Canon Kabushiki Kaisha

Shingo Nagata

Jun Yamamuro

Shuji Koyama

Koji Sasaki

Kenji Fujii

Masaki Osumi

Kazuhiro Asai

Yoshinori Tagawa

Hiroyuki Murayama

Teruo Ozaki

Seiichiro Yaginuma

Masataka Nagai

Yoshinobu Urayama

Keiichiro Tsukuda

Keiji Matsumoto

Makoto Watanabe

Kunihito Uohashi

Ryotaro Murakami

Shuhei Oya

Tomohiko Nakano

Hidehiko Kanda

Hirokazu Tanaka

Keiji Watanabe

Nobuyuki Matsumoto

Atsushi Sakamoto

Masaki Oikawa

Hiromasa Amma

Chiaki Muraoka

Keiji Tomizawa

Satoshi Ibe

Toru Yamane

Mikiya Umeyama

Ken Ikegame

Yuichiro Akama

Haruyuki Matsumoto

Satoshi Kudo

Masaki Ohsumi

Shigeki Fukui

Kenji Tamamori

Tomotsugu Kuroda

Wakako Yamamoto

Rumi Akiyama

A liquid ejection head includes a base plate and at least two device chips in which ejection ports for ejecting a liquid are formed and which are disposed on the base plate. At least one first reference mark is provided on the base plate. A second reference mark is provided on each of the device chips. At least one space is formed between adjacent device chips. The second reference marks and the first reference mark present in the space are disposed on an array axis along which the device chips are arrayed.

Liquid ejection head and process for producing liquid ejection head

A liquid ejection head includes an ejection orifice forming surface provided with an ejection orifice from which a liquid is ejected. The ejection orifice forming surface includes a first region in a vicinity of the ejection orifice, a second region that is further spaced apart from the ejection orifice than the first region and protrudes from the first region in a liquid ejection direction and a third region that connects the first region and the second region. When a contact angle of pure water in the first region is a first contact angle &#x3b8;1 and a contact angle of pure water in the third region is a third contact angle &#x3b8;3, &#x3b8;1 is larger than &#x3b8;3 by 10 degrees or more.

Liquid ejection head and manufacturing method thereof

To manufacture a liquid ejection head, a film having a lower surface free energy than a surface free energy of a substrate is first formed on an inner face of a liquid supply port. Next, a dry film to be a flow path forming member is attached to cover the surface of the substrate, and then a member to be an ejection orifice forming member is provided on the surface of the dry film.

Method of manufacturing liquid ejection head and method of manufacturing structure

There is provided a transfer method for transferring a member formed on a film held on a frame jig to an object including: attaching the member formed on the film to the object in a first direction; and delaminating the film from the object in a second direction intersecting with the first direction, wherein a rigidity of the frame jig in the first direction is higher than that of the frame jig in the second direction.

Transfer method, manufacturing method of liquid ejection head, and frame jig

A method for manufacturing a liquid ejection head including providing a negative first photosensitive resin layer on the substrate, forming a pattern of the flow path by selectively exposing the first photosensitive resin layer, providing a negative second photosensitive resin layer on the first photosensitive resin layer, providing a negative third photosensitive resin layer on the second photosensitive resin layer, forming a pattern of the ejection port by selectively exposing the second and third photosensitive resin layers, developing the first, second, and third photosensitive resin layers, irradiating an activation energy line on at least the third photosensitive resin layer after the developing, and heat curing the first, second, and third photosensitive resin layers after the irradiating of the activation energy line.

Method for manufacturing liquid ejection head

A liquid ejection head substrate includes an electrode pad for receiving driving power for liquid ejection from an outside, the electrode pad including at least a conductor layer and a layer of gold. A portion of the conductor layer has an opening region, and an upper layer portion in a laminating direction above the conductor layer including the opening region has at least the layer of gold. An external connection portion connected to the outside is provided on top of the layer of gold corresponding to the opening region of the conductor layer.

Liquid ejection head substrate and semiconductor substrate

Provided is a film formation method including the steps of: forming a resist film on an object to be applied, forming a layer of a protecting material removable by a first dissolving liquid on the upper surface of the resist film, removing the resist film from a region not having, on the upper surface thereof, the layer of the protecting material by side rinsing with a second dissolving liquid capable of dissolving the resist film therein, and removing the protecting material remaining on the upper surface of the resist film by the first dissolving liquid.

Film formation method, dry film manufacturing method and liquid ejection head manufacturing method

A method for imparting water repellency to a surface of a member includes a step in which a material including a compound containing a fluorine atom is deposited on a surface of a photosensitive resin layer in order to form a member including a material layer; a first exposure step in which the member is exposed to an amount of light with an exposure apparatus in order to form a latent image in the member; a development step in which the member including the latent image is developed; and a second exposure step in which the member is exposed to an amount of light with an exposure apparatus subsequent to the development step.

Method for imparting water repellency to surface of member

A liquid discharge head includes a substrate on the surface of which a liquid supply port opens, and a sealing material that is in contact with a side surface of the substrate and that seals the side surface of the substrate. On the surface of the substrate, an opening of the liquid supply port extends in a longitudinal direction. In a direction perpendicular to the longitudinal direction, the sealing material has a narrow region and a wide region. When the width of the narrow region is denoted as W1, and the width of the wide region is denoted as W2, W1&#x3c;W2. The narrow region of the sealing material is formed in a position corresponding to the opening of the liquid supply port. In a direction parallel to the longitudinal direction, the length of the narrow region of the sealing material is less than the length of the opening of the liquid supply port.

Liquid discharge head

A liquid discharge head includes a substrate, a heat resistor layer, and a side wall member that forms a side wall of a pressure chamber. The heat resistor layer has a heat effect portion configured to foam liquid in an interior of the pressure chamber to discharge liquid from a discharge port. The heat effect portion is apart from the substrate, at least part of a surface of the heat resistor layer is covered with a covering layer in the interior of the pressure chamber, and the covering layer extends from the interior of the pressure chamber to a position coming into contact with the side wall of the side wall member.

A liquid ejection head including a recording element substrate provided with a substrate and a flow-path-forming member forming a flow path in a principal surface of the substrate, a support member supporting the recording element substrate and an underfill material covering at least a joint portion at which the substrate and the support member are joined to each other, wherein the flow-path-forming member is formed in such a manner that an end portion thereof projects from at least one side surface of the substrate, the underfill material covers an external surface of the joint portion and covers the at least one side surface of the substrate in such a manner that the underfill material reaches the projecting end portion of the flow-path-forming member.

An apparatus includes nozzles and an ink passage. Each nozzle includes a pressure chamber which houses an electrothermal transducer provided on a substrate to apply ejection energy to ink, an ink ejection orifice which faces the electrothermal transducer, and an ink passage along which the ink is supplied to the pressure chamber. The ink supply port is provided on the substrate and communicates with the ink passages. A distance between a center of gravity of the electrothermal transducer and the ink supply port differs between the nozzles which are next to each other. In at least one of the nozzles, a center of gravity of the ink ejection orifice is shifted from that of the electrothermal transducer in a direction toward the ink supply port by an amount which is increased as the distance increases.

Inkjet recording head and inkjet recording method

Growing community of inventors

Tokyo, Japan

Shingo Nagata