Mitsubishi Plastics, Inc.

Other

Sony Corporation

Mitsubishi Chemical Corporation

Mitsubishi Plastics Industries Limited

Shingetsu Yamada

Shuuji Suzuki

Minoru Ogawa

Masahiro Izumi

Hiroo Kurosaki

Shigeyasu Itoh

Jun Takagi

Kouichirou Taniguchi

Jun Matsui

Kaoru Nomoto

Yoshihito Sato

Nobuhiro Arai

Hideo Yamano

Kouji Kondo

Toshiyuki Akitake

Kazuya Sanada

Toshihiro Miyake

Koichiro Taniguchi

Makoto Totani

The invention provides a metal substrate and a light source device ensuring that a semiconductor chip working as a light source can be firmly joined by using a metal joining material, such that heat generated in the mounted semiconductor chip can be efficiently dissipated through a metal plate. The metal substrate includes a heat dissipating metal plate made of a metal except for Au, an insulating resin-made white film stacked on a part of the heat dissipating metal plate, and a light source mounting surface-forming layer stacked on another part of the heat dissipating metal plate. The metal substrate is such that the light source mounting surface-forming layer is a metal layer directly contacting the heat dissipating metal plate, and the light source mounting surface is a surface of an Au layer which is the outermost layer of the light source mounting surface-forming layer.

Metal substrate and light source device

The present invention provides a white film comprising a thermoplastic resin composition containing 25-100 parts by mass of an inorganic filler based on 100 parts by mass of a thermoplastic resin, wherein the average reflectance at a wavelength of 400-800 nm is 70% or more, the average linear expansion coefficient in the machine direction and the transverse direction is 35&#xd7;10/&#xb0; C. or less, and the decreasing rate in reflectance at a wavelength of 470 nm after thermal treatment at 200&#xb0; C. for 4 hours is 10% or less; and the invention provides a metal laminated body. These exhibit high thermal resistance, high reflectance within visual light range, and small decrease in reflectance under a high heat load environment, but also be applicable for a large sized printed circuit boards for mounting LEDs.

Metal laminated body, LED-mounted substrate, and white film

A multilayer printed circuit board is characterized in that circuit boardsandand a circuit boardare laminated alternately to form a multilayer body using a simultaneous lamination method, the circuit boardsandincluding a film-, thin plate-, or sheet-like insulating substratemade of a thermosetting resin containing any one of epoxy resin, bismaleimide/triazine resin, and allylic polyphenylene ether resin as a major component, the circuit boardincluding a film-, thin plate-, or sheet-like insulating substratemade of a thermoplastic resin containing a polyaryl ketone resin and amorphous polyether imide resin having a crystal-fusing peak temperature of 260&#xb0; C. or more. By the present invention, it is possible to provide a multilayer printed circuit board which has small fusion or flow deformation at the time of simultaneous lamination, which does not have unevenness in positional precision in the lamination direction, which has no need for the processes to be readjusted, and which has high reliability in interlayer electrical connection.

Multilayer printed circuit board

A method of manufacturing a, in order to accommodate the words range and to clarify the multilayer wiring board, grooves for forming a wiring circuit and via holes are formed in an insulating substrate formed from a thermoplastic resin composition comprising a polyarylketone resin with a crystalline melting peak temperature of at least 260&#xb0; C. and an amorphous polyetherimide resin as the primary constituents, a metallic foil is embedded within the grooves so that the surface of the foil protrudes to the surface of the insulating substrate, and a conductive material formed by curing a conductive paste is used for filling the via holes.

Method of manufacturing multilayer wiring board

The present invention provides a semiconductor device integrated multilayer wiring board with a high degree of heat resistance, which is capable of low temperature fusion without the occurrence of resin flow, enables high precision, finely detailed conductive wiring, thereby enabling the production of high density, ultra small three dimensional mounting modules and the like, can also be ideally applied to low volume high mix manufacturing configurations, and has little impact on the environment, and also provides a method of manufacturing such a semiconductor device integrated multilayer wiring board. In the semiconductor device integrated multilayer wiring board, a wiring substrate is formed by embedding conductive wiring within an insulating substrate, formed from a thermoplastic resin composition comprising a polyarylketone resin with a crystalline melting peak temperature of at least 260&#xb0; C. and an amorphous polyetherimide resin as primary constituents, so that the surface of the wiring protrudes to the surface of the resin, and a plurality of these wiring substrates are laminated together, IC chips are mounted onto some of the wiring substrates, the insulating substrates of the wiring substrates are bonded together by thermal fusion, and the conductive wiring of each of the wiring substrates, and the wiring electrically connecting the wiring substrates together, is formed from a conductive material produced by curing a conductive paste.

Semiconductor device integrated multilayer wiring board

A heat resistant resin composition comprising 70 to 30 wt % of a crystalline polyarylketone resin having a peak crystalline melting temperature of 260&deg; C. or higher and 30 to 70 wt % of a noncrystalline polyetherimide resin, wherein said composition has at least 2 peaks of loss tangent (tan &dgr;) between 140&deg; C. and 250&deg; C., determined by dynamic mechanical measurement.

Heat resistant resin composition, a heat resistant film or sheet thereof and a laminate comprising the film or the sheet as a susbstrate

A multilayer wiring board with a high degree of heat resistance, which is capable of low temperature fusion without the occurrence of resin flow, enables high precision, finely detailed conductive wiring, can be ideally applied to low volume high mix manufacturing configurations, and also has little impact on the environment is provided, together with a semiconductor device mounting board using such a multilayer wiring board, and a method of manufacturing such a multilayer wiring board. In the multilayer wiring board, grooves for forming a wiring circuit and via holes are formed in an insulating substrate formed from a thermoplastic resin composition comprising a polyarylketone resin with a crystalline melting peak temperature of at least 260&deg; C. and an amorphous polyetherimide resin as the primary constituents, a metallic foil is embedded within the grooves so that the surface of the foil protrudes to the surface of the insulating substrate, and a conductive material formed by curing a conductive paste is used for filling the via holes.

Multilayer wiring board, semiconductor device mounting board using same, and method of manufacturing multilayer wiring board

Method of manufacturing three-dimensional printed wiring board

Heat-resistant insulating film, raw substrate for printed wiring board using the same and method for producing the substrate

A magneto-optical recording medium has on the substrate a recording layer made of a multi-layered metallic thin film comprising a first unit layer and a second unit layer. The first unit layer is composed of (Fe.sub.x Co.sub.1-x).sub.1-y M.sub.y where M represents at least one metal selected from the group consisting of Pt, Pd and Au, 0.5.ltoreq..times..ltoreq.1.0, and 0.01.ltoreq.y.ltoreq.0.1. The second unit layer is composed of a% least one metal selected from the group consisting of Nd, Dy, Gd and Tb. The first and second unit layers are superimposed alternately one on another.

Magneto-optical recording medium and method for production thereof

Growing community of inventors

Nagahama, Japan

Shingetsu Yamada