Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Shingo Yamada

Kozo Odawara

Satoshi Adachi

Shinjiro Tsuji

Akira Kameda

Nobuyuki Kakita

Ryuji Hamada

Takafumi Tsujisawa

A component mounting apparatus is configured to mount a component on a substrate. The substrate includes a lower side substrate member, an upper side substrate member provided on an upper surface of the lower side substrate member, a lower side mark provided on the lower side substrate member, and an upper side mark provided on an upper surface of the upper side substrate member. The apparatus includes an upward facing camera configured to image the lower side mark from below the lower side substrate member, a data storage configured to store relative positional relationship data indicating a predetermined relative positional relationship between the lower side mark and the upper side mark, and a component mounting unit configured to mount the component on the upper surface of the upper side substrate member based on the data and information obtained through imaging the lower side mark imaged by the upward facing camera.

Component mounting method

A component mounting line includes a first and a second component mounting devices. The first component mounting device adheres anisotropic conductive members to a region of a part of one side and a region of the other side of the substrate, temporarily crimps electronic components onto the region of the part of the one side and the region of the other side to which the anisotropic conductive members are adhered, and mainly crimps the electronic components onto the region of the other side. The second component mounting device adheres the anisotropic conductive members to remaining regions of the one side of the substrate, temporarily crimps the electronic components onto the remaining regions of the one side to which the anisotropic conductive members are adhered, and mainly crimps the electronic components onto the region of the part of the one side and the remaining regions of the one side.

Component mounting line and component mounting method

An Anisotropic Conductive Film (ACF) is stuck to a substrate by: under-receiving the substrate on which a film-shaped component is mounted by a under-receiving section, increasing an interval between a sticking head and the under-receiving section in the under-receiving step; transporting a tape member in which a base tape is bonded to the ACF and causing a sticking surface of the ACF to face the substrate, pressing the ACF together with the base tape on the substrate and sticking the ACF to the substrate, peeling the ACF sticking to the substrate from the base tape by moving a peeling member in a horizontal direction by causing the peeling member to be interposed between the ACF and the base tape, and regulating an upward warpage deformation of the component during peeling the ACF from the base tape by moving the peeling member.

ACF sticking method and ACF sticking apparatus

An Anisotropic Conductive Film (ACF) is stuck to a substrate by: under-receiving the substrate on which a film-shaped component is mounted by a under-receiving section, transporting a tape member in which a base tape is bonded to the ACF by a tape transport section and causing a sticking surface of the ACF to face the substrate, pressing the ACF together with the base tape on the substrate by a pressing tool and sticking the ACF to the substrate, peeling the ACF sticking to the substrate from the base tape by moving a peeling member in a horizontal direction by causing the peeling member to be interposed between the ACF and the base tape, and regulating an upward warpage deformation of the component during peeling the ACF from the base tape by moving the peeling member.

The pressing tool and the ACF tape cutting device are linked and connected with each other by a link device, and the forcing member is caused to move relatively towards and away from the knife member by lifting up and down the pressing tool so as to form a cut. By allowing the tool lifting device to double as a drive device for causing the forcing member to move relatively towards and away from the knife member, the necessity of the actuator of the ACF tape cutting device which is needed in the related art tape adhering device can be obviated.

Tape adhering device and tape adhering method

In the tape attaching method of cutting a tape member into conductive tape pieces and attaching the conductive tape pieces onto a plurality of attachment regions which are formed at a side edge part of a board, an attaching step in which the conductive tape pieces is attached onto the attachment region of a first press position, and a moving step, in which by driving a tape sending mechanism to perform the operation of sending the tape member while a press bonding head and a peeling unit are integrally moved relative to the board, the press bonding head is aligned with the attachment region of a second press position, and a separator is peeled from the tape member attached onto the first press position by the peeling unit during the relative movement, are repeated.

Tape attaching device and tape attaching method

A tape adhering apparatus and a tape adhering method for adhering an ACF tape formed from an anisotropic conductive film to a target adhering area on a substrate are disclosed. It is an objective of the invention to provide a tape adhering apparatus and a tape adhering method that enable shortening of a time consumed by operation for adhering one cut piece of an ACF tape. According to the present invention, the separator is peeled from the cut piece of the ACF tape by letting the tape conveyor means convey the tape member in synchronism with the transfer action of the transfer base and thereafter a cut portion of the ACF tape to be next adhered is placed at the cutting position of the tape cutting means by letting the tape conveyor means continually convey the tape member in the forward conveyance direction.

Tape adhering apparatus and tape adhering method

A panel is mounted on the stage while the one end electrode of the FPC (flexible board) is mounted on the mounting part of one surface of the panel and the other surface of the panel is facing upward. A mounting method includes bending the other end side of the flexible board, after holding the other end portion including the other end electrode, which is positionally adjusted based on the position recognition result of the mounting portion the press tool recognizing the position of the other end electrode, matching the positions of the mounting portion and the other end electrode by relative positional adjusting, and mounting the other end electrode on the mounting portion by temporarily pressing the other end electrode on the mounting portion.

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Yamanashi, Japan

Shingo Yamada