Taiwan Semiconductor Manufacturing Comp. Ltd.

Aewin Technologies Co., Ltd.

Shih-Tsung Chen

Li-Shi Liu

Chien-Yu Wang

Jiun-Rong Pai

Chien-Liang Chen

Yeh-Chieh Wang

Yung-yao Lee

Wei-Da Chen

Cheng-En Liu

Chun-Han Chen

Tsung-Cheng Ho

Yu-Ning Cheng

Yen-Shih Wang

Kai-Hsiang Tseng

Jui-Chung Lai

Yi-Tsang Hsiao

Hao-Yang Huang

A switching board and a soldering method thereof are provided. The switching board includes a circuit board having a board body and a first metal ring, where the board body has a first surface, and the first metal ring is formed on the first surface and surrounds a periphery of the board body. The switching board further includes a first metal element disposed on the first surface and fastened to the first metal ring by soldering. The switching board has a high pressure resistance and a low leakage rate.

Switching board and soldering method thereof

A cantilever for gas flow direction control configured to support an electrode housing bowl in an associated etch process chamber. The cantilever may have a cross-section that is circular, elliptical, or airfoil shaped. The shape of the cantilever induces the flow of gas and etch products within the chamber around the cantilever, reducing turbulence around the edge of a wafer.

Cantilever with etch chamber flow design

A grounding cap module includes a main body, a frame portion, and a cap portion. The main body includes a first opening penetrating the main body and a grounding portion disposed on a periphery of the main body and configured to be electrically grounded. The frame portion is disposed on the main body and includes a second opening aligned with the first opening. The cap portion is disposed on the frame portion and covers the second opening, wherein the first opening, the second opening and the cap portion define a receiving cavity. A gas injection device and an etching apparatus using the same are also provided.

Grounding cap module and gas injection device

Methods for preparing a void-free protective coating are disclosed herein. The void-free protective coating is used on a dielectric window having a central hole, which is used in a plasma treatment tool. A first protective coating layer is applied to the window, leaving an uncoated annular retreat area around the central hole. The first protective coating layer is polished to produce a flat surface and fill in any voids on the window. A second protective coating layer is then applied upon the flat surface of the first protective coating layer to obtain the void-free coating. This increases process uptime and service lifetime of the dielectric window and the plasma treatment tool.

Methods for preparing void-free coatings for plasma treatment components

Grounding cap module, gas injection device and etching apparatus

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Taipei, Taiwan

Shih-Tsung Chen