Taiwan Semiconductor Manufacturing Comp. Ltd.

Shin-Chi Lin

Yi-Lung Cheng

Wen-Kung Cheng

Sez-An Wu

Yi-Lung Wang

A method of depositing a plasma enhanced CVD metal nitride layer over an exposed copper surface in a semiconductor wafer manufacturing process to improve the metal nitride layer adhesion and to reduce copper hillock formation including providing a process surface which is an exposed copper surface; preheating the process surface; plasma sputtering the exposed copper surface in-situ to remove copper oxides; and, depositing a metal nitride layer in-situ according to a plasma enhanced CVD process at a selected deposition pressure to reduce plasma ion bombardment energy transfer and to suppress-copper hillock formation.

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Taipei, Taiwan

Shin-Chi Lin