3m Innovative Properties Company

Kimberly-clark Worldwide, Inc.

Solventum Intellectual Properties Company

Shijing Cheng

Lin Yang

Evan L Schwartz

David James Yarusso

Claire Hartmann-Thompson

Michael A Kropp

Sheng Ye

Eric G Larson

Wei Cui

Timothy Edward Long

Justin P Meyer

Brett J Sitter

Jianhui Xia

Michele A Craton

Matthew J Kryger

Kiu-Yuen Tse

George J Clements

Nicholas C Erickson

William Clayton Bunyard

Petra M Stegmaier

Pierre Reinhard Bieber

Jeffrey M Imsande

Ying Zhang

Eike H Klünker

Dmitri D Iarikov

Lijing Zhang

Athanasios Touris

Sean T Hemp

Adam E Smith

Wengsheng Xia

Jungkang Liu

Niklas M Matzeit

Petra Maria Stegmaier

Niklas Martin Matzeit

Eike Henning Klünker

George Joseph Clements

Michele Ann Craton

Dmitri Dmitrievich Iarikov

Jeffrey Michael Imsande

D Hollander

Adhesive articles include a substrate; and a hot melt processable pressure sensitive adhesive on the substrate. The hot melt processable pressure sensitive adhesive is a (meth)acrylate-based copolymer that is the reaction product of a reaction mixture that is free of acidic or basic monomers, and includes an alkyl (meth)acrylate, a hydroxyl-functional (meth)acrylate, and a photocrosslinker. The (meth)acrylate-based polymer is prepared in a thermoplastic package.

Hot melt processable (meth)acrylate-based medical adhesives

The present disclosure relates to a process of manufacturing a pressure sensitive adhesive, comprising the steps of: a) providing a hot melt mixing apparatus comprising a reaction chamber; b) providing a hot melt processable pressure sensitive adhesive composition comprising: (1) a (meth)acrylate copolymer component comprising: i. C1-C32 (meth)acrylic acid ester monomer units; ii. optionally, ethylenically unsaturated monomer units having functional groups selected from the group consisting of acid, hydroxyl, acid anhydride, epoxide, amine, amide groups, and any combinations thereof; and iii. optionally, further ethylenically unsaturated monomer units which are copolymerizable with monomer units (i) and/or (ii); and (2) a crosslinking system selected from the group consisting of thermal crosslinking systems, actinic radiation crosslinking systems, and any combinations thereof; (3) optionally, at least one expandable microsphere; and (4) optionally, at least one pigment; c) providing a polymeric resin; d) subjecting the polymeric resin to a heating step (thereby at least partly remove low Volatile Organic Compounds (VOC) from the polymeric resin) thereby forming a cleaned polymeric resin; e) incorporating the cleaned polymeric resin and the hot melt processable pressure sensitive adhesive composition in the reaction chamber of the hot melt mixing apparatus; −57-f) mixing the hot melt processable pressure sensitive adhesive composition and the cleaned polymeric resin in the hot melt mixing apparatus thereby forming a hot melt blend; g) removing the hot melt blend from the hot melt mixing apparatus; and h) optionally, crosslinking the hot melt blend.

Process of manufacturing a pressure sensitive adhesive having a low VOC characteristics

A thermally curable adhesive film, a tape, and a method of making the tape, wherein the film includes: a crosslinked (meth)acrylate matrix; and a thermally curable, one-part epoxy/thiol resin composition incorporated within the crosslinked (meth)acrylate matrix; wherein the thermally curable, one-part epoxy/thiol resin composition comprises: an epoxy resin component comprising an epoxy resin having at least two epoxide groups per molecule; a thiol component comprising a polythiol compound having at least two thiol groups; a nitrogen-containing catalyst for the epoxy resin; and an organic acid.

Adhesive film including a (meth)acrylate matrix including a curable epoxy/thiol resin composition, tape, and method

Transfer tapes include a releasing substrate and an adhesive layer adjacent to the surface of the releasing substrate. The adhesive layer includes a cured copolymer prepared from a reaction mixture that includes at least one alkyl (meth)acrylate, at least one ethylenically unsaturated silane, and an initiator. The adhesive layer is a pressure sensitive adhesive at room temperature and is convertible into a ceramic-like layer by bake-out at a temperature of from 170-500&#xb0;.

Polymeric adhesive layers as ceramic precursors

The present disclosure provides a crosslinkable composition including a (meth)acrylate polymer and a visible light absorbing compound. Two percent or less of the carbon-carbon bonds in the crosslinkable composition are double bonds. The composition allows for inclusion of one or more materials degradable by ultraviolet radiation and/or stabilized against ultraviolet radiation. Methods for making a crosslinked composition is also provided. One method includes obtaining a crosslinkable composition and subjecting the crosslinkable composition to radiation having a wavelength of 400 nm or greater. Another method includes subjecting a crosslinkable composition to first and second radiations that are different from each other.

Crosslinkable composition including a (meth)acrylic polymer and methods of making a crosslinked composition

Described herein is a backing comprising a sorbent material entrapped in a non-woven fiber matrix, wherein the backing comprises a first and a second major surface; and a first adhesive layer contacting the first major surface of the backing, wherein the first adhesive layer comprises a pressure sensitive adhesive.

Adhesive article backing with sorbent material

A method of forming a transfer film is described. The transfer film includes a template layer having a first major surface and an opposing second major surface. The second major surface includes a structured non-planar release surface. A backfill layer is disposed upon and conforms to the non-planar structured surface. The backfill layer includes a first cross-linked polymer and a plurality of multifunctional monomers, which cure via different and independent curing mechanisms.

Method of forming dual-cure nanostructure transfer film

A transfer film includes a template layer having a first major surface and an opposing second major surface. The second major surface includes a structured non-planar release surface. A backfill layer is disposed upon and conforms to the non-planar structured surface. The backfill layer includes a first cross-linked polymer and a plurality of multifunctional monomers, which cure via different and independent curing mechanisms.

Dual-cure nanostructure transfer film

A composition includes a responsive block copolymer, the responsive block copolymer including at least one block A that is a triggerable copolymer, the triggerable copolymer including at least one lower critical solution temperature monomer and at least one charged monomer, wherein the triggerable copolymer block A is a dual trigger block configured to trigger on temperature and ionic strength, and wherein the responsive block copolymer micellizes or gels at a temperature between 28&#xb0; C. and 37&#xb0; C. and a salt concentration of about 0.9 wt %.

Dual responsive block copolymer compositions

Growing community of inventors

Woodbury, MN, United States of America

Shijing Cheng