Average Co-Inventor Count = 4.56
ph-index = 32
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Taiwan Semiconductor Manufacturing Comp. Ltd. (634 from 40,253 patents)
2. Applied Materials, Inc. (24 from 13,568 patents)
658 patents:
1. 12451435 - 3D stacking architecture through TSV and methods forming same
2. 12444696 - Package structure
3. 12444663 - Semiconductor package including a semiconductor die disposed in a cavity and method for manufacturing thereof
4. 12431415 - Buffer block structures for C4 bonding and methods of using the same
5. 12424586 - Bridging-resistant microbump structures and methods of forming the same
6. 12424532 - Bump joint structure with distortion and method forming same
7. 12424511 - High efficiency heat dissipation using discrete thermal interface material films
8. 12417970 - Method for forming chip package structure
9. 12412851 - Semiconductor device and method of manufacture
10. 12412827 - Semiconductor die package with conductive line crack prevention design
11. 12406898 - Chip package structure with lid
12. 12406897 - Package structure with buffer layer embedded in lid layer
13. 12406936 - Semiconductor package with substrate recess and methods for forming the same
14. 12400999 - Semiconductor devices and methods of manufacture
15. 12394752 - Multi-chip device and method of formation