Jsr Corporation

Shingo Naruse

Hirokazu Sakakibara

Shingo Tanaka

Hidenori Naruse

Hisanori Akimaru

Hidefumi Ishikawa

The present invention provides a photosensitive resin composition comprising: an alkali-soluble resin (A); a compound having at least one ethylenically unsaturated double bond per molecule (B); a photo radical polymerization initiator having a keto oxime ester structure (C); and a compound represented by the Formula (1) or (2) below (D); wherein the content of the photo radical polymerization initiator (C) is 0.5 to 5 times the content of the compound (D), and the content of the photo radical polymerization initiator (C) with respect to 100 parts by mass of the compound (B) is 3 to 20 parts by mass. In Formula (1), the six Rs each independently represent a hydrogen atom or an electron-donating group, and n represents 0 or 1. In Formula (2), the six Rs each independently represent a hydrogen atom or an electron-donating group, and m represents 0 or 1. By use of the photosensitive resin composition of the present invention, formation of a resist pattern having excellent resolution is possible even without using an oxygen inhibition layer. By the method for producing a resist pattern of the present invention, formation of a resist pattern having excellent resolution is possible even without using an oxygen inhibition layer.

Photosensitive resin composition and method for producing resist pattern

An energy beam curable type ink jet printing ink comprising (A) a colorant, (B) a compound having at least one ethylenically unsaturated bond which can be polymerized by the application of an energy beam and (C) a photopolymerization initiator, wherein This ink has low viscosity, high sensitivity and sufficiently high film strength after curing.

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Minato-ku, Japan

Shingo Naruse