Taiyo Yuden Co., Ltd.

Shin Nakayasu

Tomohiko Zaima

Fukio Kinoshita

Takashi Sasaki

Akira Furusawa

There is provided a multi-layer ceramic electronic component includes a ceramic body, an end external electrode unit, a side face external electrode unit. The ceramic body includes a pair of end faces, a pair of first side faces, and a pair of second side faces all of which are faced each other, respectively. The ceramic body includes a plurality of ceramic layers and an internal electrode unit. A plurality of the ceramic layers extend along a pair of the first side faces, and are laminated along a pair of the second side faces. The internal electrode unit includes first and second internal electrodes disposed alternately between a plurality of the ceramic layers, the first internal electrodes are drawn to both ends of a pair of the end faces, and the second internal electrodes are dawn to both ends of a pair of the second side faces. The end external electrode unit is connected to the first internal electrodes. The side face external electrode unit goes around from one of a pair of the first and second side faces to the other and are connected directly or indirectly each other at the other. There is also provided a method of producing the same.

Multi-layer ceramic electronic component having side face external electrode and method of producing the same

In an embodiment, a through-type multilayer ceramic capacitor-has a first external electrodeprovided on one end of the capacitor bodyin the length direction, and a second external electrodeprovided on the other end of the capacitor bodyin the length direction, and it also has a third external electrodeof quadrangular cylinder shape provided at the center of the capacitor bodyin a manner continuously covering parts of both sides in the height direction, and parts of both sides in the width direction, of the capacitor body, in a state not contacting the first external electrodeand second external electrode. The through-type multilayer ceramic capacitor can offer improved strength at the time of installation on a circuit board.

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Tokyo, Japan

Shin Nakayasu