Kyocera Corporation

Shingo Sato

Hiroshi Makino

Takashige Yagi

Shin Matsuda

Kenshi Nakamura

Seigo Matsuzono

A plasma generator has a first membercontaining a dielectric material, and an electrode group composed of a plurality of electrodes and including a first assemblypartially including a plurality of electrodes and a second assemblypartially including a plurality of electrodes. In accordance with an AC voltage, the first assemblygenerates a plasma in a first spacecontacting the first member. In accordance with a DC voltage, the second assemblygenerates an electric field in a second spacecontacting the first memberand communicating with the first space. At least one or more electrodes of a portion of the first assemblyand at least one or more electrodes of a portion of the second assemblyare provided on the surface of or in the inside of the first member

Plasma generator and discharge device and reactor using plasma generator

A circuit board of the invention comprises: an insulating base, which has a semiconductor element mounting portion on an top or bottom side thereof, and on which wiring patterns led out of the semiconductor element mounting portion are installed; and a plurality of substantially circular terminal pads, which are formed on the bottom side of the insulating base, which are connected to the wiring patterns, and to which solder terminals will be joined, wherein each of the terminal pads is provided with a solder lead portion which projects from a center side toward a perimeter side of the insulating base in a diametrical direction of the terminal pad. A part of the solder terminal is pulled out at the solder lead portion, whereby it is possible to prevent a fatigue failure of a joint of the terminal pad and the solder terminal due to a concentration of thermal stress, to electrically connect the solder terminal to the terminal pad in a stable manner for a long time period.

Circuit board with terminals having a solder lead portion

A method of fabricating a package for housing a semiconductor element, comprising applying solder paste within plural depressions which are formed on at least one principal surface of an insulating substrate and have electrical connection pads, protruding the surface of the solder paste from the principal surface of the insulating substrate, mounting solder balls on the surface of the solder paste, and fusing the solder paste and the solder balls to produce unitary structures in order to form connection terminals with spherical protrusions.

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Kokubu, Japan

Shingo Sato