Hon Hai Precision Industry Co., Ltd.

Shin-Ting Yen

Shou-Kuo Hsu

Yung-Chieh Chen

Hsien-Chuan Liang

Shen-Chun Li

Cheng-Hsien Lee

Dan-Chen Wu

Chun-Neng Liao

Duen-Yi Ho

Po-Chuan Hsieh

Hung Chao

Chun-Jen Chen

Tsung-Sheng Huang

Wei-Chieh Chou

Chien-Hsun Chen

Jia-Chi Chen

An equalizer includes a circuit board and a compensation module. The compensation module includes first and second transmission lines, first to fourth resistors, and first to fourth micro-strips. Two vias extend through the circuit board and are grounded. First terminals of the first and second resistors are electrically connected to the ground layer through the first via. First terminals of the third and fourth resistors are electrically connected to the ground layer through the second via. A second terminal of the first resistor is electrically connected to the first transmission line through the first micro-strip, and is further electrically connected to a second terminal of the second resistor through the second micro-strip. A second terminal of the third resistor is electrically connected to the second transmission line through the third micro-strip, and is further electrically connected to a second terminal of the fourth resistor through the fourth micro-strip.

Equalizer for loss-compensation of high-frequency signals generated in transmission channels

A motherboard includes a printed circuit board (PCB), a central processing unit (CPU), a regulator, a first memory adaptor, and a second memory adaptor. The PCB includes a top surface, a bottom surface, a plurality of first soldering pads and first leads arranged on the top surface, and a plurality of second leads arranged between the top surface and the bottom surface. The PCB defines a plurality of first vias, second vias, and power vias. The CPU is connected to the first vias. The voltage regulator is connected to the power vias. The first memory adaptor neighbors to the regulator and is surface-mount soldered to the first soldering pads. The first soldering pads are connected to the first vias by first leads. The second memory adaptor is soldered to the second vias. The second vias are connected to the first vias by the second leads.

Motherboard capable of reducing electromagnetic interference

An exemplary port reducing method is for removing unselected ports of an original S-parameter file and generating an optimized S-parameter file. The method controls a display unit to display a user interface to receive commands from a user in response to user operation; the commands comprise a calling command, a selecting command, and an executing command. The method obtains the original S-parameter file in response to the calling command. Next, the method determines which of the ports of the original S-parameter file are unselected in response to the selecting command, and connects each unselected port to the ground through one terminal impedance. The method then generates an optimized S-parameter file that comprises only the selected ports in response to the executing command.

Electronic device and port reducing method

A printed circuit board includes a first signal layer, a first reference layer, a second signal layer, and a third signal layer in that order and includes a first slanted via and a second slanted via. The first signal layer includes an parallel first transmission wire and a second transmission wire. The first and second transmission wires are coupled with each other and cooperatively constitute a first differential pair with an edge-coupled structure. The second signal layer includes a third transmission wire. The third signal layer includes a fourth transmission wire parallel to and coupled with the third transmission wire. The third and fourth transmission wires cooperatively constitute a second differential pair with a broadside-coupled structure. The first slanted via obliquely are interconnected between the first transmission wire and the third transmission wire. The second slanted via obliquely are interconnected between the second transmission wire and the fourth transmission wire.

Printed circuit board

A method of generating electrical rule file for circuit board by using an electronic device. The electronic device acquires a component file, a wiring file, a wiring group file, a first electrical rule file, and a second electrical rule file from a storage device. The electronic device integrates the component file and the wiring file to be an integrated file according to wire names, acquires group names and inserts the group names into the integrated file according to the wire names, acquires first electrical rules and inserts the first electrical rules into the integrated file according to the group names, acquires second electrical rules and inserts the second electrical rules into the integrated file according to the group names, to complete the integrated file, and saves the completed file to the storage device.

Electronic device and method for generating electrical rule file for circuit board

An electronic device and method of automatically testing the transmission lines of a PCB. Design requirements of transmission lines are predetermined and a wiring diagram is acquired according to a designated wiring diagram storage path. Some basic parameters of each transmission line of the diagram are applied in excluding one or more transmission lines which may not meet the design requirements, then, the excluded transmission lines are marked and/or highlighted. A report of the transmission lines is generated using a report template.

Electronic device and method of automatically testing transmission lines

An electronic device reads a layout file of a printed circuit board (PCB) to be manufactured from a storage device, obtains length information and section area information of copper cladding distributed on power source areas and ground trace areas in each of one or more layers of the PCB to be manufactured by analyzing the layout file, and calculates power loss in each of the one or more layers according to the length information, the section area information, a resistance value of the copper cladding, and preset parameters of a power supply module and an integrated circuit (IC) load to be located on the PCB. In response to a determination that the power loss in the layer exceeds a preset range, the electronic device indicates the locations of the power source areas and the ground trace areas of a layer in the PCB layout file which need to be redesigned.

Electronic device and simulation method for checking printed circuit board power loss

A reversing transmission includes a shaft, a retainer, a spacing collar, reversing members, two gears and two covers. The holder is sleeved on the shaft with spaced sliding notches formed thereon. The spacing collar is mounted on an outer surface of the retainer. The reversing members each include two spaced swing plates, with two reversed spiral teeth dented on two diagonal half surfaces of the two spaced swing plates. The reversing members slide into the sliding notches of the holder, with the two swing plates of each reversing member distributed at different sides of the spacing collar. Each of the gears has a group of spiral teeth formed on the inner side for engaging with the group of spiral teeth of the reversing members, and cogs formed on the outer circumference surface. The covers are mounted on two opposite ends of the holder to keep the reversing members in position.

Reversing transmission

A computing system includes a drawing unit and a layout unit. The computing system sets components parameters to components of a circuit diagram of a printed circuit board (PCB). The drawing unit draws the circuit diagram by using the components with the components parameters. If the drawing unit wants to use a component more than once, the computing system copies the component and the corresponding components parameters. The drawing unit uses the copied components and the corresponding parameters. If the circuit diagram has been drawn, the layout unit loads the circuit diagram and wires the PCB according to the components and the components parameters in the circuit diagram.

Printed circuit board layout system and method

A printed circuit board includes a high-speed differential signal control chip, first to eighth coupling capacitor pads, first to fourth connector pads, a first transmission line, a second transmission line, a third transmission line, a fourth transmission line, first to eighth transmission lines, two ninth transmission lines, first and second vias, and first to fourth sharing pads. The printed circuit board is operable to selectively support multiple connectors.

An electronic device and method for inspecting electrical rules of circuit boards includes selecting at least two design files that record electrical rules of the circuit boards and searching the electrical rules in the selected design files using preset parameter keywords. Same electrical rules of the selected design files are acquired by comparing the electrical rules in the selected design files. The same electrical rules and corresponding parameter values are input to a comparison table, and the comparison table is output.

Electronic device and method for inspecting electrical rules of circuit boards

A printed circuit board (PCB) with compound via includes a substrate and a pair of through holes passing through the substrate. The substrate includes a signal layer which is the top layer of the substrate, a first reference layer adjacent to the signal layer, and a second reference layer not adjacent to the signal layer. A first and a second pair of pads are mounted on the signal layer. Each of the through holes extends through the first pair of pads such that the through hole and the first pair of pads jointly form a compound via. A first reserved opening is formed on the first reference layer and corresponds to the first and the second pair of pads and the compound via. A second reserved opening is formed on the second reference layer and surrounds the through hole thereon.

Printed circuit board with compound via

A bearing includes a main body, a plurality of first magnetic members, a plurality of second magnetic members, and a plurality of friction members. The main body defines a pivot hole, and a plurality of first receiving portions and a plurality of second receiving portions around the pivot hole. Each of the second receiving portions defines a cutout. The first magnetic members are received in the first receiving portions. The second magnetic members together with the friction members are received in the second receiving portions, thus generating a repelling force between the first magnetic members and the second magnetic members to impel the friction members to partially extend out of the cutouts.

Bearing

A printed circuit board can support different connectors by selectively setting connection components on the printed circuit board without changing wiring of transmission lines or making new vias in the printed circuit board.

A computer motherboard includes a printed circuit board which includes a central processing unit (CPU) socket and a group of memory slots. The group of memory slots includes an in-line type memory slot and a surface mounted device (SMD) type memory slot. The in-line type memory slot includes a number of plated through holes. The SMD type memory slot is set between the in-line type memory slot and the CPU socket. The through holes of the in-line type memory slot are connected to the CPU socket through traces, pads of the SMD type memory slot are connected to corresponding through holes of the in-line type memory slot having the same pin definition.

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Tu-Cheng, Taiwan

Shin-Ting Yen