Ube Industries, Inc.

Iwate University

Shin-ichiro Kohama

Nobuharu Hisano

Hiroaki Yamaguchi

Yoshiyuki Oishi

Taizou Murakami

Kosuke Oishi

A polyimide precursor, a polyimide using the polyimide precursor, and a polyimide film using the polyimide. The polyimide film has excellent adhesiveness to a metal layer or an adhesive, and has improved heat resistance. The polyimide solution may be used as a coating material.

Polyimide precursor, polyimide, polyimide film, polyimide metal laminate, and polyimide solution

A polyimide precursor for obtaining a polyimide film having excellent adhesiveness to metals and improved transmittance in the UV-visible range, a polyimide in which the polyimide precursor is used, a polyimide film in which the polyimide is used, and a method for manufacturing a triazine compound used for manufacturing the polyimide precursor, polyimide film and polyimide.

Polyimide precursor, polyimide, polyimide film, and method for manufacturing triazine compound used for manufacturing same

A method for manufacturing a polyimide-metal laminate including forming a polyimide film, in which at least surfaces of both sides of the film are formed by thermally fusion-bondable polyimide layers (a), and thermal compression-bonding metal layers on both sides of the polyimide film; in which forming the polyimide film includes reacting a tetracarboxylic dianhydride component with a diamine component containing a diamine compound represented by general formula (1) to give a solution of a polyamic acid (a), forming a self-supporting film from the solution of the polyamic acid (a) and imidizing the self-supporting film by heating at a maximum heating temperature of 440&#xb0; C. or lower to form the polyimide layer (a); 

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Ube, Japan

Shin-ichiro Kohama