Hitachi Chemical Company, Ltd.

Showa Denko Materials Co., Ltd.

The Yokohama Rubber Co., Ltd.

Hitachi, Condenser Co., Ltd.

Shin Takanezawa

Hikari Murai

Tomohiko Kotake

Masato Miyatake

Shintaro Hashimoto

Koji Morita

Shunsuke Nagai

Yasuo Inoue

Takako Watanabe

Shinji Tsuchikawa

Kiyoshi Hasegawa

Kenji Takai

Norio Moriike

Katsuyuki Masuda

Hiroshi Takahashi

Kenichi Kamiyama

Toshihisa Kumakura

Kazunaga Sakai

Hiroshi Yokota

Teiichi Inada

Yoshiyuki Tsuru

Hiroyuki Izumi

Toshiro Okamura

Nobuyuki Ogawa

Yorio Iwasaki

Hiroyuki Fukai

Norihiko Sakamoto

Hiroyoshi Yokoyama

Masao Kanno

Masaki Morita

Hiroaki Fujita

Katsuhiko Nawate

Kouji Morita

Shinichiro Abe

Hideo Watanabe

Yoshitaka Hirata

Akishi Nakaso

Kazunori Yamamoto

Yasuyuki Mizuno

Naoki Fukutomi

Yasushi Shimada

Yasushi Kumashiro

Hiroyuki Kuriya

Kazumasa Takeuchi

Yuusuke Kondou

Kazuhisa Otsuka

Hajime Yamazaki

Hiroyuki Wakamatsu

Tetsurou Irino

Masaharu Matsuura

Kiyoshi Nakao

Takashi Yamadera

Takahiro Tanabe

Takako Ejiri

Toshinobu Takahashi

Toshirou Okamura

Hitoshi Onozeki

Teturou Irino

Naohiro Morozumi

Konatsu Nakamura

Shuuichi Hatakeyama

Tatsuya Amano

Noriyoshi Fukuoka

Saburo Amano

Hiroshi Takaahashi

Yuuji Toshaka

Takashi Kagaya

The present invention provides a prepreg for a coreless substrate and a coreless substrate and a semiconductor package using the prepreg, which can satisfy heat resistance, low thermal expansion, and bonding strength with a metal circuit at a level required for the coreless substrate. Specifically, the prepreg for a coreless substrate contains a thermosetting resin composition containing (a) dicyandiamide, (b) an adduct of a tertiary phosphine and quinones, (c) an amine compound having at least two primary amino groups, and (d) a maleimide compound having at least two primary amino groups having at least two N-substituted maleimide groups. Instead of (c) the amine compound having at least two primary amino groups and (d) the maleimide compound, having at least two N-substituted maleimide groups, (X) an amino-modified polyimide resin obtained by reacting them may be used.

Prepreg for coreless substrate, coreless substrate and semiconductor package

Provided is an interlayer insulating film for a multi-layered printed wiring board, including a wiring embedding layer (A) obtained by forming a thermosetting resin composition (I) into a layer, and an adhesion assisting layer (B) obtained by forming a thermosetting resin composition (II) into a layer, in which the interlayer insulating film contains a residual solvent in an amount of 1% to 10% by mass in a total amount of the wiring embedding layer (A) and the adhesion assisting layer (B), and the residual solvent contains an organic solvent having a boiling point of 150&#xb0; C. to 230&#xb0; C. in an amount of 10% by mass or more in a total amount of the residual solvent.

Interlayer insulating film and method for producing same

There are provided a modified silicone compound prepared by reacting: (A) a siloxane diamine represented by the general formula (1); (B) a maleimide compound with at least two N-substituted maleimide groups in the molecular structure; and (C) an amine compound with an acidic substituent; and also provided a thermosetting resin composition, a prepreg, a laminated plate, and a printed wiring board that are formed by using this compound. The multi-layered printed wiring board produced by using the laminated plate formed by using the prepreg obtained from the modified silicone compound and the thermosetting resin composition of the present invention through laminate molding has an excellent glass transition temperature, coefficient of thermal expansion, copper foil adhesion, hygroscopicity, hygroscopic solder heat resistance, and copper-stuck solder heat resistance. Therefore, the multi-layered printed wiring board is useful as a highly integrated semiconductor package and a printed wiring board for an electronic device. 

Modified silicone compound, and thermosetting resin composition, prepreg, laminate plate and printed wiring board using same

By producing a resin composition containing (A) an epoxy resin having two or more epoxy groups in one molecule thereof and containing a hexanediol structure, (B) an ultraviolet ray active ester group-containing compound, and (C) an epoxy resin curing accelerator, even in a state where an irregular shape of the surface of an insulating resin layer is small, a high adhesive force to a wiring conductor can be easily revealed.

Support-provided insulating layer, laminate, and wiring board

The present invention provides a prepreg for a coreless substrate including a thermosetting resin composition containing (a) (meth)acrylic elastomer, (b) an amine compound having at least two primary amino groups, and (c) a maleimide compound having at least two N-substituted maleimide groups, and a coreless substrate using the same, a method of manufacturing the coreless substrate, and a semiconductor package.

Coreless substrate prepreg, coreless substrate, coreless substrate manufacturing method and semiconductor package

The invention provides a varnish produced through reaction between a compound having an amino group and a resin having a functional group capable of reacting with an amino group, and having a polycyclic structure, wherein a portion of a plurality of the functional group of the resin is caused to react with the amino group of the compound in a solvent, and also a varnish produced through reaction between a compound having a phenolic hydroxyl group and a resin having a functional group capable of reacting with a phenolic hydroxyl group, and having a polycyclic structure, wherein a portion of a plurality of the functional group of the resin is caused to react with the phenolic hydroxyl group of the compound in the solvent. The invention also provides a prepreg, a resin-coated film, a metal-foil-clad laminate, and a printed wiring board produced by use of any of the varnishes.

Varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit board

A siloxane compound containing structures represented by the following general formulae (1) and (2): wherein Rand Rindependently represent a hydrogen atom, a halogen atom, an alkyl group having from 1 to 3 carbon atoms, a halogenated alkyl group, a thiol group, an acetyl group, a hydroxyl group, a sulfonic acid group, a sulfoalkoxyl group having from 1 to 3 carbon atoms, or an alkoxyl group having from 1 to 3 carbon atoms; x and y independently represent an integer of from 0 to 4; and A represents a single bond or an azomethine group, an ester group, an amide group, an azoxy group, an azo group, an ethylene group, or an acetylene group, and wherein Rand Rindependently represent an alkyl group, a phenyl group, or a substituted phenyl group; and n represents an integer of from 1 to 100.

Siloxane compound, modified imide resin, thermosetting resin composition, prepreg, film with resin, laminated plate, multilayer printed wiring board, and semiconductor package

A thermosetting resin composition containing: (A) a resin composition having an unsaturated maleimide group, produced by reacting (a) a maleimide compound having at least two N-substituted maleimide groups per one molecule and (b) an amine compound having at least two primary amino groups per one molecule, in an organic solvent; (B) a thermosetting resin; and (C) a modified imidazole compound, such as an isocyanate-masked imidazole and an epoxy-masked imidazole, and a prepreg, an insulating film with a support, a laminate plate and a printed wiring board, each containing the same.

Thermosetting resin composition, and prepreg, insulating film with support, laminate plate, and printed wiring board, each obtained using same

There are provided a resin composition including: (a) a maleimide compound with at least two N-substituted maleimide groups per molecular structure; and (b) a silicone compound with at least one amino group per molecular structure and also provided a prepreg, a laminated plate, and a printed wiring board that are formed by using this resin composition. The multi-layered printed wiring board produced by using the laminated plate produced by laminating and molding the prepreg obtained from the resin composition of the present invention has excellent glass transition temperature, coefficient of thermal expansion, solder heat resistance, and warp characteristics. The multi-layered printed wiring board is useful as a highly integrated printed wiring board for an electronic device.

Resin composition, and printed wiring board, laminated sheet, and prepreg using same

Disclosed is a prepreg including a fiber substrate and a layer made of a thermosetting resin composition, wherein the layer made of a thermosetting resin composition contains a modified silicone oil or a compound having a skeleton derived from a modified silicone oil, and the layer made of a thermosetting resin composition has a phase separation structure. A prepreg having excellent low thermal expansion properties and warpage characteristics which are difficult to be realized by using only a conventional resin which is effective for highly filling an inorganic filler or has a low coefficient of thermal expansion, and a laminate using the same, and a printed wiring board can be provided.

Prepreg, laminate obtained with the same and printed-wiring board

Disclosed is a resin composition which is advantageous not only in that the resin composition can be produced at low cost, but also in that it is unlikely to thermally expand, and a prepreg, a laminate, and a wiring board formed using the resin composition. The resin composition comprises an insulating resin having an aromatic ring, wherein the insulating resin having an aromatic ring has a molecular weight between crosslinking sites of 300 to 1,000 on the stage after the production of the laminate, as determined from an elastic shear modulus of the insulating resin measured at a temperature of Tg or higher.

Resin composition, prepreg, laminate, and wiring board

The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 &#x3bc;m. The invention also relates to a printed wiring board being a multilayer wiring board having a plurality of layers, wherein an adhesion assisting agent layer is formed between insulating layers.

Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board

Disclosed are a resin composition containing (a) a maleimide compound having at least two N-substituted maleimide groups in a molecular structure and (b) a silicone compound having at least one reactive organic group in a molecular structure thereof; and a prepreg using the same, a laminate, and a printed wiring board. A resin composition having excellent heat resistance and low thermal expansion properties; and a prepreg, a laminate, and a printed wiring board using the same can be provided.

Resin composition, prepreg laminate obtained with the same and printed-wiring board

Growing community of inventors

Ibaraki, Japan

Shin Takanezawa