Adv Antest Corporation

Shin Nemoto

Yoshihito Kobayashi

Hiroto Nakamura

Hiroki Ikeda

Akihiko Ito

Tsuyoshi Yamashita

Takeshi Onishi

Yoshiyuki Masuo

Hiroo Nakamura

Hiroshi Okuda

Katsumi Kojima

Kazuyuki Yamashita

Hisao Hayama

A semiconductor device testing system is provided which can efficiently utilize a plurality of semiconductor device testing apparatus. There are provided a host computer for controlling a plurality of semiconductor device testing apparatus A, B, and C, and a dedicated classifying machine Storage information memory means for storing storage information of each semiconductor device such as a number assigned to each tested semiconductor device, the test results of each semiconductor device, and the like is provided in the host computer Without sorting the tested devices or with the sorting operation of the tested devices into only two categories in the handler part of each testing apparatus, the tested devices are transferred from the test tray to a general-purpose tray, and during this transfer operation, the storage information of each device is stored in the storage information memory means. When all the tests are completed, the storage information of each device stored in the storage information memory means is transmitted to the dedicated classifying machine by which the tested devices are sorted out.

Semiconductor device testing apparatus and semiconductor device testing system having a plurality of semiconductor device testing apparatus

A semiconductor device testing apparatus having a reduced transverse width and compact in size is provided. Adjacent to a constant temperature chamber containing therein a vertical transport means is located a test chamber which is in turn adjoined by a temperature-stress removing chamber likewise containing therein a vertical transport means, so that the constant temperature chamber and the test chamber are arranged transversely in a line, while the temperature-stress removing chamber is located in front of the test chamber when viewed in front view of the apparatus. Further, a loader section is located in front of the constant temperature chamber, and an unloader section is located above the temperature-stress removing chamber. With this arrangement, the transverse width of the testing apparatus may be reduced to about two test tray lengths.

Semiconductor device testing apparatus

An electronic device tray having a plurality of IC holders in which IC chips are held and having a shutter for opening and closing openings of the IC holders , the shutter being opened and closed by fluid pressure cylinders etc. provided at an IC tester. Further, a tray vertical carrier for conveying a tray holding IC chips in a substantially vertical direction, including a tray end holding member able to detachably hold an end of the lowermost level tray positioned at the lowermost level among stacked trays , a tray elevating member for conveying the lowermost level tray downward or upward, an actuator member for driving the tray end holding member so as to release the hold on the lowermost level tray and then hold the end of another tray next arriving at the lowermost level position when the lowermost level tray is in a state where it can be supported by the tray elevating member , and a tray horizontal carrier receiving the lowermost level tray when the tray elevating member descends and able to move in the substantially horizontal direction, the tray horizontal carrier being moved by a drive wire

Electronic device tray electronic device tray, transporting apparatus, and electronic device testing apparatus

A hand-operated test head positioner for positioning the test head of a semiconductor device testing apparatus is provided which is easy to operate, highly safe in operation, and yet inexpensive. Two air cylinders are installed one at each of two opposed positions of the test head. The sum of driving forces of these air cylinders is set at a level approximately equivalent to the weight of the test head to act as a counterbalancer. Hand-operated jack mechanisms are disposed on the opposite side walls of the test head, respectively. The jack mechanisms comprise long lead screws rotatably supported, two movable screw members in threaded engagement with the respective lead screws, drive arms pivotally connected at one ends to the respective movable screw members, and driven arms having approximately the same shape and size as the drive arms and being pivotally connected to the respective drive arms, respectively. By manually rotating one of the lead screws, the movable screw members are simultaneously moved thereby moving the test head vertically upwardly and downwardly.

Test head positioner for semiconductor device testing apparatus

Semiconductor device testing apparatus and semiconductor device testing

An automatic test handler system for automatically supplying IC devices to be tested to an IC tester and sorting the tested IC devices based on the test results. The system includes a testing machine for testing the IC devices by contacting the IC devices with test contactors. Test signals are provided from the IC tester and the resulting signals from the IC devices are received. The testing machine is installed in a test room in which dust, temperature and humidity are controlled in a high degree. A sorting machine is installed outside of the test room for sorting the IC devices that have been tested based on the test results. The sorting machine has a plurality of sort stations for receiving the IC devices based on categories defined in the test results. Tray cassettes hold a plurality of IC trays containing the IC devices, and both the tray cassettes and IC trays are provided with identification numbers. The trays are horizontally transferred on the testing machine and the sorting machine, and a data communication network connected between the testing machine and the sorting machine transmits the test results and position information of the IC devices in the IC trays.

Automatic test handler system for IC tester

Growing community of inventors

Yono, Japan

Shin Nemoto