National Taiwan University

Taiwan Semiconductor Manufacturing Comp. Ltd.

Advanced Semiconductor Engineering, Inc.

Asustek Computer Inc.

Shih-Yuan Chen

Jiun-Yun Li

Yao-Chun Chang

Chiung-Yu Chen

Han-Chee Yen

Ian Huang

Chien-Pai Lai

Ming-Hsien Cheng

Yu-Jui Wu

Soofin Cheng

Wang-Ta Hsieh

Wei-Hsin Shih

Shih-Chia Chiu

Skye Hui-Hsin Wu

Chin-Chang Chen

Rui-Fu Xu

Ting-I Yeh

Chien-Hao Chiu

An electronic device includes a pair of depletion gates, an accumulation gate, and a conductive resonator. The depletion gates are spaced apart from each other. The accumulation gate is over the depletion gates. The conductive resonator is over the depletion gates and the accumulation gate. The conductive resonator includes a first portion, a second portion, and a third portion. The first portion and the second portion are on opposite sides of the accumulation gate. The third portion interconnects the first and second portions of the conductive resonator and across the depletion gates. A bottom surface of the first portion of the conductive resonator is lower than a bottom surface of the accumulation gate.

Electronic device with conductive resonator

Electronic device and manufacturing method thereof

An electronic device includes a substrate, a transistor, and a ring resonator. The transistor is over the substrate. The transistor is configured to generate a quantum dot. The ring resonator is over the substrate and includes a conductive loop and an impedance matching element. The conductive loop overlaps with the transistor. The impedance matching element is on the conductive loop and is configured to determine a resonance frequency of the ring resonator.

A wireless communication circuit and an electronic device are provided. The wireless communication circuit used for an electronic device includes a wireless transceiver unit used to generate a transmitting signal, an impedance matching unit electronically coupled to the wireless transceiver unit, a coupling unit and a system grounding surface. The impedance matching unit includes at least one impedance, the impedance matching unit is used to convert the transmitting signal to a feeding signal according to the impedance value of at least one impedance. The coupling unit is electronically coupled to the impedance matching unit, to radiate the energy of the feeding signal. The system grounding surface is used to transmit a first electromagnetic wave signal via resonance on the plane of the system grounding surface after receiving the energy of the feeding signal.

Wireless communication circuit and electronic device

A semiconductor package comprises a substrate, a grounding layer, a encapsulant, a shielding layer, and a conductive element. The substrate includes a chip. The encapsulant encapsulates the grounding layer and the chip, wherein the encapsulant has an upper surface. The shielding layer is formed on the upper surface of the encapsulant. The conductive element surrounds a waveguide cavity and extends to the grounding layer. The grounding layer, the shielding layer and the conductive element together form a waveguide antenna.

Semiconductor package having a waveguide antenna and manufacturing method thereof

A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a substrate, a semiconductor chip, a package body and an antenna layer. The semiconductor chip is disposed on the substrate. The package body encapsulates the semiconductor chip and includes an upper surface. The antenna layer is formed on the upper surface of the package body and includes two antenna slot groups connected together. Each antenna slot group includes a wave guiding slot extending along a first direction, and an irradiation slot group extending along a second direction, wherein the irradiation slot group is connected to the wave guiding slot.

Semiconductor package including antenna layer and manufacturing method thereof

A facile synthesis route for preparing SBA-15 silica of platelet shape and very short mesochannels was developed by introducing a small amount of Zr(IV) ions in the first synthesis solution. The synthesis route can be easily extended to prepare SBA-15 materials with various organic functional groups in one pot.

Preparation of organic-functionalized mesoporous silica with platelet morphology and short mesochannels

Growing community of inventors

Taipei, Taiwan

Shih-Yuan Chen