Taiwan Semiconductor Manufacturing Comp. Ltd.

Shih-Wei Peng

Jiann-Tyng Tzeng

Wei-Cheng Lin

Kam-Tou Sio

Charles Chew-Yuen Young

Chih-Ming Lai

Chih-Liang Chen

Te-Hsin Chiu

Chia-Tien Wu

Ru-Gun Liu

Wei-An Lai

Hui-Ting Yang

Hui-Zhong Zhuang

Cheng-Chi Chuang

Chun-Kuang Chen

Guo-Huei Wu

Pin-Dai Sue

Shun Li Chen

Li-Chun Tien

Yung-Sung Yen

Tien-Lu Lin

Ching-Yu Huang

Shun-Li Chen

Wen-Hao Chen

Chi-Yeh Yu

Lipen Yuan

Wei-Chen Chien

Te-hsin Chiu

Lee-Chung Lu

Ken-Hsien Hsieh

Lei-Chun Chou

Meng-Hung Shen

Chih-Min Hsiao

Hui-ting Yang

Jay Yang

Ching-Wei Tsai

Chung-Hsing Wang

Yi-Kan Cheng

Hou-Yu Chen

Yuan-Te Hou

Yi-Hsun Chiu

Yu-Xuan Huang

Kuan-lun Cheng

Ching-Hsu Chang

Chew-Yuen Young

Kam-tou Sio

Chun-Hung Liou

Meng-hung Shen

Jiun-Wei Lu

Wei-cheng Tzeng

Hui-Ting Yang′

An integrated circuit includes conductive rails that are disposed in a first conductive layer and separated from each other in a layout view, signal rails disposed in a second conductive layer different from the first conductive layer, at least one first via coupling a first signal rail of the signal rails to at least one of the conductive rails, and at least one first conductive segment. The first signal rail transmits a supply signal through the at least one first via and the at least one of the conductive rails to at least one element of the integrated circuit. The at least one first via and the at least one first conductive segment are disposed above first conductive layer. The at least one first conductive segment is coupled to the at least one of the conductive rails and is separate from the first signal rail.

Integrated circuit

An integrated circuit includes metal rails. The integrated circuit includes a first layer including a first metal rail and a second layer including a second metal rail, where the second layer is above the first layer along a first direction. The integrated circuit includes a third layer including an active region of a transistor, where the third layer is above the second layer along the first direction. The integrated circuit includes a fourth layer including a third metal rail, where the fourth layer is above the third layer along the first direction. The integrated circuit includes a fifth layer including a fourth metal rail, where the fifth layer is above the fourth layer along the first direction.

Integrated circuit with backside power rail and backside interconnect

An integrated circuit includes a plurality of first layer deep lines, a plurality of first layer shallow lines, a plurality of second layer deep lines, and a plurality of second layer shallow lines. The integrated circuit also includes a first active device and a second active device coupled between a conducting path that has a low resistivity portion and a low capacitivity portion. The first active device has an output coupled to a first layer deep line that is in the low resistivity portion. The second active device has an input coupled to a first layer shallow line that is in the low capacitivity portion. The low resistivity portion excludes the first layer shallow lines and the second layer shallow lines, and the low capacitivity portion excludes the first layer deep lines and the second layer deep lines.

Deep lines and shallow lines in signal conducting paths

A monolithic three-dimensional (3D) integrated circuit (IC) device includes a lower tier including a lower tier cell and an upper tier arranged over the lower tier. The upper tier has a first upper tier cell and a second upper tier cell separated by a predetermined lateral space. A monolithic inter-tier via (MIV) extends from the lower tier through the predetermined lateral space, and the MIV has a first end electrically connected to the lower tier cell and a second end electrically connected to the first upper tier cell.

Three dimensional integrated circuit with monolithic inter-tier vias (MIV)

A semiconductor structure including a first conductive layer, a second conductive layer situated above the first conductive layer, and a via extending diagonally between the second conductive layer and the first conductive layer to electrically connect the first conductive layer to the second conductive layer.

Diagonal vias in semiconductor structures

An integrated circuit with mixed poly pitch cells with a plurality of different pitch sizes is disclosed. The integrated circuit includes: at least a minimum unit each with at least a first number of first poly pitch cells with a first pitch size, and a second number of second poly pitch cells with a second pitch size, the first pitch size PP is different from the second pitch size PP1, the greatest common divisor of the first pitch size PP and the second pitch size PP1 is GCD, wherein GCD is an integer greater than 1; a gate length of the first pitch size is Lg; a gate length of the second pitch size is Lg1; Lg and Lg1 are capable of being extended to achieve G-bias for power and speed optimization of the minimum unit and the integrated circuit.

Mixed poly pitch design solution for power trim

A semiconductor device or structure includes a first pattern metal layer disposed between a first supply metal tract and a second supply metal tract, the first pattern metal layer comprising an internal route and a power route. A follow pin couples the first supply metal to the power route. The first supply metal tract comprises a first metal and a follow pin comprises a second metal.

Metal patterning for internal cell routing

The present disclosure provides a semiconductor device. The semiconductor device includes: a first cell, a dielectric layer, and a snorkel structure. The first cell has an output terminal. The dielectric layer is disposed on the first cell. The snorkel structure is disposed in the dielectric layer. The snorkel structure includes a first conductive structure, a first conductive layer, and a second conductive structure. The first conductive layer is electrically connected to the output terminal of the cell. The first conductive layer is disposed on and electrically connected to the first conductive structure. The second conductive structure is disposed on and electrically connected to the first conductive layer. The second conductive structure has a topmost conductive layer buried in the dielectric layer.

Semiconductor device and method of failure analysis for semiconductor device

Various memory cell structures and power routings for one or more cells in an integrated circuit are disclosed. In one embodiment, different metal layers are used for power stripes that are operable to connect to voltage sources to supply different voltage signals, which allows some or all of the power stripes to have a larger width. Additionally or alternatively, fewer metal stripes are used for signals in a metal layer to allow the power stripe in that metal layer to have a larger width. The larger width(s) in turn increases the total area of the power stripe(s) to reduce the IR drop across the power stripe. The various power routings include connecting metal pillars in one metal layer to a power stripe in another metal layer, and extending a metal stripe in one metal layer to provide additional connections to a power stripe in another metal layer.

Cell structures and power routing for integrated circuits

A semiconductor structure is provided and includes a first gate structure, a second gate structure, and at least one local interconnect that extend continuously across a non-active region from a first active region to a second active region. The semiconductor structure further includes a first separation spacer disposed on the first gate structure and first vias on the first gate structure. The first vias are arranged on opposite sides of the first separation spacer are isolated from each other and apart from the first separation spacer by different distances.

Semiconductor device including source/drain contact having height below gate stack

An integrated circuit includes a first power rail, a first signal line, a first transistor and a second transistor. The first power rail is on a back-side of a substrate and is configured to supply a first supply voltage. The first signal line is on the back-side of the substrate and is separated from the first power rail. The first transistor has a first active region is in a front-side of the substrate. The first active region is overlapped by the first power rail and is electrically coupled to the first power rail. The second transistor has a second active region that is in the front-side of the substrate. The second active region is separated from the first active region, is overlapped by the first signal line, and is configured to receive the first supply voltage of the first power rail through the first active region of the first transistor.

Integrated circuit, system and method of forming the same

Apparatus and methods for back side routing a data signal in a semiconductor device are described. In one example, a described semiconductor cell structure includes: a dummy device region at a front side of the semiconductor cell structure; a metal layer including a plurality of metal lines at a back side of the semiconductor cell structure; a dielectric layer formed between the dummy device region and the metal layer; an inner metal disposed within the dielectric layer; at least one first via that is formed through the dielectric layer and electrically connects the inner metal to the plurality of metal lines at the back side; and at least one second via that is formed in the dielectric layer and physically coupled between the inner metal and the dummy device region at the front side.

Back side signal routing in a circuit with a relay cell

A method is provided, including following operations: identifying a first contact via, a second contact via, or a combination thereof in a first standard cell, wherein the first contact via is coupled between a first active region and a first conductive line on a first side, and the second contact via is coupled between a second active region and a second conductive line on a second side; calculating a first cell height according to a first width of the first and second active regions, and calculating a second cell height according to a second width of the first and second active regions; calculating multiple first available cell heights based on a ratio between the first and second cell heights; generating layout designs of multiple first cells; and manufacturing at least first one element in the integrated circuit based on the layout designs of the first cells.

Integrated circuit device and manufacturing method of the same

A method includes fabricating a first-voltage underlayer power rail conductively connecting to the source region of a first-type transistor and fabricating a second-voltage underlayer power rail conductively connecting to the source region of a second-type transistor. Each of the first-voltage and second-voltage underlayer power rails extends in a first direction. The method also includes patterning a first connection layer to form a first-voltage power rail and a second-voltage power rail extending in the second direction which is perpendicular to the first direction. The first-voltage power rail is directly connected with the first-voltage underlayer power rail through a first via-connector and the second-voltage power rail is directly connected with the second-voltage underlayer power rail through a second via-connector.

Power rail and signal conducting line arrangement

An integrated circuit includes a first conductive structure including a root portion of the first conductive structure, tine portions that are arranged in a first semiconductor layer, a neck portion surrounded by a film structure. The integrated circuit further includes a second conductive structure having first and second portions that are stacked along a first direction. The first portion of the second conductive structure is surrounded by the film structure and the second portion of the second conductive structure is in the first semiconductor layer. A third conductive structure in the integrated circuit has horizontal and vertical structures. The horizontal structure extends in a second semiconductor layer and the vertical structure passes through the second semiconductor layer and the film structure to contact a first conductive rail. The first conductive rail and the tine portions are apart from the horizontal structure along the first direction by a same distance.

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Hsinchu, Taiwan

Shih-Wei Peng