Chinese Academy of Sciences

Delta Electronics (shanghai) Co., Ltd

Suzhou Suplead Life Sciences Co., Ltd.

Suzhou Institute of Materia Medica

Shijie Chen

Hualiang Jiang

Cheng Luo

Bing Zhou

Yaxi Yang

Gang Qiao

Senhao Xiao

Hong Ding

Yan Deng

Xinjun Wang

Rukang Zhang

Guangwei Guo

Zhihui Wei

Zizhou Li

Lianghe Mei

Wenchao Lu

Shili Wan

Disclosed is a histone acetyltransferase (HAT) inhibitor. Provided are a compound represented by the general formula I, a pharmaceutically acceptable salt, a stereoisomer, an enantiomer, a diastereoisomer, an atropisomer, a racemate, a polymorph, a solvate or an isotope-labeled compound (including deuterium substitution) thereof, a preparation method therefor, a pharmaceutical composition comprising same and use thereof in the treatment of various HAT-related diseases or conditions.

Histone acetyltransferase (HAT) inhibitor and use thereof

The present invention relates to a bromodomain inhibitor. Provided are a compound represented by general formula I or a pharmaceutically acceptable salt, enantiomer, diastereomer, atropisomer, racemate, polymorph, solvate, or isotopically labeled compound (including deuterium substitution) thereof, a preparation method of the same, a pharmaceutical composition comprising the same, and a pharmaceutical use thereof. 

Bromodomain inhibitor compound and use thereof

The present disclosure provides a heat spreader and a power module. The heat spreader comprises: a base plate comprising a first surface and a second surface opposite to the first surface; an insulating frame fixedly connected to the first surface of the base plate; and an insulating material attached to at least a part of a surface of the insulating frame. The present disclosure can effectively satisfy design requirements for both heat dissipation and insulation, and significantly increase a layout space for a printed circuit board.

Heat spreader and power module

A modular power supply and a method for manufacturing the same are disclosed. The modular power supply comprises a printed circuit board, power components, and a heat sink. The power components are mounted on the printed circuit board and disposed at a side opposite to the heat sink, a lower surface of the printed circuit board is engaged with an upper surface of the heat sink which is planar, and an insulating layer is disposed between the upper surface of the heat sink and the lower surface of the printed circuit board. A method for manufacturing the modular power supply is also disclosed. The modular power supply has excellent heat dissipation effect, and the production and assembly process thereof is simplified, so that the production efficiency is improved and the quality is guaranteed.

Modular power supply and method for manufacturing the same

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Shanghai, China

Shijie Chen