Panasonic Intellectual Property Management Co., Ltd.

Shingo Okamura

Tadahiko Sakai

Tadashi Maeda

Yuki Yoshioka

An adhesive for temporarily fixing an electronic component to a solder precoat covered at least partially with an organic film, the adhesive including a principal resin, and a solvent dissolving the principal resin. The content of the solvent is 25 mass % or more and 40 mass % or less, and the organic film dissolves in the solvent when the solder precoat is melted. According thereto, the formation of an oxide film on the surface of the solder precoat can be suppressed, and poor connection between the electrode having the solder precoat and the electronic component can be suppressed.

Adhesive for provisionally fixing electronic component to solder precoat and method for producing electronic component mounted substrate

A disclosed method for manufacturing an electronic-component-mounted substrate includes: a step (i) of forming a temporary fixing film () in such a manner as to cover a plurality of solder precoats () formed on a plurality of lands () on a substrate and an antioxidation film () formed in such a manner as to cover the solder precoats; a step (ii) of disposing a plurality of electronic components () on the plurality of solder precoats () via the antioxidation film () and the temporary fixing film (); and a step (iii) of soldering the plurality of electronic components () to the lands () by melting the plurality of solder precoats (). The antioxidation film () contains a first thermoplastic resin. The temporary fixing film () contains an activating agent and a second thermoplastic resin. The softening point of the first thermoplastic resin is equal to or lower than the softening point of the second thermoplastic resin.

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FUKUOKA, Japan

Shingo Okamura