Industrial Technology Research Institute

Taiwan Semiconductor Manufacturing Comp. Ltd.

Vanguard International Semiconductor Corporation

Mediatek Corporation

National Central University

Shi Xiang Industrial Co., Ltd.

Other

Intellectual Property Innovation Corporation

Shih-Ming Chen

Hsiao-Ying Yang

Young-Jen Lee

Chih-Yuan Hsu

Chih-Ping Lin

Chi-Ming Lee

Pi-Kuang Chuang

Li-Ching Wang

Hung-Li Chang

Yeng-Fong Shih

Ching-Tien Su

Wun-Cyuan Jhang

Chih-Kuang Chen

Anthony Shiaw-Tseh Chiang

Chih-Kang Peng

Kuo-Chiang Ting

Tzong-Ming Lee

Hsiu-Mei Yu

Kuo-Wei Lin

Yu-Ying Tsai

Jen-Shiang Leu

Wei-Hao Lai

Ya-Sheng Liu

Jia-Chi Huang

Cheng-Yi Lin

Hao-Yi Tsai

Shang-Yun Hou

Tsang-Yu Liu

Yu-Cheng Chen

Chyi-Ming Leu

Yung-Hui Yeh

Yu-Lung Huang

Yu-Lin Yen

Hsi-Chien Lin

Tjandra Winata Karta

Chein-Chung Sun

Sheng-Fa Yeh

Chia-Jen Cheng

Deng-Tswen Shieh

Jui-Chang Chuang

Jih-Hsiang Yeh

Yu-Tsung Chiu

Tsung H Wang

Po-Sheng Hu

Jia-You Chuang

Jong-Min Liu

Sung-Cheng Chiu

Han-Chang Hsieh

Yu-Yuan Kuo

Cheng-Yueh Chang

Kun-Tsung Lu

Jia-Chih Huang

Wen-Hsien Liu

Shiow Huey Jang Suen

Daniel Yang

Cheng-Hsien Lai

Yan-Fong Shih

A method of forming a semiconductor device includes forming a plurality of metal pads over a semiconductor substrate of a wafer, forming a passivation layer covering the plurality of metal pads, patterning the passivation layer to reveal the plurality of metal pads, forming a first polymer layer over the passivation layer, forming a plurality of redistribution lines extending into the first polymer layer and the passivation layer to connect to the plurality of metal pads, forming a second polymer layer over the first polymer layer, and patterning the second polymer layer to reveal the plurality of redistribution lines. The first polymer layer is further revealed through openings in remaining portions of the second polymer layer.

Semiconductor structure having dielectric plugs penetrating through a polymer layer

A resin composition is provided, which includes a first polymer and a second polymer. The first polymer is formed by a reaction of an epoxy resin modified with a first elastic molecular segment and an epoxy resin curing agent. The second polymer is formed by a polymerization of an acrylate modified with a second elastic molecular segment.

Encapsulation structure

A semiconductor device includes a semiconductor substrate, an interconnection layer and an inductor pattern. The interconnection layer is disposed on the semiconductor substrate. The inductor pattern is electrically connected to the interconnection layer. The inductor pattern includes a first conductive line joined with a first terminal, a second conductive line joined with a second terminal, and a plurality of conductive coils. The conductive coils are joining the first conductive line to the second conductive line, and includes an outer coil joined with the first conductive line, an inner coil joined with the second conductive line and the outer coil. The second conductive line is spaced apart from a first side of the inner coil in a first direction by distance Y, the second terminal is spaced apart from a second side of the inner coil in a second direction by distance X1, wherein X1>1.25Y.

Semiconductor device and method of fabricating the same

Method for manufacturing a semiconductor device including patterning a polymer layer to reduce stress

A fiber spreading apparatus which is configured to spread a carbon fiber bundle, and includes a feeding roll, a winding roll, a vibrating roller, and a first nozzle. The vibrating roller is disposed between the feeding roll and the winding roll, and is in contact with the carbon fiber bundle. The vibrating roller is rotated according to an axis of rotation, and is vibrated along a vibrating direction perpendicular to the axis of rotation. The first nozzle is disposed between the vibrating roller and the winding roll, and blows the carbon fiber bundle.

Fiber spreading apparatus

A fireproof battery module including a plurality of battery cells and at least one fireproof layer. The battery cells are electrically connected to one another. The at least one fireproof layer is located between two of the plurality of battery cells that are adjacent to each other. The fireproof layer includes a heat absorbing part and a heat insulation part that are connected to each other. The heat absorbing part includes a vaporizable material and a thermal conductivity of the heat insulation part is lower than a thermal conductivity of the heat absorbing part.

Fireproof battery module and fireproof layer

Patterning polymer layer to reduce stress

Provided is a protective structure including an auxiliary layer and a hard coating layer. The auxiliary layer has a first surface and a second surface opposite to the first surface. The hard coating layer is located on the second surface of the auxiliary layer. The Young's modulus of the auxiliary layer is gradually increased from the second surface to the first surface. An electronic device with the same is also provided.

Protective structure and electronic device with the same

A charging method, a charging system and an electronic device are provided. The charging method includes the following steps: An inputting current limit is set. An inputting current of at least one charger is measured. A power source voltage of a power source is adjusted until a current difference between the inputting current and the inputting current limit is within a predetermined range.

Charging method, charging system and electronic device

The invention provides a method for improving temperature management of a battery pack. The battery pack may comprise a battery cell charged via at least one supply trace of a PCB (printed circuit board), a protection circuit module mounted on the PCB and coupled to the at least one supply trace, and a plurality of temperature sensors respectively reflecting a temperature of the battery cell and a temperature of the PCB. The method may comprise: measuring a cell temperature and a PCB temperature by the temperature sensors; when charging the battery cell by a charging current and a charging voltage, controlling the charging voltage and the charging current according to the cell temperature, and adjusting the charging current further according to the PCB temperature, so as to constrain the temperature of the PCB.

Method for improving temperature management of battery pack

A three-dimensional structure includes a plate and a three-dimensional component disposed on the plate. The three-dimensional component contains at least one first structure and at least one second structure. The first structure is an auxetic structure, and the second structure is different from the first structure. The at least one first structure and the at least one second structure are provided layer by layer along a thickness direction of the plate on the plate.

Three-dimensional structure

An electronic device includes: a connector, arranged for coupling to a power supply external to the electronic device, wherein the power supply is arranged to provide a supply voltage to the electronic device to charge a battery of the electronic device; and a charger, coupled to the connector and selectively operated in a normal mode or a self-test mode, wherein when the charger operates in the normal mode, the charger is arranged for receiving the supply voltage via a power pin of the connector to charge the battery of the electronic device; and when the charger operates in the self-test mode, the charger provides a specific voltage to the power pin of the connector. The charger includes a detector to detect the current or voltage of at least one pin of the connector to generate a detecting result, and the supply voltage is set based on the detecting result.

Electronic device, charger within the electronic device, and detecting method for detecting abnormal status of connector of electronic device

According to at least one aspect, a device is provided. The device comprises: a connector configured to electrically couple to an external device and comprising a plurality of terminals including a supply terminal; a monitoring circuit coupled to the supply terminal and configured to apply an electrical signal to the supply terminal and measure at least one of a voltage level and a current level on the supply terminal; a controller communicatively coupled to the monitoring circuit and configured to: determine whether an impedance between the supply terminal and at least one other terminal in the plurality of terminals is above a threshold using the at least one of the voltage level and the current level on the supply terminal; and output at least one message responsive to the impedance being below the threshold.

Systems and methods for monitoring an operating status of a connector

A composition consisting of BSG and PLA is produced by the following steps: processing brewer's spent grains; mixing the BSG with the PLA at a specific proportion; the BSG and the PLA are well mixed by a binder and then subjected to a granulation process to form plastic granules. Adding BSG to the PLA can reduce the use of PLA. Furthermore, the composition consisting of BSG and PLA and the method for making the same are further utilized to make utensils, bottles, cans, containers, parts and other biological plastic products to achieve the purpose of adding value to the BSG.

Composition consisting of brewer's spent grains and polylactic acid

Growing community of inventors

Hsinchu, Taiwan

Shih-Ming Chen