Jgc Catalysts & Chemicals Ltd.

Shingo Kashiwada

Michio Komatsu

Kazuhiro Nakayama

Yuji Tawarazako

Kazuaki Inoue

Yoshinori Wakamiya

A subject of this invention is to provide a dispersion liquid of a silica-based composite particle, which can rapidly polish silica film, Si wafer or even hard-to-process material, can concurrently achieve high surface accuracy (less scratches, etc.), and can suitably be used for surface polishing of semiconductor devices including semiconductor substrate and wiring board, by virtue of its impurity-free nature. The subject is solved by a dispersion liquid of a silica-based composite particle that contains a silica-based composite particle that has a core particle mainly composed of amorphous silica, and bound thereto a ceria particle mainly composed of crystalline ceria, further has a silica film that covers them.

Silica-based composite fine-particle dispersion, method for producing same, and polishing slurry including silica-based composite fine-particle dispersion

Growing community of inventors

Kitakyushu, Japan

Shingo Kashiwada