Omron Corporation

Toray Industries, Inc.

Shingo Hayashi

Daisuke Konishi

Yuji Iyama

Takuji Kobayashi

Ryoichi Hane

Sachio Inaba

Akihisa Matsuyama

Keita Ebisawa

Beiping Jin

An object is to shorten time required for visual inspection. A visual inspection device () configured to inspect an appearance of an inspection object (), the visual inspection device () including: an imager () configured to image the inspection object () arranged at a predetermined position of the visual inspection device (); and a height measurer () configured to measure a height of the inspection object () carried into the visual inspection device () or carried out from the visual inspection device ().

External appearance inspection apparatus and external appearance inspection method

Provided are a measurement method, and a measurement device that enable measuring a deviation amount in an arrangement angle of a camera, with respect to a reference direction of a shaft of the camera, and that enable correcting a deviation in the arrangement angle at low cost with high accuracy. The measurement method includes: an imaging step of imaging a target object, provided with a reference mark configured to identify a slope-known straight line, a plurality of times in different visual fields; an image processing step of obtaining the straight line identified based on the reference mark where a plurality of the straight lines corresponds to a plurality of the reference marks in images imaged in the different visual fields, respectively; and a calculating step of calculating a rotation angle, as the deviation amount in the arrangement angle, with which a distance between the straight lines becomes zero.

Measurement method for amount of deviation, and measurement apparatus

Provided is a technique capable of more accurately determining a solder protruding defect in an appearance inspection device that acquires an image of an inspection region of an inspection target and measures a height of a predetermined place in the inspection region with a height measurement device. The appearance inspection device includes: an imaging unit (); a height measurement unit (); a moving mechanism () that moves the imaging unit () and the height measurement unit (). When a restricted region (M) in the inspection target is irradiated with the measurement light emitted from the height measurement unit (), the determination unit restricts defect determination based on the information on the height of the predetermined place measured by the height measurement unit ().

Appearance inspection device and defect inspection method

A position measurement method is used by a device including an imaging unit and a position detector that detects a position of the imaging unit to measure, using a detection value at imaging of a measurement point, position coordinates of the measurement point. The method for correcting the detection value from the position detector includes obtaining, with the device, position coordinates of predetermined indices () arranged two-dimensionally on a calibration plate () as an actual measurement value, obtaining, as a correction value, a difference between the actual measurement value and a true value resulting from transformation of position coordinates of the indices () with respect to a reference point on the calibration plate (), and correcting the detection value from the position detector (). The imaging unit () images measurement points (P) on the measurement target () to measure position coordinates of the measurement points (P).

Position measurement method using a calibration plate to correct a detection value from the position detector

Provided is a method for more accurately correcting position coordinates of a point on an object to be imaged, the coordinates being identified based on values detected by linear scales. A visual field is moved to a measurement point defined on a recessed portion formed on a calibration plate, and an image is captured (step S-), edges are detected from an image of sides of the recessed portion (step-), an intersection of the edges is calculated (step S-), values of the intersection as actually measured by the linear scales are saved (step S-), and position coordinates of the point on the object to be imaged as detected by the linear scales are corrected by using a true value and a difference.

Method for correcting values detected by linear scales

A visual inspection device and a method for setting illumination condition thereof are provided to include an illumination part irradiating illumination lights to an inspection object; an imaging part capturing an image of the inspection object; a defect detecting part analyzing the image of the inspection object captured by the imaging part and detecting a defect of the inspection object; an illumination condition setting part setting an illumination condition of the illumination lights irradiated to the inspection object; and an optimum illumination condition deriving part deriving an optimum illumination condition by scoring each of the illumination conditions based on the images captured under plural and different illumination conditions, where the optimum illumination condition is the most suitable illumination condition for detecting the defect of the inspection object by the defect detecting part.

Visual inspection device and illumination condition setting method of visual inspection device

A fiber sheet is densely charged with electric charge and provides an electret fiber sheet that has excellent dust collecting performance. The electret fiber sheet is an electret fiber sheet in which averages of a* values and b* values satisfy all requirements of the following (a) to (c): (a) 10&#x2264;average of (a* values)&#x2264;40; (b) &#x2212;25&#x2264;average of (b* values)&#x2264;0; and (c) &#x2212;5&#x2264;average of [(a* values)+(b* values)]&#x2264;40; wherein a* and b* are values measured by a spectrophotometer when a red positive charge toner and a blue negative charge toner are attached.

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Otsu, Japan

Shingo Hayashi