Skhynix Inc.

Magnachip Semiconductor, Inc.

Shin Young Park

Dong Hyun Kim

Seung Hwan Kim

Hyeong Seok Choi

Hyun Chul Seo

Kyeong Su Kim

Jae Jin Lee

Ki Jun Bang

Sang Jae Kim

Disclosed are a semiconductor package and a manufacturing method thereof. Semiconductor chips may be disposed on a package substrate with vent holes formed therethrough, and a molding layer including a lower molding portion connected to an upper molding portion may be formed. The package substrate may include a substrate body with a plurality of unit regions, ball lands disposed in the unit regions, and first and second dam patterns that cross the unit regions and extend into edge regions, which is outside of the unit regions.

Semiconductor packages including dam patterns and methods for manufacturing the same

A semiconductor device includes: a lower structure; a redistribution insulating layer disposed over the lower structure; a redistribution conductive layer disposed over the redistribution insulating layer and electrically connected to a part of the lower structure, the redistribution conductive layer including a redistribution pad; and a protective layer covering the redistribution insulating layer and the redistribution conductive layer while leaving the redistribution pad exposed. The redistribution conductive layer includes a trench disposed adjacent to the redistribution pad, and a part of the protective layer fills the trench.

Semiconductor device including redistribution layer and method for fabricating the same

A semiconductor device includes a semiconductor chip body having a surface on which a chip pad is disposed, a passivation layer covering the surface of the semiconductor chip body and providing a tapered hole revealing the chip pad, and a redistributed layer (RDL) structure disposed on the passivation layer. The RDL structure includes a first RDL interconnection portion spaced apart from the tapered hole and passing by the tapered hole and a second RDL overlapping pad portion configured to have a bottom portion contacting the revealed chip pad and configured to have a first side surface facing a side surface of the first RDL interconnection portion. A central portion of the first side surface of the second RDL overlapping pad portion extends toward the side surface of the first RDL interconnection portion such that the first side surface is curved.

Semiconductor devices including redistributed layer structures and methods of forming semiconductor devices including redistributed layer structures

A semiconductor package attached to a curved display panel includes a semiconductor chip, having a top surface and a bottom surface, disposed on a curved flexible film, wherein the curved flexible film is disposed on the curved display panel, a flexible cover layer attached to the top surface of the semiconductor chip, and an underfill material formed between the semiconductor chip and the curved flexible film, and wherein the top surface of the semiconductor chip is planar.

Growing community of inventors

Suwon-si, South Korea

Shin Young Park