Tokyo Electron Limited

Tokyo Electron Kabushiki Kaisha

Tokyo Electron Tohoku Kabushiki Kaisha

Tohoku University

Tokyo Electron Tohoku Limited

Tokyo Electron Sagami Kabushiki Kaisha

Tokyo Electron Tohoku Kabushiki

Tel Sagani Limited

Osaka Kagaku Gokin Co., Ltd.

Shingo Watanabe

Tetsuya Hanagata

Toshihisa Nozawa

Kazunari Sakata

Hiroyuki Iwai

Tadahiro Ohmi

Yuuichi Mikata

Ken Nakao

Katsuya Okumura

Yasushi Yagi

Hirofumi Kitayama

Hironobu Nishi

Katsushin Miyagi

Tetsu Ohsawa

Motoki Akimoto

Masato Kadobe

Hisashi Kikuchi

Koyu Hasegawa

Shinya Mochizuki

Hiroshi Motono

Mitsuo Mizukami

Seiichi Yoshida

Hiroki Fukushima

Tsutomu Haraoka

Chuichi Kawamura

Isao Furuya

Keiichi Katabuchi

Keiji Takano

Kimihiko Yoshino

Tomoyoshi Nomi

Tomio Ito

Testuya Hanagata

Disclosed is a light emitting device manufacturing apparatus including a plurality of processing chambers for performing a substrate processing for forming, on a target substrate, a light emitting device having multiple layers including an organic layer, wherein each of the plurality of processing chambers is configured to perform a substrate process on the target substrate while maintaining the target substrate such that its device forming surface, on which the light emitting device is to be formed, is oriented toward a direction opposite to a direction of gravity.

Light emitting device and method for manufacturing light emitting device

A film forming apparatus is provided with a processing chamber having a substrate holding table for holding a substrate to be processed inside the container; a gas material generation unit arranged outside the processing chamber, for generating a gas material by evaporating or sublimating a film forming source material including a metal; a gas material supply unit for supplying the processing chamber with the gas material; and a transport path for transporting the gas material to the gas material supply unit from the gas material generation unit. The film forming apparatus is characterized in that a metal-containing layer is formed on an organic layer including a light emitting layer on the target substrate.

Film forming apparatus and method for manufacturing light emitting element

A heat treatment system and method for cooling a loading chamber that includes a heat treatment furnace for heat-treating an object to be treated. The heat treatment furnace includes a throat for carrying the object in and out, and a cooling mechanism for cooling the vicinity of the throat. The cooling mechanism has a ventilating unit with a ventilating port for sending a cooling fluid toward the vicinity of the throat and a heat exchanger arranged so as to face the ventilating port in the vicinity of the throat. The cooling mechanism also has an intake fan for sucking the cooling fluid in the vicinity of the throat over the heat exchanger. When the object to be treated is carried in, the structure of various mechanisms in the vicinity of the throat is simplified, and space is saved.

Heat treatment system and a method for cooling a loading chamber

A semiconductor manufacturing unit according to the invention includes a processing container into which a semiconductor substrate is adapted to be conveyed. A heating unit is adapted to heat an atmosphere in the processing container in order to thermally process the semiconductor substrate. A plane thermoelectric module having a first surface is arranged opposite to an area heated by the heating unit, for converting a thermal energy of the area into an electric energy by making use of Seebeck effect. According to the feature, the thermal energy which has been disposed in conventional units can be used as the electric energy. Thus, total energy efficiency of the semiconductor manufacturing unit can be raised.

Semiconductor manufacturing unit and semiconductor manufacturing method

Quartz process tube

Processing tube for use in a semiconductor wafer heat processing

Food component transfer sheet and method of processing food therewith

A heat treatment device including a handling chamber that has a carriers feed in/out opening for carriers holding plural sheets of objects to be treated parallelly vertical, a vertical heat treatment furnace for heat treating the objects and a posture changer for swinging the carriers near the carriers feed in/out opening of the handling chamber on a rotational center into a territory of lower sides of the carriers to change the posture of the objects to be treated from the vertical position to the horizontal position. The heat treatment device also has a carriers storage unit disposed above the posture changing means for storing a plural number of posture changed carriers, conveying device for conveying the carriers between the storage unit and the posture changing device and the heat treatment furnace side. Also, provided is a transferrer for transferring the objects-to-be-treated to/from an objects-to-be-treated holder for loading and unloading into/out of the heat treatment furnace side. The posture changer swings the carriers on the rotational center to sides of the carriers to change the carriers' posture from vertical to horizontal so the carriers have postures changed along a swing track of a minimum radius with small bulge amounts and a minimum moving amount. Thus, a conveying distance and a conveying time for conveying the posture changed carriers to the upper storage unit be reduced, and the heat treatment device can be smaller-sized and have improved processing efficiency.

Heat treatment method and device

Wafer boat

A heat treatment boat for mounting a number of disc-shaped objects to be treated at a vertical interval for heat treatment thereof in a vertical heat treatment furnace comprises arcuate or ring-shaped support members provided on support rods at a vertical interval for supporting the objects to be treated in surface contact with the undersides of peripheral parts of the objects to be treated. The heat treatment boat is disposed on a ring-shaped intermediate member of high radiant heat absorption disposed on a heat insulating cylinder. The heat treatment boat comprises support rods which are planted on an annular support member circumferentially in accordance with a contour of the objects to be treated and whose upper ends are secured to an annular fixation member. The heat treatment boat of such constitution can reduce occurrences of slips in the disc-shaped objects when heat treated.

Heat treatment boat support

Heat treatment boat

A vertical heat treatment system for heat treating a large number of semiconductor wafers housed in a boat at once includes a heat treatment unit having a boat loading/unloading port, a boat section communicating with the heat treatment unit through the boat loading/unloading port, an elevator mechanism for loading/unloading the boat between the boat section and the heat treatment unit through the boat loading/unloading port, a cassette section provided adjacent to the boat section, a wafer transfer mechanism for transferring wafers between a cassette and the boat, a gas supply mechanism for supplying a non-oxidization gas into the boat section, and a gas shower means for blowing the non-oxidization gas to the wafers in the vicinity of the boat loading/unloading port.

Vertical type heat treatment system

A heat treatment apparatus having a heat treatment boat with a plurality of wafers held thereon, which is to be loaded in a reaction vessel which has one end opened. Once loaded, the boat effects a seal of the reaction vessel, in preparation for subjecting the wafers to heat treatment. The boat also has a heat-insulator disposed on its lower end for heat-insulating the interior of the reaction vessel during the heat-treatment. The heat-insulator includes composite plates having a metal film layer on an upper surface for reflecting heat rays generated during the heat treatment of the reaction vessel, and a cylinder enclosing the composite plates. Thus, sufficient heat-insulating effect for the heat treatment can be obtained, and stable heat-treatment can be conducted with the sufficient heat-insulating effect secured. Furthermore, the generation of particles can be suppressed, and yields of the heat treatment can be improved.

Heat treatment apparatus

Growing community of inventors

Kanagawa, Japan

Shingo Watanabe