Samsung Electronics Co., Ltd.

Shin-min Rhee

Jae-Sung Kim

Dong-hun Lee

Choo-ho Kim

Eui-seok Kim

Won-soo Ji

Sang-woo Ha

Tae-hee Song

In-je Sung

Hee-young Jun

Young-hyo Eun

Ju-hyun Song

Provided is a light emitting diode (LED) module. The LED module includes: a light emitting chip on a substrate; and an optical lens on the substrate configured to envelop the light emitting chip, wherein the optical lens includes a body comprising a groove receiving the light emitting chip therein and having a dome-shaped upper surface and a ring-shaped supporting portion protruding from a lower surface of the body.

Light emitting diode module

A method of cutting light emitting element packages includes preparing a ceramic substrate having a surface on which a plurality of light emitting element chips are mounted and a light-transmitting material layer is formed to cover the plurality of light emitting element chips; partially removing the light-transmitting material layer between the plurality of light emitting element chips along a cutting line by using a mechanical cutting method; and separating individual light emitting element packages by cutting the ceramic substrate along the cutting line by using a laser cutting method.

Method of cutting light emitting element packages employing ceramic substrate, and method of cutting multilayered object

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Seoul, South Korea

Shin-min Rhee