Sharp Kabushiki Kaisha Corporation

Shin Itoh

Masahiro Konishi

Hiroyuki Nokubo

Yoshiaki Itakura

Ippei Yamaguchi

Shinji Yamaguchi

Yoshiki Sota

Tsukasa Inoguchi

Kazuo Tamaki

Masayuki Ohta

Masaki Tatsumi

Yoshinobu Nakamura

Keisuke Miyazaki

Masahiro Ikehara

Peter John Roberts

Kazuhiro Tsuchida

Yuhsuke Fujita

Masato Sumikawa

Noriaki Fujii

Hiroshi Yamashita

Tomoshi Kimura

Tohru Murata

Takashi Nakanishi

[Object] To provide (i) a two-lens optical system, (ii) a beam combining module, (iii) a projector, and (iv) a method for assembling a two-lens optical system each of which allows for an improved lens positioning sensitivity [Means to Attain the Object] A two-lens optical system () includes a first lens () for use in collimation adjustment, the first lens being configured to move along only an optical axis of light emitted from a light source; and a second lens () for use in beam steering, the second lens being configured to move along only two axes perpendicular to the optical axis.

Two-lens optical system, beam combining module, projector, and method for assembling two-lens optical system

Light emission efficiency is increased in an eye-safe light source by regulating light distribution properties. An eye-safe light source includes a package, a semiconductor laser that emits laser light from a left light emission end surface and a right light emission end surface, and a wire that is joined to the semiconductor laser. The semiconductor laser is joined to the package such that the laser light is emitted parallel to an upper surface of a lead frame of the package. The package includes reflection surfaces that face the left light emission end surface and the right light emission end surface and reflect the laser light. In top view, a direction in which the wire extends is perpendicular to a direction of emission of the laser light.

Eye-safe light source

Image capturing accuracy is improved while a simple optical system is used. An image capture device includes: a polarizing filter that blocks non-transmitted light that has been in polarized light of an infrared ray radiated from a light source and has not been transmitted through an image capturing target and transmitted light that has been in the polarized light and has been transmitted through the image capturing target without diffusion inside the image capturing target, and transmits transmitted light that has been in the polarized light and has been diffused inside the image capturing target and transmitted therethrough; and an image sensor that receives the light that has been transmitted through the polarizing filter and captures an image of the image capturing target.

Image capture device and biometric authentication device

An electrode pattern () formed on a ceramics layer () in a substrate for a light emitting device (circuit board ()) of the present invention includes a first metal layer (), a second metal layer (), and an electrode terminal unit (), and the thickness of a part at which the electrode terminal unit () is not formed in the electrode pattern () is at least equal to or greater than 35 &#x3bc;m. Accordingly, it is possible to suppress heat resistance to be low.

Substrate for light emitting device and manufacturing method of substrate for light emitting device

A substrate (A) includes an aluminum substrate body (), a reflection layer () that is formed between an electrode pattern () which obtains electrical connection with a light emitting element () and the aluminum substrate body () and that contains first ceramics which reflect light from the light emitting element (), and an intermediate layer () that contains second ceramics which are formed by thermal spraying and reinforces dielectric strength performance of the reflection layer ().

Substrate for light emitting devices, light emitting device, and method for producing substrate for light emitting devices

A lighting reflectorincludes a base member, made of metal, having an inner circumferential surfaceexpanding toward a light exit apertureopen at an end in an axial direction. A thin-film layerwhich is formed from a thin film containing ceramic and which scatters light is placed on an end portion of the inner circumferential surfacethat is on the opposite side to the light exit aperture

Lighting device, lighting reflector and production method therefor

A substrate () in which a surface of an aluminum base () other than a surface on which an insulating thin film layer () is formed is covered with a protective layer () which is an aluminum anodic oxide film.

Substrate for light emitting device, light emitting device, and method for manufacturing substrate for light emitting device

In a light-emitting device substrate (), a light reflecting surface covered with an anodized aluminum layer () is formed on one side of a base (), and a glass-based insulator layer () and electrode patterns () disposed on the first insulating layer () are formed on the one side of the base () in a region not covered with the anodized aluminum layer (). A glass-based insulator layer () is formed at least on the other side of the base () that is opposite the one side of the base (). Therefore, a light-emitting device substrate having high reflectivity, high heat dissipation capability, dielectric withstand capability, and long-term reliability and excellent in mass productivity can be realized.

Light-emitting device substrate, light-emitting device, and method for producing light-emitting device substrate

A substrate includes a base made of a metal material, a thermally conductive, light-reflective ceramic insulating layer, and a buffer layer formed between the base and the ceramic insulating layer and having a smaller linear expansion coefficient than the base.

Light-emitting device substrate, light-emitting device, and method for manufacturing light-emitting device substrate

In order to provide a substrate for light emitting devices having high heat radiating properties, dielectric strength voltage properties, light reflectivity, and excellent mass productivity, a substrate () includes an intermediate layer () containing ceramic which is formed on the surface of the aluminum base () by using an aerosol deposition method.

Substrate for light emitting devices and light emitting device

Provided is a substrate for a light emitting device having high reflectivity, high heat radiating properties, dielectric strength voltage properties, long-term reliability including heat resistance and light resistance, and excellent mass productivity. A substrate () for a light emitting device includes: a first insulating layer () having thermal conductivity which is formed on a surface of one side of a metal base (); a wiring pattern () which is formed on the first insulating layer (); and a second insulating layer () having light reflectivity which is formed on the first insulating layer () and on some parts of the wiring pattern (), so that some parts of the wiring pattern () are exposed, in which the first insulating layer () is a layer of ceramic formed by thermal spraying.

Substrate for light emitting device, light emitting device, and manufacturing method of substrate for light emitting device

A light emitting device achieving a high heat dissipation effect and a high light utilization efficiency includes an aluminum substrate, a high heat dissipation ceramic layer on the aluminum substrate, an etching frame on the high heat dissipation ceramic layer, and a highly reflective ceramic layer on the high heat dissipation ceramic layer and the etching frame.

Light emitting device including a metal substrate for high heat dissipation and increased light efficiency

An LED chip () is disposed in a recessed portion () formed by bending a metal lead frame (). A reflector () has a resin reflection surface () and the recessed portion () has a metal reflection surface (). When the inclination angle of at least one metal reflection surface () is &#x3b8;s(&#xb0;), the resin reflection surface () has a sloped resin surface with an inclination angle of &#x3b8;s(&#xb0;) that is smaller than &#x3b8;s(&#xb0;). With &#x3b8;c(&#xb0;) defined as the critical angle of light emitted from an LED chip () and incident on the interface between a light-transmissive resin () and an air layer, the sloped resin surface and metal reflection surface having a relationship of &#x3b8;s&#x3c;&#x3b8;s, satisfies both a conditional expression (1): 45&#xb0;&#x2212;&#x3b8;c/2&#x3c;&#x3b8;s&#x3c;&#x3b8;c and a conditional expression (2): 35&#xb0;&#x2266;&#x3b8;s&#x2266;55&#xb0;.

Light-emitting device, illumination device and backlight for display device

Improves light extraction efficiency. A light emitting deviceusing a white resin molding packageintegrally molded with lead framesconstituting an electrode corresponding to one or a plurality of light emitting elementand white resin, wherein an area in a plane view of a white resin surface on a reflective surface that is level with amounting surface of the light emitting elementis configured to be larger than total area in a plane view occupied by surfaces of the lead framesand the light emitting element. Further, a step section is formed on the surfaces of lead frames, white resin is filled in the step section, and the area of white resin surface on a reflective surface where the light emitting elementis mounted is increased.

Light-emitting device with reflective resin

In the line light source device and the plane light emission device, first recessesare formed between adjoining light emission elements, on surfaces of sealing resin layersopposite to the board. The line light source device and the plane light emission device, in which the light emission elements are coated with resin, have a simple configuration and high uniformity in luminous intensity in an emission end face of the device.

Growing community of inventors

Osaka, Japan

Shin Itoh