Industrial Technology Research Institute

Shih Ting Lin

Yu Wen Hsu

Chao Ta Huang

Yao Wun Jhang

Jen Yi Chen

Chien Ming Huang

Hsin Chia Su

Hong Xi Tsau

Chieh Hu

A method for manufacturing a MEMS device includes the following operations. An SOI wafer including a device layer, an insulating layer and a handle layer is provided. The device layer is etched to form a recess and an annular protrusion surrounding the recess. A moving part and a spring of the MEMS device are formed on the recess by etching the device layer, the insulating layer and the handle layer. An anchor of the MEMS device is formed at the annular protrusion by etching the device layer, the insulating layer and the handle layer. The moving part and the anchor are connected to each other by the spring. The insulating layer is disposed between a first conductive portion and a second conductive portion of the moving part. The insulating layer is disposed between a first conductive portion and a second conductive portion of the anchor.

Manufacturing methods for micro-electromechanical system device having electrical insulating structure

One embodiment discloses an apparatus integrating a microelectromechanical system device with a circuit chip which includes a circuit chip, a microelectromechanical system device, a sealing ring, and a lid. The circuit chip comprises a substrate and a plurality of metal bonding areas. The substrate has an active surface with electrical circuit area, and the metal bonding areas are disposed on the active surface and electrically connected to the electrical circuits. The microelectromechanical system device comprises a plurality of bases and at least one sensing element. The bases are connected to at least one of the metal bonding areas. The at least one sensing element is elastically connected to the bases. The sealing ring surrounds the bases, and is connected to at least one of the metal bonding areas. The lid is opposite to the active surface of the circuit chip, and is connected to the sealing ring to have a hermetic chamber which seals the sensing element and the active surface of the circuit chip.

Apparatus integrating microelectromechanical system device with circuit chip and methods for fabricating the same

A polarization modulation device for wideband laser comprises a first polarization maintaining optical fiber, a second polarization maintaining optical fiber, and a non-polarization maintaining optical fiber. The non-polarization maintaining optical fiber includes a first polarization controller coupled with the first polarization maintaining optical fiber, and a second polarization controller coupled with the second polarization maintaining optical fiber.

Polarization modulation device and laser system for wideband laser

One embodiment discloses an apparatus integrating a microelectromechanical system device with a circuit chip which comprises a circuit chip, a microelectromechanical system device, a sealing ring, and a lid. The circuit chip comprises a substrate and a plurality of metal bonding areas. The substrate has an active surface with electrical circuit area, and the metal bonding areas are disposed on the active surface and electrically connected to the electrical circuits. The microelectromechanical system device comprises a plurality of bases and at least one sensing element. The bases are connected to at least one of the metal bonding areas. The at least one sensing element is elastically connected to the bases. The sealing ring surrounds the bases, and is connected to at least one of the metal bonding areas. The lid is opposite to the active surface of the circuit chip, and is connected to the sealing ring to have a hermetic chamber which seals the sensing element and the active surface of the circuit chip.

An ultrafast laser generating system comprises a laser signal generator, a laser signal amplifier and a beam splitting element. The laser signal generator is configured to generate a first nanosecond pulse laser. The laser amplifier is configured to amplify the first nanosecond pulse laser from the laser signal generator so as to generate a second nanosecond pulse laser, which includes a picosecond pulse laser. The beam splitting element is configured to receive the second nanosecond pulse laser and split the picosecond pulse laser from the second nanosecond pulse laser.

Ultrafast laser generating system and method thereof

The disclosure relates to a micro-electromechanical system (MEMS) device having an electrical insulating structure. The MEMS device includes at least one moving part, at least one anchor, at least one spring and an insulating layer. The spring is connected to the anchor and to the moving part. The insulating layer is disposed in the moving part and the anchor. Each of the moving part and the anchor is divided into two conductive portions by the insulating layer. Whereby, the electrical signals of different moving parts are transmitted through the insulated electrical paths which are not electrically connected.

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Hualien, Taiwan

Shih Ting Lin