Tokyo Ohka Kogyo Co., Ltd.

Shingo Ishida

Takahiro Yoshioka

Yasumasa Iwata

Hirofumi Imai

Koki Tamura

Atsushi Kubo

Akihiko Nakamura

Yoshihiro Inao

Atsushi Miyanari

Yasushi Fujii

Shigeru Kato

Takahiro Setaka

A method for processing a mold material which includes a heating step of heating a mold material layer formed of the mold material to discharge gas from the mold material constituting the mold material layer.

Method for processing mold material and method for manufacturing structural body

A method of preparing a laminate, in which the laminate has a substrate and a support plate, and is provided with a release layer capable of being altered by irradiation with infrared ray, the method including forming the release layer on only a periphery of one of the substrate and the support plate; and laminating the substrate and the support plate through the release layer and a first adhesive layer.

Method of preparing laminate, and method of separating support

A bonding method including an adhesive layer forming process in which a thermoplastic adhesive is applied to a substrate or a support plate and an adhesive layer is formed; a heating process in which the adhesive layer that is formed on the substrate or the support plate is heated; and a bonding process in which the substrate and the support plate are pressed against each other via the heated adhesive layer, thereby bonding the substrate and the support plate.

Bonding method and bonding apparatus

An adhesive composition for temporarily attaching a substrate to a support plate which supports the substrate, including a thermoplastic resin and a release agent.

Adhesive composition, laminate, and stripping method

An adhesive composition for temporarily attaching a substrate to a support plate which supports the substrate, and includes a thermoplastic resin and a release agent.

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Kawasaki, Japan

Shingo Ishida