Citizen Watch Company, Ltd.

Shingo Ichikawa

Yoshihiro Ishida

Seiichi Mimura

Yoshihiro Shimada

Isao Yabe

Katsuji Komatsu

Kikuo Takenouchi

Hiroyuki Kaneko

Yoshio Iinuma

Hisashi Kawahara

Yoshinobu Kashima

Toshibumi Wakayama

Toyoharu Fujikawa

Toyoji Kanazawa

Hisataro Watada

Hiroshi Yanagawa

Hirotoki Takamune

Junichiro Shimizu

Takayuki Tajiri

Masayuki Ohi

A process of producing an IC card, the IC card having a card substrate and an IC module embedded therein, the card substrate having a single core sheet and first and second cover films laminated over the core sheet on the opposite sides, the process including the steps of forming an adhesive layer on the inside of each of the first and second cover films except a non-adhesive area in which the IC module is to be fitted; bonding the cover films to the opposite sides of the core sheet through the adhesive layers to form the card substrate having the non-adhesive area; cutting the non-adhesive areas of the card substrate along their outer peripheries to form a cavity for receiving the IC module; fitting the IC module into the cavity; and fixedly securing the IC module to the card substrate.

Process of producing IC cards

Electronic clinical thermometer

Heavy-load drive apparatus for an electronic watch

A semiconductor device has circuit patterns formed on upper and lower surfaces of a laminated board with both surfaces lined with copper and interconnected by through holes, an IC chip mounted on the upper pattern, and external connection terminals mounted on the lower pattern, the external connection terminals comprising copper core bumps. According to a method of manufacturing such a semiconductor device, the same etching process as pattern etching for forming the circuit pattern are effected in bump forming regions on the circuit pattern formed by the resist pattern.

Method of manufacturing semiconductor device with copper core bumps

A resin encapsulated pin grid array includes an IC chip mounted on a resin substrate having a plurality of contact pins on its lower surface and resin-encapsulated by injection molding. A metal heat radiating member is integrally formed on the upper surface of the encapsulating resin when the encapsulating resin is injection-molded.

Resin encapsulated semiconductor device

Resin encapsulated pin grid array and method of manufacturing the same

A method of making a resin encapsulated pin grid array includes an IC chip mounted on a resin substrate having a plurality of contact pins on its lower surface and resin-encapsulated by injection molding. A metal heat radiating member is integrally formed on the upper surface of the encapsulating resin when the encapsulating resin is injection-molded.

Method of making a resin encapsulated pin grid array with integral

A method of making a resin encapsulated pin grid array which includes an IC chip mounted on a resin substrate having a plurality of contact pins on its lower surface and resin-encapsulated by injection molding. A metal heat radiating member is integrally formed on the upper surface of the encapsulating resin when the encapsulating resin is injection-molded.

A device for packaging many memory IC chips having a plurality of common connecting terminals on a main circuit board. A plurality of IC chips are packaged on an auxiliary board to make an IC chip unit, and a plurality of IC chip units are aligned on the main circuit board. The connections between unit-connecting terminals provided on the respective IC chip units and the main circuit board are made by means of wiring patterns on the main circuit board.

IC package

An IC-packaged device comprises a lower plate which has wiring patterns at least on an upper surface; an upper plate which has upper surface wiring patterns and at least an opening hole and are superimposed on the lower plate when used; and a plurality of IC chips which has a lot of connecting terminal groups mounted on the upper plate. In this structure, some of the connecting terminal groups of the plurality of IC chips are wire-bonded to the wiring patterns on the upper plate, while the other of the connecting terminal groups of the plurality of IC chips pass through the opening hole in the upper plate and are wire-bonded directly to the wiring patterns on the lower plate.

IC-packaged device

An electronic timepiece includes a plurality of light-receiving elements arranged to receive external light, a light-receiving condition discriminator for discriminating a light-receiving condition of each light-receiving element, and a circuit to be controlled in response to an output signal from the light-receiving condition discriminator. The light-receiving condition discriminator discriminates that the light-receiving condition of a central one of three light-receiving elements among the plurality of light-receiving elements is different from those of end light-receiving elements, and thereupon generates an output signal.

Electronic timepiece

The invention concerns with an electronic timepiece provided with digital display means including an elastomeric display element. This element has an uppermost transparent and solid plate which is made of glass or plastic resin material, serving as a solid base member of the element durable to outside mechanical stresses and shocks. The thickness may amount to about 0.2-2 mm, or so. Transparent upper electrodes are provided at the lower surface of the glass or plastic resin plate, these electrodes being shaped and arranged in registration with the display segments of a scheduled display pattern. The thickness may be in the order of 500-2,000 A.

Electronic timepiece with digital display means

The invention resides in an improved time error measuring device or test bench for watches. The device includes a sensing microphone for sensing the stepping movement of the watch under test and in the form of a series of electric signal pulses. It further includes a range selector adapted for selecting a proper range depending upon the thus sensed stepping signal pulse series. Time error measuring means is utilized for detecting occasional time error of the watch by comparing the sensed stepping pulses with a standard clock pulse series and at the precision attributed to a selected measuring range. All these operations may be carried out in a fully automatic manner.

Growing community of inventors

Sayama, Japan

Shingo Ichikawa