Fuji Electric Co., Ltd.

Fuji Electric Device Technology Co., Ltd.

Fuji Electric Systems Co. Ltd.

Honda Motor Co., Ltd.

Aisin Aw Co., Ltd.

Shin Soyano

Akira Morozumi

Noriho Terasawa

Yoshikazu Takamiya

Keiichi Higuchi

Kenji Suzuki

Yoshikazu Takahashi

Takahiro Koyama

Akira Nishiura

Toshifusa Yamada

Daisuke Inoue

Susumu Toba

Yoshinari Ikeda

Hiroshi Otsuka

Toru Yamada

Hiromichi Gohara

Tomohiro Fukazu

Takeshi Ichimura

Ryo Maruyama

Kosuke Nishiyama

Masahiro Kikuchi

Eiji Mochizuki

Katsumichi Ueyanagi

Masaki Ono

Kazuo Aoki

Hayato Nakano

Seiki Igarashi

Seiji Yasui

Yuki Inaba

Junji Tsuruoka

Manabu Watanabe

Daiki Yoshida

Akihiro Osawa

Yasushi Kabata

Etsuo Arai

Yoshikazu Takayima

Semiconductor module

A semiconductor device includes a printed circuit board in a peripheral portion of a housing portion of a case in which a laminated substrate is housed. A terminal block holding control terminals from which control signals are outputted to the printed circuit board is disposed over the printed circuit board. A gate electrode of a semiconductor chip and the printed circuit board are electrically connected by a wire.

Semiconductor device and semiconductor device fabrication method

A semiconductor module includes: a first lead frame connected to a plurality of semiconductor chips in a first arm circuit; a second lead frame connected to a plurality of semiconductor chips in a second arm circuit; a first main terminal connected to the first lead frame; and a second main terminal connected to the second lead frame, wherein each of the first lead frame and second lead frame has a facing part, a first terminal connection portion connected to the first main terminal is provided at a first end portion of the first lead frame, a second terminal connection portion connected to the second main terminal is provided at a second end portion of the second lead frame, and the first terminal connection portion and second terminal connection portion are arranged on opposite sides when viewed from the facing parts of the first lead frame and second lead frame.

Semiconductor module, electric automobile and power control unit

A semiconductor device is provided, in order to prevent tilt of a terminal pin in the semiconductor device with a printed board in which the terminal pin is pressed, the semiconductor device comprising a printed board, a plurality of pins pressed in the printed board, a resin block in which a plurality of through holes are formed, the plurality of pins respectively pressed in the plurality of through holes, and a resin case covering at least a part of the printed board and the resin block.

Semiconductor device and semiconductor device manufacturing method

The semiconductor device includes a multi-layered substrate having an insulating plate and a circuit plate, a semiconductor chip having a front surface attached with a main electrode and a control electrode formed thereon, and a back surface fixed to the circuit plate, a first wiring substrate which includes a first conductive member and is placed so as to face the main electrode connected electrically to first conductive member, a second wiring substrate which includes a second conductive member, is placed so as to face the control electrode, and has an opening, and a conductive post having one end and another end, the one end being connected electrically and mechanically to the control electrode, and the other end being connected electrically and mechanically to the second conductive member. The first conductive member is thicker than the second conductive member, and the first wiring substrate is disposed within the opening.

Semiconductor device

A semiconductor device includes: a frame; a first-external-terminal provided to a first side portion of the frame; a first substrate enclosed in the frame and having a first-conductive-layer at an upper surface; a first-semiconductor-element: mounted on the first-conductive-layer; having, on a lower surface, a first main electrode connecting with the first-conductive-layer; and having a second main electrode and a control electrode on an upper surface; a first terminal connecting portion establishing a connection between the first-external-terminal and an exposed portion of the first-conductive-layer between the first-semiconductor-element and the first-external-terminal; a first-external-control-terminal provided above a wire in the frame and between the first main electrode of the first-semiconductor-element and the first-external-terminal; and a first control terminal connecting portion establishing a connection: between the control electrode of the first-semiconductor-element and the first-external-control-terminal; and above a wire between the first main electrode of the first-semiconductor-element and the first-external-terminal.

Semiconductor device and manufacturing method of semiconductor device

In a semiconductor device, a multilayer substrate includes an insulating substrate, a first circuit board having a first semiconductor chip disposed thereon, and a second circuit board having a second semiconductor chip disposed thereon. On the multilayer substrate of the semiconductor device, a plate portion of a resin plate including a first positioning portion that regulates the position of each semiconductor chip is sandwiched between a first jumper terminal, which includes a first terminal connected to the first semiconductor chip and a first plate member perpendicular to the first terminal, and a second jumper terminal, which includes a second terminal connected to the second semiconductor chip and a second plate member perpendicular to the second terminal.

A semiconductor device includes a plurality of main terminals extending from one end of a base plate toward the other end thereof, a group of semiconductor chips on a side of higher electric potential disposed on one side of the main terminal and mounted on the base plate, and a group of semiconductor chips on a side of lower electric potential disposed on the other side of the main terminal and mounted on the base plate. The one main terminal has an extending portion extending, in a direction perpendicular to the extending direction of the main terminal, toward one of both sides of the main terminal, and two adjacent semiconductor chips in one of the group of semiconductor chips on the side of higher electric potential and the group of semiconductor chips on the side of lower electric potential are axisymmetrically disposed with respect to the extending portion.

Semiconductor device with separated main terminals

A semiconductor device includes an insulating substrate; a semiconductor element mounted on the insulating substrate; and a radiation block bonded to the semiconductor element. The radiation block includes a three-dimensional radiation portion and a base portion connected to the radiation portion. The radiation portion of the radiation block has a pin shape, a fin shape, or a porous shape.

Semiconductor device, and method for assembling semiconductor device

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Shiojiri, Japan

Shin Soyano