Kyocera Corporation

Shingo Matsuura

Daisuke Sakumoto

Yuki Mori

Shozo Toyohisa

Kousuke Katabe

Mitsuo Yanagisawa

Chie Kanazawa

Akira Miyake

Tsuneyuki Hirabayashi

Tomoya Tabuchi

Fumiaki Sekine

Masayuki Mori

According to an aspect, a lighting apparatus includes a lighting unit including a long-shaped housing that has upper and lower openings and has an outer surface formed as a convex surface when seen in a cross-section perpendicular to a longitudinal direction, and a semiconductor light emitting device disposed inside the housing so as to emit light toward the lower opening. Further, the lighting apparatus includes a holding unit including a holding member in which at least a portion of a surface is formed as a concave surface corresponding to the convex surface when seen in a cross-section perpendicular to the longitudinal direction of the lighting unit. When seen in the cross-section, the convex surface has, in a region that faces the concave surface, a portion that is brought into contact with the concave surface, and a portion that is not brought into contact with the concave surface.

Lighting apparatus

To improve the luminance of light emitted by a light-emitting device, the light-emitting device includes a base () that has an opening part () constituted by a light-reflecting surface () and a bottom surface (), a light-emitting chip () that is mounted on the bottom surface () of the opening part (), a transparent member () that covers the light-emitting chip (), and an optical member () that is disposed on the transparent member (). The transparent member () is disposed on the bottom surface () of the opening part () in a state where the transparent member () is spaced away from the light-reflecting surface () of the opening part ().

Light-emitting device

A light emitting device includes a base, a sub-mount substrate, and a frame member. The light emitting device further includes a light emitting element and a wavelength converting member. The sub-mount substrate is disposed on the base, and has an upper surface made of a ceramic sintered body. The frame member has a light reflecting portion made of porous ceramics, is disposed on the base, and surrounds the sub-mount substrate. The light emitting element is mounted on the sub-mount substrate. The wavelength converting member covers the light emitting element and the light reflecting portion of the frame member.

Light emitting device and illumination device

A light emitting device includes a light emitting element, a base, and a transparent layer. The base has an upper side portion including a first portion and a second portion. The first portion includes a mounting region of the light emitting element, and has a first porosity. The second portion surrounds the first portion, includes a plurality of transparent particles, and has a second porosity larger than the first porosity. The light transmitting layer encapsulates the light emitting element, and is attached to the first portion in a state where the transparent layer is apart from the second portion.

Light emitting device

A package includes a base body having a mounting portion for mounting a light-emitting device, a frame-shaped first reflection member attached to the upper surface of the base body, an inner peripheral surface of which is shaped into a first light reflecting surface and surrounds the mounting portion, and a frame-shaped second reflection member attached to the upper surface of the base body, with a spacing secured between an inner peripheral surface of the second reflection member and an outer peripheral surface of the first reflection member, the inner peripheral surface surrounding the first reflection member and having a second light reflecting surface at a location above an upper end of the first reflection member.

Package for light-emitting device, light-emitting apparatus, and illuminating apparatus

A light-emitting chip includes a base, a transparent material layer and a light-emitting chip. The base has an upper surface including a conductive pattern. The transparent material layer is disposed on the upper surface of the base and has an opening part which is located on region at least part of the conductive pattern. The light-emitting chip is mounted on the conductive pattern and located in the opening part of the transparent material layer.

Light emitting device and method for manufacturing the same

A light-emitting apparatus includes a light-emitting element, a base body, a reflection member and a fluorescent material layer. A cross section of the inner surface of the reflection member cut by a virtual plane including a virtual axis penetrating a center of the inner surface and perpendicular to the upper principal surface of the base body has a sectional profile defined by a curved line expressed by the following formula, and the inner surface of the reflection member is a curved surface obtained by rotating the curved line about the virtual axis: Z=(cr)/[1+{1&#x2212;(1+k)cr}] (where &#x2212;10&#x2266;k&#x2266;&#x2212;0.001, 0.001&#x2266;c&#x2266;10). An angle &#x3b8;which is made by an upper surface of the fluorescent material layer and a line which connects one corner of a light-emitting portion of the light emitting element with an uppermost position of the inner surface and is tangent to the one corner, is given as &#x3b8;&#x2267;90&#xb0;&#x2212;sin(1/n).

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Higashiomi, Japan

Shingo Matsuura