrate including a via or a hole for forming a through electrode. The plating method includes the steps of preparing a substrate including a via or a hole for forming a through electrode, preparing a plating solution tank that is divided, by a diaphragm, into an anode tank in which an insoluble anode is disposed and a cathode tank in which the substrate is disposed, and electroplating the substrate with an anode current density when plating the substrate in the plating solution tank being equal to or more than 0.4 ASD and equal to or less than 1.4 ASD.

Plating method, insoluble anode for plating, and plating apparatus

An NTC thermistor element includes a thermistor body and a plurality of internal electrodes disposed in the thermistor body and opposing each other. The thermistor body includes a region interposed between adjacent internal electrodes of the plurality of internal electrodes. The region of the thermistor body includes a plurality of crystal grains arranged in succession between the internal electrodes adjacent to each other. The plurality of crystal grains include a first crystal grain, a second crystal grain, and a third crystal grain. The first crystal grain is in contact with one internal electrode of the internal electrodes adjacent to each other. The second crystal grain is in contact with another internal electrode of the internal electrodes adjacent to each other. The third crystal grain is not in contact with the first crystal grain and the second crystal grain.

NTC thermistor element

A plating method capable of controlling a concentration of an additive within a proper range during plating of a substrate is disclosed. The plating method includes: disposing an anode and a substrate, having a via-hole formed in a surface thereof, so as to face each other in a plating solution containing an additive; applying a voltage between the anode and the substrate for filling the via-hole with metal; measuring the voltage applied to the substrate; calculating an amount of change in the voltage per predetermined time; and adjusting a concentration of the additive in the plating solution to keep the amount of change in the voltage within a predetermined control range.

Plating method and plating apparatus

A method of plating a substrate, such as a wafer, by applying a voltage between the substrate and an anode is disclosed. The plating method includes: preparing a substrate having a recess formed in a surface thereof, a conductive layer being formed in at least a part of the recess; placing an insoluble anode and the substrate in contact with a copper sulfate plating solution containing an additive; applying a predetermined plating voltage between the substrate and the insoluble anode by a plating power source to plate the substrate; and shutting off a reverse electric current, which flows from the insoluble anode to the substrate via the plating power source, by a diode disposed between the insoluble anode and the substrate when the predetermined plating voltage is not applied.

Plating method

An electroplating method can securely and efficiently fill a plated metal into deep high-aspect ratio vias in a bottom-up manner without producing defects in the plated metal. The electroplating method includes: immersing a substrate, having vias formed in a surface, and an anode in a plating solution in a plating tank, the anode being disposed opposite the surface of the substrate; and intermittently passing a plating current at a constant current value between the substrate and the anode in such a manner that the supply and the stop of the plating current are repeated, and that the proportion of a current supply time during which the plating current is supplied increases with the progress of plating, thereby filling a plated metal into the vias.

Electroplating method

The present invention provides a drawing machine and a game apparatus using the same by which it is easier to give the participants of the drawing an impression like drawing is carried out fairly when the computer drawing in which a winning-probability of each of drawing-objects is changed is carried out. A drawing machine for determining a winning-object from a plurality of drawing-objects includes: a winning-probability data storage unit for storing winning-probability data showing respective winning-probabilities of the plurality of drawing-objects; a drawing unit for carrying out a drawing in accordance with the winning-probability of each of the drawing-objects determined by the winning-probability data stored in the winning-probability data storage unit and determining a winning-object from the plurality of drawing-objects; a winning-probability data changing unit for changing the winning-probability data stored in the winning-probability data storage unit; a winning-probability image displaying unit for displaying a winning-probability image showing the winning-probability of each of the drawing-objects determined by the winning-probability data stored in the winning-probability data storage unit; and a winning-probability displaying control unit for changing the winning-probability image displayed on the winning-probability image displaying unit, when the winning-probability data changing unit changes the winning-probability data, so as to correspond to the changed winning-probability data.

Drawing machine and game apparatus using the same

In a random number selector using a selection ball, a first selector is provided with a passage and a plurality first pockets each associated with a symbol and operable to receive the selection ball. A second selector is provided with a plurality of second pockets each associated with a jackpot and operable to receive the selection ball. A guide member guides the selection ball which has been passed through the passage in the first selector to the second selector. In a bingo game machine, a first bingo game using only the first selector and a second bingo game using both of the first selector and the second selector are performed.

Random number selector, and bingo game machine incorporating the same

A virtual image/real image superimposing and displaying apparatus for displaying a virtual image and an actual substance includes image display ( ) for displaying an image from which a virtual image originates; a half mirror ( ) which forms the virtual image ( ) on the basis of the image displayed by the image display ( ); a communications section ( ) which enables movement of an actual substance from a back side of the virtual image to a front side of the same so as to penetrate therethrough; and a mechanical reel portion ( ) having a plurality of spinning drums ( and ) which have marks, such as numbers and symbols, printed on a circumferential surface thereof and spin independently of each other. The actual substance is paid out so as to penetrate through a virtual image from its back to front and becomes visible only when the actual substance is moved to the front side of the virtual image.

Virtual image/real image superimposing and displaying apparatus, and slot machine

Growing community of inventors

Tokyo, Japan

Shingo Yasuda