Taiwan Semiconductor Manufacturing Comp. Ltd.

Shine Chen

Jiun-Rong Pai

Hsu-Shui Liu

Yang-Ann Chu

Tsung-Sheng Kuo

Chieh-Chun Lin

In certain embodiments, a system includes: an inspection station configured to receive a die vessel, wherein the inspection station is configured to inspect the die vessel for defects; a desiccant station configured to receive the die vessel from the inspection station, wherein the desiccant station is configured to add a desiccant to the die vessel; a bundle station configured to receive the die vessel from the desiccant station, wherein the bundle station is configured to combine the die vessel with another die vessel as a die bundle; and a bagging station configured to receive the die bundle from the bundle station, wherein the bagging station is configured to dispose the die bundle in a die bag and to heat seal the die bag with the die bundle inside.

Growing community of inventors

Hsin-Chu, Taiwan

Shine Chen