Seiko Epson Corporation

Shingo Tomimatsu

Shunsuke Watanabe

Hiroki Kobayashi

Katsuhiro Okubo

Takahiro Kanegae

Motoki Takabe

Haruhisa Uezawa

Kentaro Murakami

Yoichi Naganuma

Fumiya Takino

Eiju Hirai

Daisuke Yamada

Hiroshige Owaki

Eiichiro Watanabe

Kohei Yuwaki

Masahiko Sato

Hitoshi Takaai

Osamu Yagi

Kenta Ono

A liquid ejecting head includes a first-positioning-portion into which a first-positioning-pin of a support body is inserted. When a virtual cylinder inserted to a deepest position of the first-positioning-portion and having a maximum cross-sectional area when viewed in a first-direction which is a depth direction of the first-positioning-portion is defined as a first-virtual-cylinder, a side surface of the first-virtual-cylinder includes a first-region, a second-region, and a third-region disposed between the first-region and the second-region. The first-region contacts with the first-positioning-portion on a first-side which is one side in a second-direction orthogonal to the first-direction, and does not contact with the first-positioning-portion on a second-side which is the other side in the second-direction. The second-region does not contact with the first-positioning-portion on the first-side, and contacts with the first-positioning-portion on the second-side. The third-region does not contact with the first-positioning-portion on both the first-side and the second-side.

Liquid ejecting head, support body, and liquid ejecting apparatus

A flow passage member includes: a supply flow passage through which liquid flows; a filter provided on a path of the supply flow passage, the liquid being configured to pass through the filter; a fixing member which constitutes a part of the supply flow passage and to which the filter is fixed; and a first member which constitutes a part of the supply flow passage and to which the fixing member is fixed; wherein the fixing member is made of thermoplastic resin, and the first member is made of any of thermosetting resin, metal, and ceramic.

Flow passage member, liquid ejecting head, liquid ejecting apparatus, and method for manufacturing flow passage member

A liquid ejecting head includes: a plurality of head chips having a nozzle surface; a thermally conductive holder holding the plurality of head chips; a thermally conductive flow path structure provided with a flow path of a liquid supplied to the plurality of head chips; and a planar heater disposed between the holder and the flow path structure and along a direction parallel to the nozzle surface, in which the heater overlaps the plurality of head chips in a plan view.

Liquid ejecting head and liquid ejecting apparatus

A liquid ejecting head supported by a support body includes: a first head chip; a holder having a holding portion holding the first head chip and a flange portion; and a heater heating the holding portion, in which the holding portion has a heat receiving portion receiving heat from the heater, and a shortest path of heat transferred through the holder from the heat receiving portion to the flange portion is bent or curved at two or more points.

A liquid ejecting head includes: head chips including a first-head-chip and a second-head-chip; a holder holding the head chips; and a heater along a direction parallel to a nozzle surface. The first-head-chip and the second-head-chip are disposed to be offset from each other in both a first-direction and a second-direction parallel to the nozzle surface and intersecting with each other. When a first-side is one of the four sides of a virtual rectangle circumscribing the aggregate of the head chips and a second-side and a third-side are coupled to both ends of the first-side, the first-head-chip is in contact with the first-side and the third-side and the second-head chip is in contact with the second-side. The heater overlaps the head chips. A first-region surrounded by the first-side, the second-side, the first-head-chip, and the second-head-chip includes a first-outside-part positioned outside the outer edge of the heater.

A liquid ejecting apparatus includes a liquid ejecting head including head chips each including a nozzle plate, a holder that is formed of resin, holds the head chips, and includes a flow path for supplying the liquid to each of the head chips, a holder cover that is formed of a material having a higher thermal conductivity than a thermal conductivity of the holder and houses the head chips and the holder, and a fixing plate that is formed of metal and to which the holder cover and the head chips are fixed, a carriage on which the liquid ejecting head is mounted, and a heater that is mounted on the carriage and heats the liquid inside each of the head chips via the holder cover and the fixing plate.

Liquid ejecting apparatus and liquid ejecting head

A liquid ejecting head includes: a plurality of head chips having nozzles; a holder holding the plurality of head chips; and a planar heater disposed on the holder and heating the holder, in which the heater includes an outer peripheral region along an outer edge of the holder and a middle region positioned inside the outer peripheral region in a plan view, and a heat generation amount per unit time of the outer peripheral region is larger than a heat generation amount per unit time of the middle region.

A plurality of head chips including: a nozzle plate having a plurality of nozzles configured to eject a liquid in a first direction, and a case having one or more first flow paths communicating with at least a part of the plurality of nozzles; a holder to which the plurality of head chips are fixed, which includes metal or ceramics, and which has a plurality of second flow paths communicating with at least one of the plurality of first flow paths; and a heater configured to heat the holder.

There is provided a liquid discharge head including a first wiring through which a drive signal is input to a wiring substrate, in which the wiring substrate has a substrate having a first surface and a second surface that opposes the first surface, a second wiring formed on the first surface, a third wiring formed on the second surface, a fourth wiring and a fifth wiring that pass through the substrate and electrically couples the second wiring with the third wiring, and an electrode provided on the second wiring and electrically couples the second wiring with the first wiring, and the electrode is positioned between a first coupling point at which the fourth wiring is electrically coupled to the second wiring and a second coupling point at which the fifth wiring is electrically coupled to the second wiring, in the second wiring.

Liquid discharge head having a wiring substrate with surface wirings connected at both ends via through-wirings

A liquid ejecting head including a head unit including a mounting surface on which a plurality of first terminals, to which a signal to eject ink from a nozzle is supplied, are formed, and a flexible wiring substrate including a plurality of second terminals that supply the signal to the head unit, the flexible wiring substrate bonded to the head unit with nonconductive paste while the second terminals and the first terminals are in an electrically coupled state, in which the plurality of second terminals are arranged at pitches of 50 &#x3bc;m or less, and in which protrusions in contact with surfaces of the first terminals are formed on surfaces of the second terminals, the protrusions protruding at a height exceeding a surface roughness of the second terminals.

Liquid ejecting head, liquid ejecting apparatus, and wiring substrate

In a plan view from a perpendicular direction to a surface of a wiring substrate on which a wiring is provided, a buried wiring, a connection wiring, and a terminal portion of an external wiring are formed at an overlapping position, in which a recessed portion is provided at a position corresponding to the buried wiring on a surface of the connection wiring on an opposite side to the wiring substrate, and in which, in a direction intersecting an extension direction of the wiring on the surface of the wiring substrate on which the wiring is provided, a width of the connection wiring is larger than a width of the buried wiring, a width of the terminal portion of the external wiring is larger than a width of the recessed portion, and the terminal portion is provided across the recessed portion of the connection wiring.

Liquid ejection head, liquid ejection apparatus, and electronic device

A liquid ejecting head includes a pressure chamber that communicates with a nozzle which ejects liquid, a liquid chamber that communicates with the pressure chamber, a flexible compliance member that defines a portion of the liquid chamber, and a pressure adjusting mechanism that adjusts a supply pressure of liquid supplied to the liquid chamber. The pressure adjusting mechanism can adjust displacement of the compliance member.

Liquid ejecting head, liquid ejecting apparatus, and control method for liquid ejecting apparatus

A liquid ejecting head includes a liquid ejection unit, a flexible substrate, and a case member. The liquid ejection unit includes a drive element, a pressure chamber, and a nozzle. The flexible substrate is electrically connected to the drive element. The case member includes a flow channel configured to supply the liquid to the pressure chamber and an opening portion through which the flexible substrate is inserted. The flexible substrate has a straight portion and a wide portion having a width more than that of the straight portion. The case member has a side wall surrounding the opening portion, and a cutout portion formed in the side wall and configured to release the opening portion outward from the side wall. Portions of the side wall across the cutout portion are positioned outside the straight portion of the flexible substrate disposed in the opening portion.

A liquid ejecting head may include a driver element that ejects liquid in a pressure chamber from a nozzle, a liquid storage chamber that stores liquid to be supplied to the pressure chamber, and a driver IC that drives the driver element. At least a part of the liquid storage chamber overlaps with both the driver element and the driver IC when viewed in plan.

A liquid ejection head, which includes a driving element that changes pressure in a pressure chamber and causes a liquid to be ejected from a nozzle, an individual channel that communicates with the pressure chamber, and a liquid reservoir that supplies via the individual channel the liquid introduced from an inlet to the pressure chamber. The liquid reservoir includes a first reservoir disposed on the inlet side, a second reservoir disposed on the individual channel side, and an intermediate reservoir that communicates with the first reservoir and the second reservoir. At least a part of the first reservoir overlaps the second reservoir when seen in plan view. A first compliance substrate is provided in the first reservoir on the second reservoir side on the side opposite to the inlet. A second compliance substrate is provided in the second reservoir on the side opposite to the first reservoir.

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Matsumoto, Japan

Shingo Tomimatsu