Nan Ya Printed Circuit Board Corporation

Antig Technology Co., Ltd.

Shing-Fun Ho

Yung-Yi Liu

James Shang

Yi-Chen Chen

Hsien-Chieh Lin

Kuo-Chun Chiang

Tsang-Ming Chang

Feng-Yi Deng

Hsi-Ming Shu

Wei-Hsin Lin

Yi-Tang Weng

Chin-Yi Chuang

Hsing-Lun Lo

Cheng-Hung Huang

Hung-En Hsu

Guo-Shau Luo

Binwei Wang

A package structure that includes a first redistribution structure and a second redistribution structure is provided. The first redistribution structure includes a first dielectric layer, and a first redistribution circuit in the first dielectric layer. The second redistribution structure includes a first portion on the first redistribution structure and a second portion on the first portion, and each of the portions is electrically connected to the first redistribution structure and the first portion, respectively. The circuit density of the second portion is lower than that of the first portion. The first portion includes a second dielectric layer having a second redistribution circuit therein. The second portion includes a third dielectric layer having a third redistribution circuit therein. The third dielectric layer has a stiffener layer, which is separated from the third redistribution circuit by the third dielectric layer. A method of forming a package structure is also provided.

Package structure and method of forming the same

A structure of an integrated packed fuel cell including an integrated cathode electrode sheet that further includes a substrate, at least a cathode electrode area, and at least a conductive opening, an intermediate bonding layer that further includes at least a bonding sheet and at least a conductive opening, an integrated anode electrode sheet that further includes a substrate, at least an anode electrode area, at least a conductive pad, a device combination, and a fuel container base.

Structure of integrated packed fuel cell

A novel flat panel DMFC (direct methanol fuel cell) includes an integrated cathode electrode plate, a membrane electrode assembly (MEA) unit, an intermediate bonding layer, an integrated anode electrode plate, and a fuel container. The integrated cathode and anode electrode plates are manufactured by using PCB compatible processes. The integrated cathode and anode electrode plates have embedded metal layout and improved heat dissipation capability.

Method for manufacturing a flat panel direct methanol fuel cell

A lot traceable printed circuit board (PCB) includes a substrate having thereon a patterned circuit layer and a working zone carrying production information related to the PCB itself. The working zone includes a plurality of code boxes, wherein each of the code boxes has a first probe region and second probe region. A single set of resistance test loop is disposed within the first probe region. Four sets of resistance test loops are disposed within the second probe region. A frying probe tester is used to probe the set of resistance test loops respectively for abstracting the production information recorded in the working zone.

Lot traceable printed circuit board

A flat panel direct methanol fuel cell (DMFC) includes an integrated cathode electrode plate, a set of membrane electrode assemblies, an intermediate bonding layer, an integrated anode electrode plate, and a fuel container base. The integrated cathode/anode electrode plates are conducive to mass production, and are manufactured by using PCB compatible processes.

Method of fabricating a flat panel direct methanol fuel cell

A Chip-in Substrate Package (CiSP) includes a double-sided metal clad laminate including a dielectric interposer, a first metal foil laminated on a first side of the dielectric interposer, and a second metal foil laminated on a second side of the dielectric interposer. A recessed cavity is etched into the second metal foil and the dielectric interposer with a portion of the first metal foil as its bottom. A die is mounted within the recessed cavity and makes thermal contact with the first metal foil. A build-up material layer covers the second metal foil and an active surface of the die. The build-up material layer also fills the gap between the die and the dielectric interposer. At least one interconnection layer is provided on the build-up material layer and is electrically connected with a bonding pad disposed on the active surface of the die via a plated through hole.

Embedded chip package with improved heat dissipation performance and method of making the same

The present invention provides a method of manufacturing a double-sided printed circuit board. An insulation substrate is first formed by creating a plurality of through holes on a Copper Clad Laminate (CCL) whose copper foil surface has been removed. Next, an electro-less copper layer is plated on the substrate for forming a plurality of plated through holes. After a wire pattern is formed on the substrate, a solder preventive layer is formed on top of the wire pattern. Next, a plurality of openings is created in between the solder preventive layer for exposing the contact pads. Finally, a protective layer is plated on top of the contact pads.

Method of manufacturing double-sided printed circuit board

A packaging substrate is fabricated using two plating steps for respectively plating the gold-plating areas defined on two opposite sides of the substrate. Before plating, the gold-plating areas are defined by a layer of solder mask. By doing this, the plated gold layer will not overlap with the solder mask, thereby preventing peeling or reliability problems.

Growing community of inventors

Taipei, Taiwan

Shing-Fun Ho