Murata Manufacturing Co., Ltd.

Shingo Okuyama

Yoshiji Okamoto

Makoto Fukuda

Toshihiro Nakai

Yukio Sakamoto

Tadahiro Nakagawa

Shinichi Madokoro

Hiroyoshi Takashima

Shinichi Kokawa

Akira Hashimoto

Takehiko Miura

Hiromichi Tokuda

Takeshi Tanabe

Takaaki Ooi

Tsuyoshi Tatsukawa

Solder-repellent portions are each arranged so as to extend over all or substantially all of a portion of a corresponding one of outer electrodes provided on a corresponding one of end surfaces of a monolithic ceramic electronic component and partially on portions of the outer electrode provided over two side surfaces of the monolithic ceramic electronic component. When the monolithic ceramic electronic component is mounted on the circuit board, solder does not adhere to the end surfaces and portions of the outer electrode provided on portions of the two side surfaces. Thus, expansion and contraction that occur as a result of application of an AC voltage is not transmitted or is not significantly transmitted to the circuit board. Consequently, vibrations of the circuit board are significantly reduced or prevented.

Monolithic ceramic electronic component

When a monolithic ceramic electronic component is viewed from either one of end surfaces thereof, an outer electrode includes a solder-repellent portion and a solder-receivable portion. The solder-repellent portion covers the central portion of an end surface of a ceramic laminate body. The solder-receivable portion includes portions disposed on two opposing sides of the solder-repellent portion. When the monolithic ceramic electronic component is mounted on the circuit board, solder does not adhere to a portion around the central portion of the end surface. Thus, expansion and contraction that occur as a result of application of an AC voltage are not significantly transmitted to the circuit board. Consequently, vibrations of the circuit board are reduced.

A method for manufacturing a multilayer ceramic electronic element includes the steps of forming ceramic green sheets having superior surface smoothness and small variations in thickness at a high speed, in which defects such as pinholes are prevented from occurring, and providing internal electrodes and step-smoothing ceramic paste on the ceramic green sheets with high accuracy. The method includes the steps of applying ceramic slurry to a base film by a die coater followed by drying performed in a drying furnace for forming the ceramic green sheets, and performing gravure printing of conductive paste and ceramic paste onto the ceramic green sheets by using a first and a second gravure printing apparatus, respectively. Accordingly, the internal electrodes are formed, and the step-smoothing ceramic paste is provided in regions other than those in which the internal electrodes are formed.

Method for manufacturing multilayer ceramic electronic element

The object of the present invention is to reduce irregularity of the amount of applying of the conductive paste applied for forming the side face electrode so as to be extended from a part of the side face of the component body up to a part of the face adjoining the side face, wherein the conductive paste is filled into the slit provided on the slit plate, and the component body is disposed with its side face toward the first principal face side of the slit plate, followed by allowing the shutter member to undergo elastic deformation toward the inside of the slit by compressing the shutter member comprising an elastic material with a projection on the compression member, thereby the conductive paste is applied so as to extend the paste from a part of the side face of the component body up to a part of the faces adjoining the side face while supplying the conductive paste on in the slit so as to swell on the first principal face.

Method for manufacturing electronic component and apparatus for manufacturing the same

A manufacturing method for a laminated ceramic electronic component is performed such that the thickness of the inner electrode is greatly increased, delamination does not occur, and reliability is superior. The manufacturing method for the laminated ceramic electronic component includes a process in which a green sheet including the inner electrode paste layer and the ceramic paste layer, is provided on a carrier sheet such that the inner electrode paste layer penetrates the green sheet from the top surface to the bottom surface thereof, and a process, in which laminates of the green sheet and the carrier film are adhered by pressing, and thereafter the carrier film is peeled off, are repeated to obtain the ceramic laminate, and the ceramic laminate is fired after pressing in the direction of the thickness to obtain the ceramic sintered body.

Laminated ceramic electronic components and manufacturing method therefor

A laminated ceramic electronic component significantly simplifies a step of forming external electrodes and has reliable electrical connection between an internal electrode and the external electrodes. A method for manufacturing the laminated ceramic electronic component includes the steps of forming composite sheets each having a conductor and a ceramic layer provided at the sides of the conductor on a carrier film, laminating the composite sheets with each other for forming a mother laminate, cutting the mother laminate in the thickness direction thereof so as to divide the conductor for forming laminates each forming one laminated ceramic electronic component, in which the conductor is exposed on the cut surface of the laminate, and firing the laminate so as to simultaneously form external electrodes from the exposed conductors and a sintered ceramic body.

Laminated ceramic electronic component and method for manufacturing same

Method for manufacturing electronic component

A manufacturing method for a laminated ceramic electronic component includes the steps of printing a layer of a conductor and a ceramic green sheet formed around the conductor a plurality of times on a carrier film, thus preparing a composite sheet laminate in which composite sheets made up of the conductor and the ceramic green sheet are laminated, and pressing and attaching the composite sheet laminate to another ceramic green sheet and removing the carrier film.

Manufacturing method for a laminated ceramic electronic component

A chip type electronic component and a method of manufacturing the same reduces the steps necessary for applying an electrically conductive paste to define a first external electrode, a second external electrode and a third external electrode on the outer surface of an electronic component main body. External electrodes are provided around the side surfaces of the main body of the electronic component. The first external electrode is positioned on the first end surface of the main body, the second external electrode is positioned on the second end surface, the third external electrode is positioned between the first and second external electrodes. The first and second external electrodes are arranged to extend to edge portions of the first and second end surfaces, but exposing at least the approximate central portions of these end surfaces. In this way, the external electrodes are formed by applying the electrically conductive paste on the side surfaces of the main body.

Chip electronic component and method of manufacturing the same

A chip-like LC filter which comprises a cylindrical magnetic element having a through hole. A cylindrical capacitor element has a through hole and terminal electrodes formed on inner and outer peripheral surfaces thereof. A central conductor is inserted in the through holes of the magnetic element and the capacitor element, which through holes are aligned along an axial direction. The terminal electrode on the inner peripheral side of the capacitor element is electrically connected with the central conductor. Cap-shaped external terminal members are respectively provided on both end portions of the central conductor, so that the magnetic element and the capacitor element are located between the external terminal members. The central conductor is obtained by cylindrically rolling a metal plate, so that a portion located on the outer periphery of the rolled metal plate defines an elastic contact portion which elastically comes into pressure contact with the terminal electrode on the inner peripheral surface of the capacitor element.

Chip-like LC filter

A compliant pin terminal inserted into a through hole, such as a center hole of a feed-through capacitor or a through hole of a circuit substrate having an electrode at the inner periphery thereof, is mounted into the through hole for electrically connecting with the electrode therein. The pin terminal includes slits, by which linear divided portions and expanded elastic contact portions are formed so that when the body is inserted into the through hole of the capacitor the elastic contact portions come into press-contact with the electrode, thereby obtaining electrical connection with the electrode and mechanical locking by means of the elasticity of each elastic contact portion. A lengthwise pulling force acting on the terminal body is borne by the linear divided portions, but does not act on the elastic portions. Accordingly, an interval between the elastic contact portions opposite to each other resists change, thereby effectively preventing the pin terminal from escaping from the through hole.

Feed-through capacitor having a compliant pin terminal

A chip-like LC filter which comprises a cylindrical magnetic element having a through hole, a cylindrical capacitor element having a through hole and terminal electrodes formed on inner and outer peripheral surfaces thereof, and a central conductor inserted in the through holes of the magnetic element and the capacitor element aligned in the axial direction. The terminal electrode on the inner peripheral side of the capacitor element is electrically connected with the central conductor. Flange-shaped external terminal members are respectively provided on both end portions of the central conductor, so that the magnetic element and the capacitor element are located between the external terminal members.

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Takefu, Japan

Shingo Okuyama