Hewlett-Packard Development Company, L.p.

Hewlett-Packard Company

Shih Yuan Wang

Nobuhiko P Kobayashi

Alexandre M Bratkovski

Jianhua Yang

Michael Josef Stuke

John L Moll

Michael R Ty Tan

A memristor includes a substrate having a plurality of protrusions, wherein each of the plurality of protrusions extends in a first direction, a first electrode provided over at least one of the plurality of protrusions, wherein the first electrode conforms to the shape of the at least one protrusion such that the first electrode has a crest, a switching material positioned upon the first electrode; and a second electrode positioned upon the switching material such that a portion of the second electrode is substantially in line with the crest of the first electrode along the first direction, wherein an active region in the switching material is operable to be formed between the crest of the first electrode and the portion of the second electrode that is substantially in line with the crest of the first electrode.

Memristor with a non-planar substrate

A hetero-crystalline semiconductor device and a method of making the same include a non-single crystalline semiconductor layer and a nanostructure layer that comprises a single crystalline semiconductor nanostructure integral to a crystallite of the non-single crystalline semiconductor layer.

Hetero-crystalline semiconductor device and method of making same

A hetero-crystalline device structure and a method of making the same include a first layer and a nanostructure integral to a crystallite in the first layer. The first layer is a non-single crystalline material. The nanostructure is a single crystalline material. The nanostructure is grown on the first layer integral to the crystallite using epitaxial growth.

Hetero-crystalline structure and method of making same

A double heterostructure step recovery diode having a very fast step transition time and a high output voltage. A highly doped, wide bandgap p-type region; a narrow bandgap intrinsic region; and a highly doped, wide bandgap n-type region define a PIN diode structure. The intrinsic region forms heterojunctions with the p and n regions. Highly doped, narrow bandgap p and n contact regions adjoin the wide bandgap p and n regions, respectively and form heterojunctions therewith. Very thin, highly doped, narrow bandgap p and n regions are located between the intrinsic region and the wide bandgap p and n regions, respectively. Optional graded bandgap p-type and n-type regions are located between the wide and narrow bandgap p and n regions. In one embodiment the diode is embedded in an undoped wide bandgap material. In an alternate version, the intrinsic region is replaced with a lightly-doped p-type charge storage region to reduce the slow tail portion of the step recovery. An electric field, generated by a graded doping level or a graded bandgap structure, also reduces the slow tail.

Growing community of inventors

Palo Alto, CA, United States of America

Shih Yuan Wang