Jsr Corporation

Japan Synthetic Rubber Co., Ltd.

Ibiden Company Limited

Shin-ichiro Iwanaga

Eiichi Kobayashi

Hiroji Enyo

Takayoshi Tanabe

Toru Kajita

Mitsuhito Suwa

Hozumi Sato

Yasuhiko Takemura

Katsumi Inomata

Tooru Kimura

Tatsuaki Matsunaga

Makoto Shimizu

Yong Wang

Toshiyuki Ota

Haruo Iwasawa

Kouji Nishikawa

Kazuo Kawaguchi

Yoshiaki Kawamura

Ituo Nishiwaki

Atsushi Ito

Takashi Kariya

Toshiki Furutani

Yoshihisa Ohta

Satoshi Iwamoto

Masahiro Akiyama

Akira Tsuji

Isamu Mochizuki

Hirofumi Goto

Masaru Ohta

Koji Nishikawa

Ryoji Setaka

Osamu Ishikawa

Takeo Hara

Akio Saito

Takasi Morita

Norichika Nojima

Hiroko Nishimura

Shigeru Shingae

Toshiaki Ikemura

Katsuji Douki

Tooru Mizumachi

Ken-ichi Yokoyama

A multilayer printed wiring board is equipped with a core board, a build-up layerformed on the core boardso as to have a conductor patternon the upper surface thereof, a low-elasticity layerformed on the build-up layer, landsthat are provided on the upper surface of the low-elasticity layerand connected to an IC chipvia solder bumps, and conductor poststhat penetrate through the low-elasticity layerand electrically connect the landsto the conductor pattern. The low-elasticity layeris formed of resin composition containing epoxy resin, phenol resin, cross-linked rubber particles and a hardening catalyst.

Multilayer printed wiring board

It is an object of the present invention to provide a process capable of precisely producing a plated shaped article of a large thickness such as a bump or a wiring, a negative radiation-sensitive resin composition which is preferably used for the process and has excellent sensitivity and resolution, and a transfer film using the composition. The above object is achieved by a negative radiation-sensitive resin composition comprising (A) a polymer containing structural units represented by the following formula (1) and/or the following formula (2), (B) a compound having at least one ethylenically unsaturated double bond and (C) a radiation-sensitive radical polymerization initiator, and by forming a negative radiation-sensitive resin film using the composition. 

Negative radiation-sensitive resin composition

The invention concerns a lift-off process for patterning layers that are deposited and/or sputtered. The invention provides a two-layer resist and a patterning method using the resist. The patterning method can readily produce burr-free layers on a substrate. The method comprises the steps of:

Two-layer film and method of forming pattern with the same

The photosensitive resin film in an uncured state of the invention comprises (A) a specific alkali-soluble copolymer, (B) a compound having at least one ethylenically unsaturated double bond and (C) a radiation-sensitive radical polymerization initiator by the use of which a coating film having a dry film thickness of 70 &#x3bc;m in an uncured state has a 365 nm radiation transmittance of not less than 10% and a 405 nm radiation transmittance of not less than 60%, contains the radiation-sensitive radical polymerization initiator (C) in an amount of 20 to 40 parts by weight based on 100 parts by weight of the component (A), and has a dry film thickness of not less than 50 &#x3bc;m. According to the photosensitive resin film, a high bump having a height of not less than 50 &#x3bc;m can be readily formed on a chip substrate with high precision though formation of such a high bump is difficult by the conventional technique. Moreover, connection failure of an element can be inhibited, and reliability of an element can be enhanced.

Photosensitive resin film and cured film made therefrom

A radiation-sensitive resin composition comprising (A) an alkali-soluble resin having an unsaturated group, (B) a compound having at least one ethylenically unsaturated double bond, and (C) a radiation-induced radical polymerization initiator, wherein: The resin composition can form a radiation-sensitive film in a thickness greater than a deposit thickness and has a high resolution.

Radiation-sensitive resin composition

A radiation-sensitive resin composition including (A) a resin containing an alicyclic skeleton in its backbone, and (B) a radiation-sensitive acid-generating agent, is provided. This composition is excellent in transparency with respect to radiation and dry etching resistance, and can give a photoresist pattern excellent in adhesion to substrates, sensitivity, resolution, and developability.

A heat-conductive sheet comprising a cured or semi-cured binder wherein a carbon fiber is orientated in the direction of the thickness of the heat-conductive sheet. This heat-conductive sheet exhibits a high anisotropic heat conductivity along the direction of the thickness thereof to thereby enable efficiently releasing heat from a heating element such as a semiconductor element or semiconductor package. Moreover, the heat-conductive sheet is excellent in not only heat resistance, durability and mechanical strength but also adherence to the heating element.

Curing composition for forming a heat-conductive sheet, heat-conductive sheet, production thereof and heat sink structure

A positive-tone or negative-tone radiation sensitive resin composition comprising (A) a photoacid generator represented by the following formula (1-1) or (1-2):

Radiation sensitive resin composition

A reflection-preventing film-forming composition including a copolymer having structural units represented by the following general formulas (1) and (2) and a solvent:

Acrylic copolymer and reflection-preventing film-forming composition containing the same

A radiation sensitive resin composition comprising (A) a copolymer possessing recurring units of the formulas (1), (2), and (3),

A radiation-sensitive resin composition including (A) an alkali-soluble novolak resin obtained by condensing a particular combination of a first phenol having formula:

A novel diazodisulfone compound capable of generating acid having high sensitivity to far ultraviolet rays typified by a KrF excimer laser and the like and capable of providing a resist with superior resolution and patterns when used as a photoacid generator for a chemically amplified resist, and a radiation-sensitive resin composition comprising the diazodisulfone compound. The diazodisulfone compound is represented by the following formulas (1) and (2). ##STR1## The radiation-sensitive resin composition comprises the diazodisulfone compound and resin represented by 4-hydroxystyrene/4-(1'-ethoxyethoxy)styrene copolymer.

Diazodisulfone compound and radiation-sensitive resin composition

Positive as well as negative radiation sensitive resin compositions that, in addition to being capable of providing excellent resolution and pattern profile, are particularly excellent in avoiding the problems of 'nano-edge roughness' or 'coating surface roughness'. The positive type radiation sensitive resin composition comprises (A) (a) an acid-decomposable group-containing resin, or (b) an alkali-soluble resin and an alkali dissolution controller, and (B) a photoacid generator comprising 'a compound that upon exposure to radiation generates a carboxylic acid having a boiling point of 150.degree. C. or higher', and 'a compound that upon exposure to radiation generates an acid other than a carboxylic acid'. The negative type radiation sensitive resin composition comprises (C) an alkali-soluble resin, (D) a cross-linking agent, and the component (B) as described above.

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Tokyo, Japan

Shin-ichiro Iwanaga