Murata Manufacturing Co., Ltd.

Murata Manufacturingco., Ltd.

Shingo Ito

Kuniaki Yosui

Naoki Gouchi

Hirotaka Fujii

Takahiro Baba

Atsuyoshi Maeda

Kanto Iida

Satoru Noda

Shuichi Kezuka

Kazutaka Muraoka

Masanori Nakamura

Yohei Mukobata

Takahiro Hirao

Hiromasa Koyama

Isamu Morita

Haruhiko Ueno

Genro Kato

Ken Takakura

Syuichi Nabekura

Masaaki Kanao

Kosuke Takeuchi

Koichi Ikeda

Satoshi Yoshida

Kyosuke Uno

Kotaro Mishima

Kosuke Ooi

Yu Fujimura

Takumi Tanaka

A laminate of a laminated coil includes first and second sections in a stacking direction from a first surface toward a second surface. The number of windings of each of coil conductor patterns on insulation resin layers, respectively, in the first region is equal to or more than the number of windings of a coil conductor pattern on an insulation resin layer in the second section, and is more than the number of windings of the coil conductor pattern closest to the second surface in the second section. The number of main conductor portions per unit distance in the first section is more than the number of main conductor portions per unit distance in the second section. The outermost main conductor portion of the coil conductor pattern in the second section has a width more than a width of the main conductor portion of the coil conductor pattern in the first section.

Laminated coil

A transmission line substrate includes a line portion, a base including a first main surface and a second main surface opposite to the first main surface, first and second ground conductors, and a signal line. The first ground conductor is on the first main surface side. The second ground conductor is on the second main surface side. The first ground conductor includes first conductor-non-formed portions overlapping the signal line when viewed in the Z axis direction. The second ground conductor includes second conductor-non-formed portions overlapping the signal line when viewed in the Z axis direction. A total area of the second conductor-non-formed portions is less than a total area of the first conductor-non-formed portions.

Transmission line substrate and electronic device

A three-terminal capacitor includes a main body having a cylindrical or substantially cylindrical shape extending in a first direction and including first and second inner electrodes alternately laminated together with dielectric layers interposed therebetween, a pair of first outer electrodes on two end surfaces of the main body in the first direction and electrically connected to the first inner electrodes, and a second outer electrode electrically connected to the second inner electrodes. The main body includes a projecting portion projecting in a direction perpendicular or substantially perpendicular to the first direction at a position between the pair of first outer electrodes. The second outer electrode is provided on one surface of the projecting portion viewable when viewed in the first direction.

Three-terminal capacitor with cylindrical main body and electronic component including the same

A multilayer substrate includes at least three coil conductors respectively patterned on different surfaces of a first main surface of a laminated body, a second main surface of the laminated body, and laminated interfaces of insulating base materials and that are arranged in a lamination direction. The at least three coil conductors include first and second coil conductors, and are connected in series between first and second external electrodes. A surface at which another coil conductor is provided is not interposed between two surfaces at which the first and second coil conductors are provided, respectively. Further, the first and second coil conductors are directly connected to the first and second external electrodes, respectively, without another coil conductor interposed therebetween.

Multilayer substrate and method for manufacturing the same

A method for manufacturing a multilayer coil includes preparing a first substrate by forming a first conductor pattern on a first insulating base material layer, preparing a second substrate by forming a second conductor pattern on a second insulating base material layer, and joining a surface of the first substrate on which the first conductor pattern is formed and a surface of the second substrate on which the second conductor pattern is formed together with only a joining layer made of a thermoplastic resin interposed therebetween. Amounts of deformation of the first and second insulating base material layers are less than that of the joining layer at a fusion temperature. The first and second conductor patterns are each a coil pattern having a coil axis that extends in a lamination direction in which the first substrate and the second substrate are laminated together.

Multilayer coil and method for manufacturing the same

A multilayer substrate includes a stacked body of insulating base material layers and conductor patterns on the insulating base material layers. A thickness adjustment base material layer includes a frame portion, an opening portion inside the frame portion, and an island shaped portion inside the frame portion, and connection portions to connect the island shaped portion to the frame portion. The conductor patterns, in a stacking direction of the insulating base material layers, are wound around the island shaped portion. A line width of the connection portions is smaller than the width of the island shaped portion connected to the frame portion through the connection portions. An area overlapped with the conductor patterns is larger in the opening portion than in the frame portion and the island shaped portion.

Multilayer substrate and method of manufacturing the same

An actuator includes a coil substrate including a coil, a base substrate including a coil drive circuit, and a magnet to receive a magnetic field generated by the coil. A magnetic sensor is mounted on the coil substrate. The coil substrate on which the magnetic sensor is mounted is connected to the base substrate through a conductive bonding material.

Actuator and method of manufacturing actuator

A coil-incorporated multilayer substrate includes base materials and a coil portion including conductor patterns that are wound a plurality of times on at least one of the base materials, and, in a predetermined direction along the surface of the base material of the coil portion, the width of outermost conductor patterns is larger than the widths of the conductor patterns between an innermost conductor pattern and an outermost conductor pattern, the width of the innermost conductor pattern is larger than the widths of the conductor patterns between the outermost conductor pattern and the innermost conductor pattern, and the width of the innermost conductor pattern is larger than the distance between the innermost conductor pattern and the conductor pattern adjacent to the innermost conductor pattern.

Coil-incorporated multilayer substrate and method for manufacturing the same

A multilayer substrate includes a stacked body including a first main surface, and a conductor pattern (including a mounting electrode provided on the first main surface, and a first auxiliary pattern provided on the first main surface). The stacked body includes a plurality of insulating base material layers made of a resin as a main material and stacked on one another. The first auxiliary pattern is located adjacent to or in a vicinity of the mounting electrode. The mounting electrode, in a plan view of the first main surface (when viewed in the Z-axis direction), is interposed between a different conductor pattern (the mounting electrode) and the first auxiliary pattern.

Multilayer substrate, multilayer substrate mounting structure, method of manufacturing multilayer substrate, and method of manufacturing electronic device

A method of manufacturing a multilayer board includes forming conductor patterns on four or more insulating base material layers, forming a multilayer body by stacking the insulating base material layers in a state in which the conductor patterns face each other with prepreg layers therebetween, and heat-pressing the multilayer body. In a state before the step of heat-pressing, among the prepreg layers, a thickness of an outermost prepreg layer is larger than a thickness of a prepreg layer other than the outermost prepreg layer.

Multilayer board and method of manufacturing the same

A multilayer substrate includes a stacked body, coil conductor patterns, and a connection conductor pattern. The stacked body includes insulating layers. A first coil conductor pattern is provided on the front surface of an insulating layer and has a wound shape including outer and inner end portions. A second coil conductor pattern is provided on the front surface of the insulating layer and includes an end portion. The connection conductor pattern is provided in the stacked body, and connects the coil conductor patterns. The outer end portion is connected to a terminal conductor on a back surface of the stacked body. The end portion of the second coil conductor pattern is connected to the terminal conductor on the back surface of the stacked body. The first coil conductor pattern extends parallel or substantially parallel to the second coil conductor pattern along an outer periphery of the second coil conductor pattern.

Multilayer substrate and electronic device

A mounting substrate includes a resin layer and a first conductor including a contact surface in contact with the resin layer. The first conductor includes a first surface facing toward the mounting surface and a second surface on a side opposite to the first surface and extends in a direction parallel or substantially parallel to the mounting surface. The first conductor has a difference of a maximum value and a minimum value of a distance between the first surface and the mounting surface smaller than a difference of a maximum value and a minimum value of a distance between the second surface and the mounting surface. The resin layer includes a resin wall portion surrounding an opening portion partially exposing the first conductor on the mounting surface side, and the first conductor includes an exposed portion defining a mounting electrode.

Mounting substrate

A multilayer substrate includes a stacked body including a principal surface and insulating base material layers made of a thermoplastic resin that are stacked, and a coil including coil conductors. The coil includes a winding axis in a stacking direction. The coil conductors includes a first coil conductor closest to the principal surface, and a second coil conductor adjacent to or in a vicinity of the first coil conductor. The second coil conductor includes a wide portion of which a line width is larger than a line width of the first coil conductor. The wide portion includes an overlapping portion that overlaps with the first coil conductor, and a non-overlapping portion that does not overlap with the first coil conductor, when viewed from the stacking direction. The non-overlapping portion is curved to be closer to the principal surface than to the overlapping portion.

Multilayer substrate, actuator, and method of manufacturing multilayer substrate

A resin multilayer substrate includes a stacked body including resin layers, and a coil including coil conductor patterns provided on two or more resin layers. The coil conductor patterns include a coil conductor pattern including a parallel conductor portion. The parallel conductor portion includes linear conductor patterns connected in parallel that are parallel to each other, and is provided at least at a portion of an outermost peripheral portion of the coil conductor pattern. A total line width of the linear conductor patterns of the parallel conductor portion is larger than a line width of other portions of the coil conductor pattern.

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Nagaokakyo, Japan

Shingo Ito