Canon Kabushiki Kaisha

Shingo Ishiguri

Mitsutoshi Hasegawa

Takashi Sakaki

Kunihiko Minegishi

Shusuke Tobita

Yoshitomo Fujisawa

A printed circuit board includes an electronic component including a first base and a plurality of first lands, the first base including a first main surface, the plurality of first lands being disposed around a first portion of the first main surface and spaced from each other, a printed wiring board including a second base and a plurality of second lands, the second base including a second main surface, the plurality of second lands being disposed around a second portion of the second main surface and spaced from each other, bonding portions configured to bond the first lands and the second lands, a resin portion configured to cover the bonding portions and including cured thermosetting resin, and a member having a property to repel uncured thermosetting resin and disposed on one of the first portion and the second portion.

Method for manufacturing printed circuit board, printed circuit board, and electronic device

An electronic module includes an electronic part including a bottom surface and lands, the bottom surface including a first region and a third region surrounding the first region, the first lands being disposed in the third region, a printed wiring board including a main surface and second lands, the main surface including a second region and a fourth region surrounding the second region, the main surface facing the bottom surface of the electronic part, the second lands being disposed in the fourth region, solder bonding portions respectively bonding the first lands to the second lands, and a resin portion containing a cured product of a thermosetting resin and being in contact with the solder boding portions. A recess portion is provided in the second region. The resin portion is not provided in the recess portion.

Electronic module, electronic device, manufacturing method for electronic module, and manufacturing method for electronic device

An image pickup module includes a printed wiring board, an electronic component, solder, and a thermosetting resin. The printed wiring board has a first surface provided with first lands. The electronic component includes an image pickup element and has a second surface provided with second lands. The thermosetting resin is in contact with the solder and bonds the printed wiring board to the electronic component. The solder bonds the first lands to the second lands and has a hollow portion. The area of the hollow portion is 5% to 50% of the total area of the solder as observed from the electronic component side in a transmission mode using an X-ray.

Image pickup module, method for manufacturing image pickup module, and electronic device

A composite plastic lens including: a lens having a convex surface, a lens back surface, and a protrusion formed on at least part of an periphery; and a holder, the lens and the holder being molded integrally, wherein the cross-sectional shape of at least part of the lens including an optical axis on the convex surface side is such that a profile line on the convex surface side is curved in a direction getting closer to the lens back side as it goes from the optical axis side toward a turning point out of an optical effective area, and the cross sectional shape of the protrusion is inverted from the turning point out of the optical effective area toward the periphery in a direction away from the lens back surface, and the holder is fitted to the protrusion so as to include the turning point and is molded integrally on the peripheral side of the resin lens.

Growing community of inventors

Yokohama, Japan

Shingo Ishiguri