Lite-on It Corporation

IV Technologies Co., Ltd.

Shih-Ming Yu

Ko-Wen Chen

A polishing pad is provided. The polishing pad includes a polishing layer, which includes a central region, a peripheral region, and a main polishing region located between the central region and the peripheral region. At least one annular groove is located in the main polishing region of the polishing layer. A peripheral groove is located in the peripheral region, and the peripheral groove includes grid-shaped grooves. At least one radial extending groove is located in the main polishing region of the polishing layer, and the at least one radial extending groove is connected with the at least one annular groove. A polishing system including the polishing pad and a polishing method using the polishing pad are provided.

Polishing pad, polishing system and polishing method

A housing adapted for use in an electronic device is provided. The housing includes a first member, a second member, and a fastener. The first member has a first fastening hole and a weakening structure disposed around the first fastening hole. The second member has a second fastening hole. The fastener passes through the first fastening hole and the second fastening hole to fix the first member and the second member to each other.

Growing community of inventors

Taipei, Taiwan

Shih-Ming Yu