Sumitomo Electric Industries, Limited

Sumitomo Electric Printed Circuits, Inc.

Other

National Institute of Advanced Industrial Science and Technology

A School Corporation Kansai University

Shingo Kaimori

Kentaro Okamoto

Jun Sugawara

Satoshi Kiya

Toshifumi Hosoya

Moriyasu Ichino

Masaaki Yamauchi

Takahiko Kitamura

Kazuo Murata

Makoto Nakabayashi

Yoshiro Tajitsu

Yasuhiro Okuda

Akira Mizoguchi

Hideki Kashihara

Isao Karube

Naota Uenishi

Yoshifumi Uchita

Chiaki Tokuda

Motohiko Sugiura

Tomoko Ishikawa

Masao Gotoh

Hideaki Nakamura

Takayuki Yonezawa

Syougo Asai

Takuma Yoshisaka

Masaya Kakimoto

Shogo Asai

Masato Tsurugasaki

Satoshi Koshimuta

Tsuyoshi Nonaka

Takashi Ninomiya

A method for manufacturing a dielectric sheet, includes the steps of extrusion molding a mixture including powder polytetrafluoroethylene and spherical silica at a temperature lower than or equal to a melting point of the polytetrafluoroethylene, and calendering a sheet body obtained by the extrusion molding. A mass ratio of the silica with respect to the polytetrafluoroethylene is 1.3 or greater. An average particle diameter of the silica is 0.1 μm or greater but 3.0 μm or less. A reduction ratio of the extrusion molding is 8 or less.

Method for manufacturing dielectric sheet, method for manufacturing substrate for high-frequency printed wiring board, dielectric sheet, and substrate for high-frequency printed wiring board

A first embodiment of a substrate for a high-frequency printed wiring board according to the present disclosure is directed to a substrate for a high-frequency printed wiring board, the substrate including: a dielectric layer including a fluororesin and an inorganic filler; and a copper foil layered on at least one surface of the dielectric layer, wherein a surface of the copper foil at the dielectric layer side has a maximum height roughness (Rz) of less than or equal to 2 μm, and a ratio of the number of inorganic atoms of the inorganic filler to the number of fluorine atoms of the fluororesin in a superficial region of the dielectric layer at the copper foil side is less than or equal to 0.08.

Substrate for high-frequency printed wiring board

A first embodiment of a substrate for a high-frequency printed wiring board according to the present disclosure is directed to a substrate for a high-frequency printed wiring board, the substrate including: a dielectric layer including a fluororesin and an inorganic filler; and a copper foil layered on at least one surface of the dielectric layer, wherein a surface of the copper foil at the dielectric layer side has a maximum height roughness (Rz) of less than or equal to 2 &#x3bc;m, and a ratio of the number of inorganic atoms of the inorganic filler to the number of fluorine atoms of the fluororesin in a superficial region of the dielectric layer at the copper foil side is less than or equal to 0.08.

An object of the present invention is to provide an adhesive composition for a printed wiring board, the adhesive composition having a good heat resistance. Another object of the present invention is to provide a coverlay for a printed wiring board, a copper-clad laminate, and a printed wiring board, all of which use the adhesive composition for a printed wiring board. The present invention provides an adhesive composition for a printed wiring board, the adhesive composition containing a siloxane-modified polyimide that includes structural units represented by formulae (1) and (2) below, an epoxy resin, and an inorganic filler. The siloxane-modified polyimide has a weight-average molecular weight (Mw) of 25,000 or more and 150,000 or less. A content of the inorganic filler is 10 parts by mass or more and 100 parts by mass or less relative to 100 parts by mass of the siloxane-modified polyimide. In formulae (1) and (2), Ar represents a tetravalent aromatic tetracarboxylic acid residue, m is 0.35 or more and 0.75 or less, and n is 0.25 or more and 0.65 or less. Rin formula (1) represents a divalent diamine siloxane residue, and Rin formula (2) represents a divalent aromatic diamine residue. 

Adhesive composition for printed wiring boards, bonding film, coverlay, copper-clad laminate and printed wiring board

There is provided a piezoelectric element, including: a porous fluororesin film made of a first fluororesin; and a nonporous fluororesin layer stacked on at least one surface of the porous fluororesin film and made of a second fluororesin, wherein the first fluororesin is different in type from the second fluororesin, and when 50 pores are selected in descending order from a pore having the longest thickness-direction length, of pores present in a cut surface of the porous fluororesin film in a thickness direction, an average value Aof thickness-direction lengths of the 50 pores is 3 &#x3bc;m or smaller.

Piezoelectric element including fluororesin film

Provided are an adhesive resin composition that is halogen-free, has good adhesiveness, solder heat resistance, and flame retardancy, and has good flow characteristics, and a laminate and a flexible printed wiring board using the same. The adhesive resin composition contains a phosphorus-containing epoxy resin and/or a phosphorus-containing phenoxy resin, a phosphorus-containing polyester resin having a weight-average molecular weight of more than 20,000 and 150,000 or less, another thermoplastic resin, and a curing agent. The adhesive resin composition preferably further contains a benzoxazine compound. Preferably, substantially no inorganic filler is mixed in the adhesive resin composition.

Adhesive resin compositions, and laminates and flexible printed wiring boards using same

A biosensor measurement device for providing accurate measurement results within a short period of time by using only a very small amount of sample. The biosensor measurement device includes a power source, which is connected to a voltage regulator, a measurement instrument, and a controller for supplying power. When the biosensor chip is connected to the biosensor measurement device and a voltage is applied, the measurement instrument begins the measurement of a current value for the biosensor. When the measured current value or a measured charge value is greater than a reference value, the measurement is terminated in accordance with an instruction issued by the controller, and when the value is smaller than the reference value, the measurement is continued in accordance with a controller instruction.

Biosensor measurement machine, biosensor measurement system and biosensor measurement method

In a biosensor system and its measuring instrument which determine that a biosensor chip has been inserted and measure biological information on a biological material supplied to the biosensor chip, the size of the biosensor chip is made small, the reliability of the measuring instrument is improved, and the product life becomes long. In addition, a measurement error of the biological information is suppressed in measuring the biological information by inserting a biosensor chip, which has a sensor electrode formed of an electrode member with an electric resistance value higher than a conductive metal, into the measuring instrument.

Biosensor chip, biosensor system and measuring instrument thereof

Method for etching laminated assembly including polyimide layer

Growing community of inventors

Osaka, Japan

Shingo Kaimori