Average Co-Inventor Count = 4.56
ph-index = 32
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Taiwan Semiconductor Manufacturing Comp. Ltd. (629 from 40,053 patents)
2. Applied Materials, Inc. (24 from 13,520 patents)
654 patents:
1. 12431415 - Buffer block structures for C4 bonding and methods of using the same
2. 12424586 - Bridging-resistant microbump structures and methods of forming the same
3. 12424532 - Bump joint structure with distortion and method forming same
4. 12424511 - High efficiency heat dissipation using discrete thermal interface material films
5. 12417970 - Method for forming chip package structure
6. 12412851 - Semiconductor device and method of manufacture
7. 12412827 - Semiconductor die package with conductive line crack prevention design
8. 12406898 - Chip package structure with lid
9. 12406897 - Package structure with buffer layer embedded in lid layer
10. 12406936 - Semiconductor package with substrate recess and methods for forming the same
11. 12400999 - Semiconductor devices and methods of manufacture
12. 12394752 - Multi-chip device and method of formation
13. 12394758 - Packages with metal line crack prevention design
14. 12394698 - Underfill cushion films for packaging substrates and methods of forming the same
15. 12387991 - Manufacturing method of semiconductor package