Intel Corporation

Shijiang He

Victor M Alvarez

Scott K Buttars

Steven R Vandervoort

A cover for a socket that is to be soldered to a printed circuit board is described. The socket has connections to be soldered to the printed circuit board and connections to contact a die that will be carried by the socket. The socket includes a top surface to cover the die contacts of the socket and side walls surrounding the top surface and extending toward the socket to separate the top surface from the die contacts. The top surface has a plurality of inlet vents, and the side walls have a plurality of outlet vents.

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Gilbert, AZ, United States of America

Shijiang He