Au Optronics Corporation

Shih-Ping Chou

Chun-Yu Lee

Chien-Liang Chen

Wen-Hung Lai

Hui-Chang Chen

Wei-Chung Chuang

Yung-Lung Hsuao

Ying-Hung Tsai

Ching-Yu Huang

A misalignment detection device comprising a first substrate, at least one integrated circuit, a second substrate, a third substrate, and at least one detection unit. The at least one integrated is disposed on the first substrate in a first pressing region. The third substrate is disposed on the first substrate in a second pressing region and on the second substrate on the second substrate in a third pressing region. The at least one detection unit outputs a fault signal in response to a positioning shift occurring in at least one of the first, second, and third pressing regions.

Misalignment detection devices

A misalignment detection device comprising a substrate, at least one integrated circuit (IC), and at least one detection unit is disclosed. The substrate comprises a first positioning pad and a second positioning pad adjacent to the first positioning pad. The integrated circuit is disposed on the substrate and comprises a first positioning bump and a second positioning bump adjacent to the first positioning bump. The first and second positioning bumps substantially correspond to the first and second positioning pads, respectively. The at least one detection unit is electrically coupled to the substrate, wherein the detection unit outputs a fault signal in response to a positioning shift occurring between the first and second positioning pads and the first and second positioning bumps.

A flexible printed circuit and a display module comprising the flexible printed circuit are disclosed. The display module comprises a display panel, a printed circuit board, and a flexible printed circuit. The flexible printed circuit electrically connects the display panel and the printed circuit board, and further comprises a flexible substrate and a cover lay. The flexible substrate has an upper surface and two opposite end portions. The cover lay is disposed on the upper surface of the flexible substrate and extends along a lengthwise direction of the flexible substrate. The cover lay further has two opposite sides each also extending along the lengthwise direction of the flexible substrate. Each of the sides has at least a partially continuous contour which is formed with a discontinuous status on at least one of the end portions.

Flexible printed circuit and display module comprising the same

A lamp detection driving system is disclosed for performing adaptive lamp driving and related detection operations based on a recipe. The system includes a micro-controller, a driver, a defect detection module and a feedback circuit. The micro-controller provides a modulation signal and a plurality of reference signals based on the recipe. The driver generates at least one driving signal for driving at least one lamp based on the modulation signal. The feedback circuit generates a plurality of feedback signals based on lamp currents or lamp voltages. The defect detection module generates a plurality of detection signals based on the reference signals and the feedback signals. Furthermore, disclosed is a lamp detection driving method including downloading the recipe, generating at least one driving signal for driving at least one lamp based on the recipe, and providing at least one reference signal for performing defect detection processes based on the recipe.

Lamp detection driving system and related detection driving method

This invention provides a circuit bonding detection device, a detection method thereof and an electro-optical apparatus incorporating the circuit bonding detection device. The circuit bonding detection device includes a substrate, a circuit module, a set of sensors, and a detection unit. A plurality of contact pads is disposed on the substrate. The circuit module includes a plurality of conductive bumps corresponding to the contact pads. The sensors are disposed on two sides of at least one of contact pads or of the corresponding conductive bumps. The detection unit is electrically coupled with the set of sensors and transmits a fault signal when at least one of the contact pads and the corresponding conductive bumps deforms and contacts the sensors.

Electro-optical apparatus and a circuit bonding detection device and detection method thereof

A thin film transistor (TFT) substrate includes a glass substrate, a thin film transistor, an electrode pad, and a conductive bump. The TFT and the electrode pad are formed on the glass substrate, and the electrode pad is used for electrically connecting with the thin film transistor. The conductive bump includes several insulating bumps and a conductive layer. The insulating bumps are formed on the electrode pad dividedly, and the conductive layer covers the top surfaces of the insulating bumps, the inward surfaces of the insulating bumps, and the electrode pad between the insulating bumps for electrically connecting with the electrode pad. The outward side surfaces of the insulating bumps are exposed out of the conductive layer.

Growing community of inventors

Taoyuan County, Taiwan

Shih-Ping Chou